{"id":"https://openalex.org/W4391248742","doi":"https://doi.org/10.1109/access.2024.3359037","title":"Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review","display_name":"Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4391248742","doi":"https://doi.org/10.1109/access.2024.3359037"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3359037","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3359037","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10415105.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10415105.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100695871","display_name":"Junyong Park","orcid":"https://orcid.org/0000-0002-5446-1799"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Junyong Park","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0000-0002-5446-1799","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100454695","display_name":"DongHyun Kim","orcid":"https://orcid.org/0000-0003-2738-9549"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Donghyun Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0000-0003-2738-9549","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I20382870"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.1484,"has_fulltext":true,"cited_by_count":9,"citation_normalized_percentile":{"value":0.7494192,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":98},"biblio":{"volume":"12","issue":null,"first_page":"22880","last_page":"22891"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7584842443466187}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7584842443466187}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3359037","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3359037","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10415105.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:2bb035b66ffb456e9f0cc62140b2d36d","is_oa":true,"landing_page_url":"https://doaj.org/article/2bb035b66ffb456e9f0cc62140b2d36d","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 12, Pp 22880-22891 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3359037","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3359037","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10415105.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1265942123","display_name":"Phase III IUCRC at Missouri University of Science and Technology:  Center for Electromagnetic Compatibility","funder_award_id":"1916535","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G1510614258","display_name":null,"funder_award_id":"IIP-1916535","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4391248742.pdf","grobid_xml":"https://content.openalex.org/works/W4391248742.grobid-xml"},"referenced_works_count":75,"referenced_works":["https://openalex.org/W1480210121","https://openalex.org/W1492718429","https://openalex.org/W1511626689","https://openalex.org/W1512002052","https://openalex.org/W1548861598","https://openalex.org/W1550189289","https://openalex.org/W1593525474","https://openalex.org/W1597620877","https://openalex.org/W1969657124","https://openalex.org/W1969658701","https://openalex.org/W1991233943","https://openalex.org/W1995220828","https://openalex.org/W2019264127","https://openalex.org/W2025879008","https://openalex.org/W2035478412","https://openalex.org/W2041729444","https://openalex.org/W2047877856","https://openalex.org/W2054730679","https://openalex.org/W2056021806","https://openalex.org/W2061783548","https://openalex.org/W2077018692","https://openalex.org/W2083774980","https://openalex.org/W2095892633","https://openalex.org/W2097470318","https://openalex.org/W2099571807","https://openalex.org/W2103244535","https://openalex.org/W2111439418","https://openalex.org/W2112774177","https://openalex.org/W2117766083","https://openalex.org/W2117945740","https://openalex.org/W2118804941","https://openalex.org/W2128734703","https://openalex.org/W2129153627","https://openalex.org/W2130704241","https://openalex.org/W2130868223","https://openalex.org/W2132616434","https://openalex.org/W2133040214","https://openalex.org/W2133137966","https://openalex.org/W2144325070","https://openalex.org/W2148575324","https://openalex.org/W2151133729","https://openalex.org/W2151803937","https://openalex.org/W2153186550","https://openalex.org/W2156408736","https://openalex.org/W2166994153","https://openalex.org/W2171347752","https://openalex.org/W2185470114","https://openalex.org/W2221779175","https://openalex.org/W2320835389","https://openalex.org/W2523683877","https://openalex.org/W2543638875","https://openalex.org/W2560529905","https://openalex.org/W2744034227","https://openalex.org/W2767048941","https://openalex.org/W2769133487","https://openalex.org/W2810095688","https://openalex.org/W2810531015","https://openalex.org/W2901240903","https://openalex.org/W2902598753","https://openalex.org/W2921101359","https://openalex.org/W2987787321","https://openalex.org/W3009425635","https://openalex.org/W3023906650","https://openalex.org/W3171032819","https://openalex.org/W3195223147","https://openalex.org/W3217601129","https://openalex.org/W4234572373","https://openalex.org/W4252365207","https://openalex.org/W4300128852","https://openalex.org/W4312198597","https://openalex.org/W4312852161","https://openalex.org/W4388953079","https://openalex.org/W4389164456","https://openalex.org/W4389626908","https://openalex.org/W6630633693"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"An":[0],"eye":[1,32,55,91],"diagram,":[2],"a":[3,58,63],"critical":[4],"metric":[5],"in":[6],"signal":[7,37,125],"integrity":[8,38],"analysis":[9,39],"for":[10],"high-speed":[11,100,133],"interconnects":[12],"such":[13,76],"as":[14,77],"packages,":[15],"interposer,":[16],"and":[17,66,81,99,113,126,143],"printed":[18],"circuit":[19],"boards":[20],"(PCBs),":[21],"is":[22,34,40],"generated":[23],"by":[24],"superposition":[25],"of":[26,116],"the":[27,78,110,114,117],"received":[28],"waveform.":[29],"Obtaining":[30],"an":[31],"diagram":[33,56],"time-consuming,":[35],"thus":[36],"inefficient.":[41],"This":[42,84],"article":[43,85],"reviews":[44],"that":[45],"have":[46],"been":[47],"proposed":[48],"to":[49,73,94,105,122,132],"overcome":[50],"this":[51],"limitation.":[52],"The":[53,102,119,129],"statistical":[54,90],"provides":[57],"probability":[59],"distribution":[60],"depending":[61],"on":[62,89],"sampling":[64],"time":[65],"voltage,":[67],"therefore":[68],"it":[69],"can":[70],"be":[71],"expanded":[72],"other":[74],"metrics,":[75],"bit-error":[79],"rate":[80],"shmoo":[82],"plot.":[83],"introduces":[86],"previous":[87],"research":[88],"diagrams":[92],"applied":[93,104,121,131],"complementary":[95],"metal-oxide-semiconductors":[96],"(CMOSs),":[97],"noise,":[98],"systems.":[101],"methods":[103,120,130],"CMOSs":[106],"include":[107,124,135],"asymmetry":[108],"between":[109],"P/NMOS":[111],"transistors":[112],"nonlinearity":[115],"CMOS.":[118],"noise":[123],"power":[127],"noise.":[128],"systems":[134],"equalizers,":[136],"signaling,":[137],"encoding,":[138],"linear":[139],"feedback":[140],"shift":[141],"register,":[142],"error":[144],"correction":[145],"code.":[146]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}