{"id":"https://openalex.org/W4392796854","doi":"https://doi.org/10.1109/access.2024.3375367","title":"Multi-Stage Process Diagnosis Networks in Semiconductor Manufacturing","display_name":"Multi-Stage Process Diagnosis Networks in Semiconductor Manufacturing","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4392796854","doi":"https://doi.org/10.1109/access.2024.3375367"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3375367","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3375367","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/10380310/10464314.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/10380310/10464314.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103150338","display_name":"Jongwon Choi","orcid":"https://orcid.org/0009-0000-4434-4858"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jongwon Choi","raw_affiliation_strings":["School of Industrial and Management Engineering, Korea University, Seoul, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Industrial and Management Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058258354","display_name":"Seoung Bum Kim","orcid":"https://orcid.org/0000-0002-2205-8516"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seoung Bum Kim","raw_affiliation_strings":["School of Industrial and Management Engineering, Korea University, Seoul, South Korea"],"raw_orcid":"https://orcid.org/0000-0002-2205-8516","affiliations":[{"raw_affiliation_string":"School of Industrial and Management Engineering, Korea University, Seoul, South Korea","institution_ids":["https://openalex.org/I197347611"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I197347611"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.6886,"has_fulltext":true,"cited_by_count":6,"citation_normalized_percentile":{"value":0.84591627,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"12","issue":null,"first_page":"39495","last_page":"39504"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11689","display_name":"Adversarial Robustness in Machine Learning","score":0.977400004863739,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11512","display_name":"Anomaly Detection Techniques and Applications","score":0.9729999899864197,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.8515742421150208},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6555720567703247},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6408347487449646},{"id":"https://openalex.org/keywords/micronization","display_name":"Micronization","score":0.6353090405464172},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6141172051429749},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.514474630355835},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.5035731196403503},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.4676700830459595},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.4557393193244934},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4540969729423523},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.40842628479003906},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.35157039761543274},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2028655707836151},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.18547213077545166},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1288529634475708},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.1077965497970581}],"concepts":[{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.8515742421150208},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6555720567703247},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6408347487449646},{"id":"https://openalex.org/C86178769","wikidata":"https://www.wikidata.org/wiki/Q1130789","display_name":"Micronization","level":3,"score":0.6353090405464172},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6141172051429749},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.514474630355835},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.5035731196403503},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.4676700830459595},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.4557393193244934},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4540969729423523},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.40842628479003906},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.35157039761543274},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2028655707836151},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.18547213077545166},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1288529634475708},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.1077965497970581},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C187530423","wikidata":"https://www.wikidata.org/wiki/Q7140503","display_name":"Particle size","level":2,"score":0.0},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3375367","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3375367","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/10380310/10464314.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:129f01d118a24a28a7b90b4e40cb714b","is_oa":true,"landing_page_url":"https://doaj.org/article/129f01d118a24a28a7b90b4e40cb714b","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 12, Pp 39495-39504 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3375367","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3375367","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/10380310/10464314.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1698445836","display_name":null,"funder_award_id":"RS-2022-00144190","funder_id":"https://openalex.org/F4320328359","funder_display_name":"Ministry of Science and ICT, South Korea"},{"id":"https://openalex.org/G2959606156","display_name":null,"funder_award_id":"IITP-2020-0-01749","funder_id":"https://openalex.org/F4320328359","funder_display_name":"Ministry of Science and ICT, South Korea"},{"id":"https://openalex.org/G4557667495","display_name":null,"funder_award_id":"IITP-2020-0-01749","funder_id":"https://openalex.org/F4320324891","funder_display_name":"Iran Telecommunication Research Center"},{"id":"https://openalex.org/G4700831490","display_name":null,"funder_award_id":"2022-","funder_id":"https://openalex.org/F4320335489","funder_display_name":"Institute for Information and Communications Technology Promotion"},{"id":"https://openalex.org/G7845272108","display_name":null,"funder_award_id":"IITP-2020-0-01749","funder_id":"https://openalex.org/F4320335489","funder_display_name":"Institute for Information and Communications Technology Promotion"},{"id":"https://openalex.org/G8191624576","display_name":null,"funder_award_id":"RS-2022-00144190","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G961783548","display_name":null,"funder_award_id":"2020-0-01749","funder_id":"https://openalex.org/F4320335489","funder_display_name":"Institute for Information and Communications Technology Promotion"}],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320324891","display_name":"Iran Telecommunication Research Center","ror":"https://ror.org/01a3g2z22"},{"id":"https://openalex.org/F4320328359","display_name":"Ministry of Science and ICT, South Korea","ror":"https://ror.org/01wpjm123"},{"id":"https://openalex.org/F4320335489","display_name":"Institute for Information and Communications Technology Promotion","ror":"https://ror.org/01g0hqq23"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4392796854.pdf","grobid_xml":"https://content.openalex.org/works/W4392796854.grobid-xml"},"referenced_works_count":26,"referenced_works":["https://openalex.org/W1522301498","https://openalex.org/W2064675550","https://openalex.org/W2109553965","https://openalex.org/W2133564696","https://openalex.org/W2295598076","https://openalex.org/W2594332903","https://openalex.org/W2783323081","https://openalex.org/W2911964244","https://openalex.org/W2946530240","https://openalex.org/W2962862931","https://openalex.org/W2997583607","https://openalex.org/W2999615587","https://openalex.org/W3027221375","https://openalex.org/W3086583482","https://openalex.org/W3196018676","https://openalex.org/W3198381997","https://openalex.org/W3202584185","https://openalex.org/W4293149888","https://openalex.org/W4312675323","https://openalex.org/W4380142972","https://openalex.org/W4388666602","https://openalex.org/W4393789489","https://openalex.org/W6604828220","https://openalex.org/W6631190155","https://openalex.org/W6679434410","https://openalex.org/W6737947904"],"related_works":["https://openalex.org/W2170726572","https://openalex.org/W2146435486","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W2394172622","https://openalex.org/W1594978932","https://openalex.org/W2083418455","https://openalex.org/W2025046394","https://openalex.org/W2018048930"],"abstract_inverted_index":{"The":[0,113,141,201],"semiconductor":[1,75,170],"industry,":[2],"driven":[3],"by":[4],"technological":[5],"advancements,":[6],"is":[7,54,84,118,144,204],"continuously":[8],"undergoing":[9],"process":[10,24,53,167],"micronization.":[11],"This":[12],"micronization":[13],"has":[14],"led":[15],"to":[16,31,68,119,146,206],"an":[17],"increased":[18],"complexity":[19],"in":[20,34,87,127,169],"the":[21,38,50,60,63,98,101,104,107,111,121,149,156,162,182,185,191,198,209],"wafer":[22],"fabrication":[23],"and":[25,56,106,154,193,211],"equipment.":[26,91,112],"Inevitably,":[27],"this":[28,116,124],"change":[29],"leads":[30],"a":[32,78,129],"rise":[33],"defect":[35,51,150,216],"rates.":[36],"Furthermore,":[37],"traditional":[39],"manual":[40],"analysis":[41,52,71],"methods":[42],"for":[43,215],"these":[44,159],"defects":[45],"possess":[46],"several":[47],"limitations.":[48],"Notably,":[49],"time-consuming":[55],"heavily":[57],"relies":[58],"on":[59,97,213],"expertise":[61],"of":[62,81,103,110,115,123,152,158,184],"workers,":[64],"making":[65],"it":[66],"challenging":[67],"achieve":[69,173],"consistent":[70],"results.":[72,200],"In":[73],"modern":[74],"manufacturing":[76,139],"sites,":[77],"vast":[79],"amount":[80],"sensor":[82,93,125,163],"data":[83,94,126,164],"being":[85],"generated":[86,136],"real-time":[88],"from":[89,165],"various":[90],"These":[92],"contain":[95],"information":[96,135],"wafer\u2019s":[99],"condition,":[100],"progress":[102],"process,":[105],"operating":[108],"conditions":[109],"purpose":[114],"study":[117],"examine":[120],"use":[122],"creating":[128],"deep":[130],"learning":[131],"model":[132],"that":[133,195],"leverages":[134],"within":[137],"multi-stage":[138],"processes.":[140],"proposed":[142,202],"method":[143],"designed":[145],"automatically":[147],"classify":[148],"status":[151],"wafers":[153],"interpret":[155],"causes":[157],"defects.":[160],"Using":[161],"two":[166],"equipment":[168,194],"manufacturing,":[171],"we":[172,188],"better":[174],"classification":[175,186,199],"performance":[176],"than":[177],"other":[178],"existing":[179],"methods.":[180],"Through":[181],"interpretation":[183],"results,":[187],"can":[189],"identify":[190],"sensors":[192],"significantly":[196,207],"impact":[197],"methodology":[203],"expected":[205],"reduce":[208],"effort":[210],"reliance":[212],"engineers":[214],"analysis,":[217],"thus":[218],"greatly":[219],"improving":[220],"production":[221],"efficiency.":[222]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}