{"id":"https://openalex.org/W4394966889","doi":"https://doi.org/10.1109/access.2024.3391336","title":"Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process","display_name":"Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4394966889","doi":"https://doi.org/10.1109/access.2024.3391336"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3391336","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3391336","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10505246.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10505246.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5067162800","display_name":"Yaofeng Yi","orcid":"https://orcid.org/0009-0007-4059-6952"},"institutions":[{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yaofeng Yi","raw_affiliation_strings":["Department of Electronic and Physical Systems, Graduate School of Fundamental Science and Engineering, Waseda University, Tokyo, Japan"],"raw_orcid":"https://orcid.org/0009-0007-4059-6952","affiliations":[{"raw_affiliation_string":"Department of Electronic and Physical Systems, Graduate School of Fundamental Science and Engineering, Waseda University, Tokyo, Japan","institution_ids":["https://openalex.org/I150744194"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062571816","display_name":"Toshimasa Umezawa","orcid":"https://orcid.org/0000-0002-9768-3981"},"institutions":[{"id":"https://openalex.org/I90023481","display_name":"National Institute of Information and Communications Technology","ror":"https://ror.org/016bgq349","country_code":"JP","type":"facility","lineage":["https://openalex.org/I90023481"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Toshimasa Umezawa","raw_affiliation_strings":["National Institute of Information and Communications Technology (NICT), Koganei, Tokyo, Japan","National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan"],"raw_orcid":"https://orcid.org/0000-0002-9768-3981","affiliations":[{"raw_affiliation_string":"National Institute of Information and Communications Technology (NICT), Koganei, Tokyo, Japan","institution_ids":["https://openalex.org/I90023481"]},{"raw_affiliation_string":"National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan","institution_ids":["https://openalex.org/I90023481"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081746680","display_name":"Kouichi Akahane","orcid":"https://orcid.org/0000-0002-8919-1717"},"institutions":[{"id":"https://openalex.org/I90023481","display_name":"National Institute of Information and Communications Technology","ror":"https://ror.org/016bgq349","country_code":"JP","type":"facility","lineage":["https://openalex.org/I90023481"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kouichi Akahane","raw_affiliation_strings":["National Institute of Information and Communications Technology (NICT), Koganei, Tokyo, Japan","National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan"],"raw_orcid":"https://orcid.org/0000-0002-8919-1717","affiliations":[{"raw_affiliation_string":"National Institute of Information and Communications Technology (NICT), Koganei, Tokyo, Japan","institution_ids":["https://openalex.org/I90023481"]},{"raw_affiliation_string":"National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan","institution_ids":["https://openalex.org/I90023481"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5069072922","display_name":"Tetsuya Kawanishi","orcid":"https://orcid.org/0000-0001-9724-8878"},"institutions":[{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]},{"id":"https://openalex.org/I90023481","display_name":"National Institute of Information and Communications Technology","ror":"https://ror.org/016bgq349","country_code":"JP","type":"facility","lineage":["https://openalex.org/I90023481"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsuya Kawanishi","raw_affiliation_strings":["Department of Electronic and Physical Systems, Graduate School of Fundamental Science and Engineering, Waseda University, Tokyo, Japan","National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan"],"raw_orcid":"https://orcid.org/0000-0001-9724-8878","affiliations":[{"raw_affiliation_string":"Department of Electronic and Physical Systems, Graduate School of Fundamental Science and Engineering, Waseda University, Tokyo, Japan","institution_ids":["https://openalex.org/I150744194"]},{"raw_affiliation_string":"National Institute of Information and Communications Technology (NICT) 4-2-1, Nukui-Kitamachi, Koganei, Tokyo, Japan","institution_ids":["https://openalex.org/I90023481"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.1856,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":{"value":0.45654974,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"12","issue":null,"first_page":"56414","last_page":"56421"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10767","display_name":"Advanced Photonic Communication Systems","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/photocurrent","display_name":"Photocurrent","score":0.9699347615242004},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8416827917098999},{"id":"https://openalex.org/keywords/photodetector","display_name":"Photodetector","score":0.7636381983757019},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.7135793566703796},{"id":"https://openalex.org/keywords/saturation-current","display_name":"Saturation current","score":0.6004981398582458},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5436108112335205},{"id":"https://openalex.org/keywords/saturation","display_name":"Saturation (graph theory)","score":0.500575065612793},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.45083746314048767},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.44223302602767944},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.43551933765411377},{"id":"https://openalex.org/keywords/junction-temperature","display_name":"Junction temperature","score":0.4121537208557129},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.09937694668769836},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09897914528846741},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09475061297416687},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09312978386878967},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07151007652282715},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.07130366563796997}],"concepts":[{"id":"https://openalex.org/C2779845233","wikidata":"https://www.wikidata.org/wiki/Q3381567","display_name":"Photocurrent","level":2,"score":0.9699347615242004},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8416827917098999},{"id":"https://openalex.org/C23125352","wikidata":"https://www.wikidata.org/wiki/Q210765","display_name":"Photodetector","level":2,"score":0.7636381983757019},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.7135793566703796},{"id":"https://openalex.org/C155891486","wikidata":"https://www.wikidata.org/wiki/Q3694418","display_name":"Saturation current","level":3,"score":0.6004981398582458},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5436108112335205},{"id":"https://openalex.org/C9930424","wikidata":"https://www.wikidata.org/wiki/Q7426587","display_name":"Saturation (graph theory)","level":2,"score":0.500575065612793},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.45083746314048767},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.44223302602767944},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.43551933765411377},{"id":"https://openalex.org/C167781694","wikidata":"https://www.wikidata.org/wiki/Q6311800","display_name":"Junction temperature","level":3,"score":0.4121537208557129},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.09937694668769836},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09897914528846741},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09475061297416687},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09312978386878967},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07151007652282715},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07130366563796997},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3391336","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3391336","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10505246.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:4517d33883504aa293c974c352af74b0","is_oa":true,"landing_page_url":"https://doaj.org/article/4517d33883504aa293c974c352af74b0","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 12, Pp 56414-56421 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3391336","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2024.3391336","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10505246.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3723536152","display_name":null,"funder_award_id":"JPJ000254","funder_id":"https://openalex.org/F4320325628","funder_display_name":"Ministry of Internal Affairs and Communications"},{"id":"https://openalex.org/G522832653","display_name":null,"funder_award_id":"22H05196","funder_id":"https://openalex.org/F4320334764","funder_display_name":"Japan Society for the Promotion of Science"},{"id":"https://openalex.org/G8924630776","display_name":"\u30de\u30eb\u30c1\u30d5\u30a3\u30b8\u30c3\u30af\u30b9ICT\u30b7\u30b9\u30c6\u30e0\u30c7\u30b6\u30a4\u30f3","funder_award_id":"JPMJAP2324","funder_id":"https://openalex.org/F4320334789","funder_display_name":"Japan Science and Technology Agency"}],"funders":[{"id":"https://openalex.org/F4320325628","display_name":"Ministry of Internal Affairs and Communications","ror":"https://ror.org/00vs1pz50"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"},{"id":"https://openalex.org/F4320334789","display_name":"Japan Science and Technology Agency","ror":"https://ror.org/00097mb19"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4394966889.pdf","grobid_xml":"https://content.openalex.org/works/W4394966889.grobid-xml"},"referenced_works_count":35,"referenced_works":["https://openalex.org/W1986782717","https://openalex.org/W1992963377","https://openalex.org/W2001105193","https://openalex.org/W2008470287","https://openalex.org/W2013177154","https://openalex.org/W2066797376","https://openalex.org/W2091625845","https://openalex.org/W2118411166","https://openalex.org/W2124751814","https://openalex.org/W2127164582","https://openalex.org/W2131401397","https://openalex.org/W2133559443","https://openalex.org/W2138262942","https://openalex.org/W2151859756","https://openalex.org/W2153737283","https://openalex.org/W2156611964","https://openalex.org/W2166418095","https://openalex.org/W2183166780","https://openalex.org/W2320051031","https://openalex.org/W2572280179","https://openalex.org/W2600570349","https://openalex.org/W2745200956","https://openalex.org/W2753285534","https://openalex.org/W2900586736","https://openalex.org/W3062497058","https://openalex.org/W3089242068","https://openalex.org/W3091947986","https://openalex.org/W3128346160","https://openalex.org/W3138010649","https://openalex.org/W4200572623","https://openalex.org/W4243826237","https://openalex.org/W4250897953","https://openalex.org/W4293214336","https://openalex.org/W6787905415","https://openalex.org/W6811281813"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W4232272518","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2508449101","https://openalex.org/W2004912356","https://openalex.org/W2103854567","https://openalex.org/W2042575274"],"abstract_inverted_index":{"We":[0,42],"reported":[1],"a":[2,6,10,44],"thermal":[3,23,38,100,139],"investigation":[4],"on":[5,21],"photodetector":[7],"(PD)":[8],"with":[9,59,152],"sandwiched":[11],"structure":[12],"comprising":[13],"p-type,":[14],"intrinsic,":[15],"and":[16,26,37,51,68,161,170,180],"n-type":[17],"(PIN-PD)":[18],"layers":[19],"based":[20],"Williams\u2019":[22],"model.":[24],"Simulations":[25],"measurements":[27],"of":[28,57,92,122,134,155,183,189],"the":[29,32,48,87,103,108,115,123,138,143,153,159,177,192],"photocurrent":[30,50,56,144,164,182],"in":[31],"linear":[33,55,160],"region,":[34],"3-dB":[35],"bandwidth":[36],"analyses":[39,101],"were":[40,165],"conducted.":[41],"found":[43],"good":[45],"agreement":[46],"between":[47],"measured":[49,54,110],"simulations.":[52],"The":[53],"PIN-PD":[58,135],"<inline-formula":[60,69],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[61,70],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[62,71],"<tex-math":[63,72],"notation=\"LaTeX\">$50~\\mu":[64],"\\text{m}$":[65,74],"</tex-math></inline-formula>":[66,75],"substrate":[67],"notation=\"LaTeX\">$0.4~\\mu":[73],"absorber":[76],"was":[77,84,145],"28":[78],"mA":[79,147,169,185],"at":[80,95,148],"-2":[81,149],"V,":[82],"which":[83],"related":[85],"to":[86,107,167],"expected":[88,162],"RF":[89],"output":[90],"power":[91],"+13":[93],"dBm":[94],"50":[96],"GHz.":[97],"In":[98],"addition,":[99],"evaluated":[102],"junction":[104,119],"temperature":[105,121,179],"corresponding":[106],"specific":[109],"photocurrent,":[111],"as":[112,114,191],"well":[113],"431":[116],"K":[117],"for":[118],"breakdown":[120,140],"fabricated":[124],"PD":[125,178],"samples.":[126],"This":[127],"evaluation":[128],"further":[129],"predicted":[130,176],"that":[131],"this":[132],"type":[133],"would":[136],"reach":[137],"point":[141],"when":[142],"34":[146],"V.":[150],"Furthermore,":[151],"application":[154],"AlN":[156,187],"flip-chip":[157],"bonding,":[158],"maximum":[163,181],"improved":[166],"30":[168],"45":[171],"mA,":[172],"respectively.":[173],"Finally,":[174],"we":[175],"55":[184],"using":[186],"instead":[188],"InP":[190],"main":[193],"substrate.":[194]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}