{"id":"https://openalex.org/W4388676644","doi":"https://doi.org/10.1109/access.2023.3333048","title":"A Novel 4-Bit U-Shaped Chipless Flexible Substrate RFID Sensor Sensing Characterization Study","display_name":"A Novel 4-Bit U-Shaped Chipless Flexible Substrate RFID Sensor Sensing Characterization Study","publication_year":2023,"publication_date":"2023-01-01","ids":{"openalex":"https://openalex.org/W4388676644","doi":"https://doi.org/10.1109/access.2023.3333048"},"language":"en","primary_location":{"id":"doi:10.1109/access.2023.3333048","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3333048","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10318094.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10318094.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003725523","display_name":"Yaming Xie","orcid":"https://orcid.org/0000-0002-8659-6938"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ya Ming Xie","raw_affiliation_strings":["Department of Electronic Science and Technology, Tongji University, Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Science and Technology, Tongji University, Shanghai, China","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008087825","display_name":"Jingwen Hu","orcid":"https://orcid.org/0000-0001-6477-0360"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jing Wen Hu","raw_affiliation_strings":["Department of Electronic Science and Technology, Tongji University, Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Science and Technology, Tongji University, Shanghai, China","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008847770","display_name":"Yang Yu","orcid":"https://orcid.org/0000-0002-2415-8844"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yu Lu Yang","raw_affiliation_strings":["Department of Electronic Science and Technology, Tongji University, Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Science and Technology, Tongji University, Shanghai, China","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114186599","display_name":"Guo Chun Wan","orcid":null},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guo Chun Wan","raw_affiliation_strings":["Department of Electronic Science and Technology, Tongji University, Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0003-0521-1176","affiliations":[{"raw_affiliation_string":"Department of Electronic Science and Technology, Tongji University, Shanghai, China","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100458703","display_name":"Liyu Xie","orcid":"https://orcid.org/0000-0001-5777-0645"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Yu Xie","raw_affiliation_strings":["Department of Civil Engineering, Tongji University, Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0001-5777-0645","affiliations":[{"raw_affiliation_string":"Department of Civil Engineering, Tongji University, Shanghai, China","institution_ids":["https://openalex.org/I116953780"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I116953780"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.5751,"has_fulltext":true,"cited_by_count":4,"citation_normalized_percentile":{"value":0.71489769,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":"11","issue":null,"first_page":"128655","last_page":"128666"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10986","display_name":"RFID technology advancements","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10986","display_name":"RFID technology advancements","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10326","display_name":"Indoor and Outdoor Localization Technologies","score":0.9857000112533569,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reconfigurability","display_name":"Reconfigurability","score":0.7669341564178467},{"id":"https://openalex.org/keywords/structural-health-monitoring","display_name":"Structural health monitoring","score":0.6523969173431396},{"id":"https://openalex.org/keywords/chipless-rfid","display_name":"Chipless RFID","score":0.6213719844818115},{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.5404549241065979},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.49819111824035645},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4951414167881012},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4881502091884613},{"id":"https://openalex.org/keywords/strain-gauge","display_name":"Strain gauge","score":0.4824443459510803},{"id":"https://openalex.org/keywords/antenna","display_name":"Antenna (radio)","score":0.4565633237361908},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.4528525471687317},{"id":"https://openalex.org/keywords/planar","display_name":"Planar","score":0.4514826238155365},{"id":"https://openalex.org/keywords/radio-frequency-identification","display_name":"Radio-frequency identification","score":0.4268483519554138},{"id":"https://openalex.org/keywords/ultra-high-frequency","display_name":"Ultra high frequency","score":0.4183318614959717},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.41132399439811707},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37060704827308655},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2812662124633789},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24775418639183044},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2211456298828125},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17279458045959473},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10513889789581299}],"concepts":[{"id":"https://openalex.org/C2780149590","wikidata":"https://www.wikidata.org/wiki/Q7302742","display_name":"Reconfigurability","level":2,"score":0.7669341564178467},{"id":"https://openalex.org/C2776247918","wikidata":"https://www.wikidata.org/wiki/Q1423713","display_name":"Structural health monitoring","level":2,"score":0.6523969173431396},{"id":"https://openalex.org/C2775974325","wikidata":"https://www.wikidata.org/wiki/Q16154688","display_name":"Chipless RFID","level":3,"score":0.6213719844818115},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.5404549241065979},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.49819111824035645},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4951414167881012},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4881502091884613},{"id":"https://openalex.org/C60584519","wikidata":"https://www.wikidata.org/wiki/Q610723","display_name":"Strain gauge","level":2,"score":0.4824443459510803},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.4565633237361908},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.4528525471687317},{"id":"https://openalex.org/C134786449","wikidata":"https://www.wikidata.org/wiki/Q3391255","display_name":"Planar","level":2,"score":0.4514826238155365},{"id":"https://openalex.org/C204222849","wikidata":"https://www.wikidata.org/wiki/Q104954","display_name":"Radio-frequency identification","level":2,"score":0.4268483519554138},{"id":"https://openalex.org/C96122199","wikidata":"https://www.wikidata.org/wiki/Q628096","display_name":"Ultra high frequency","level":2,"score":0.4183318614959717},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.41132399439811707},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37060704827308655},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2812662124633789},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24775418639183044},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2211456298828125},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17279458045959473},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10513889789581299},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2023.3333048","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3333048","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10318094.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:ad030ef58e1f4afa93074866c3e8de91","is_oa":true,"landing_page_url":"https://doaj.org/article/ad030ef58e1f4afa93074866c3e8de91","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 11, Pp 128655-128666 (2023)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2023.3333048","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3333048","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10318094.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G7755266263","display_name":null,"funder_award_id":"52078375","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4388676644.pdf","grobid_xml":"https://content.openalex.org/works/W4388676644.grobid-xml"},"referenced_works_count":44,"referenced_works":["https://openalex.org/W1455150066","https://openalex.org/W1984983488","https://openalex.org/W2047858339","https://openalex.org/W2072245644","https://openalex.org/W2082119775","https://openalex.org/W2094363255","https://openalex.org/W2110861070","https://openalex.org/W2131134142","https://openalex.org/W2154156000","https://openalex.org/W2164029929","https://openalex.org/W2165942675","https://openalex.org/W2168552293","https://openalex.org/W2281732274","https://openalex.org/W2315744054","https://openalex.org/W2535873298","https://openalex.org/W2554347063","https://openalex.org/W2602457292","https://openalex.org/W2746161144","https://openalex.org/W2790545786","https://openalex.org/W2799723590","https://openalex.org/W2801620960","https://openalex.org/W2892782619","https://openalex.org/W2898569331","https://openalex.org/W2900154519","https://openalex.org/W2900852471","https://openalex.org/W2901416094","https://openalex.org/W2907816154","https://openalex.org/W2976639151","https://openalex.org/W2977795628","https://openalex.org/W2999406866","https://openalex.org/W3002489019","https://openalex.org/W3033909304","https://openalex.org/W3044459136","https://openalex.org/W3080872690","https://openalex.org/W3102577100","https://openalex.org/W3110185113","https://openalex.org/W3137999037","https://openalex.org/W3173176031","https://openalex.org/W3198770949","https://openalex.org/W3200176290","https://openalex.org/W4221096010","https://openalex.org/W4246067179","https://openalex.org/W4292396109","https://openalex.org/W4312843308"],"related_works":["https://openalex.org/W4285153716","https://openalex.org/W2673135913","https://openalex.org/W3189014285","https://openalex.org/W2331874935","https://openalex.org/W2499858975","https://openalex.org/W3015086530","https://openalex.org/W2890875378","https://openalex.org/W4386858745","https://openalex.org/W4236373924","https://openalex.org/W1031946321"],"abstract_inverted_index":{"The":[0,22,84,120],"technical":[1],"method":[2],"of":[3,15,31,38,53,62,81,130,163],"strain":[4,95,148,150,173],"detection":[5],"by":[6,109],"radio":[7],"frequency":[8,101],"identification":[9],"(RFID)":[10],"technology":[11],"has":[12],"the":[13,36,51,60,98,118,155,161,164],"characteristics":[14],"flexibility,":[16,43],"low":[17],"cost":[18],"and":[19,42,149,154,157],"high":[20],"intelligence.":[21],"traditional":[23],"planar-based":[24],"rigid":[25,32],"sensing":[26],"antennas":[27],"are":[28,47],"basically":[29],"made":[30],"substrates,":[33],"which":[34],"have":[35],"disadvantages":[37],"poor":[39],"surface":[40],"fit":[41],"so":[44],"flexible":[45,72],"electronics":[46],"gradually":[48],"applied":[49],"in":[50,97,117,175],"field":[52],"structural":[54,176],"health":[55,177],"monitoring":[56,151,174,178],"(SHM)":[57],"to":[58,142],"solve":[59],"challenge":[61],"non-planar":[63],"deformation":[64],"monitoring.":[65],"In":[66],"this":[67],"paper,":[68],"we":[69],"propose":[70],"a":[71,90,111],"reconfigurable":[73],"strain-gauge":[74],"RFID":[75,100,180],"sensor":[76],"with":[77,94,113,127],"an":[78,124],"encoding":[79,85],"capability":[80],"4":[82],"bits.":[83],"structure":[86],"is":[87,107,140,167],"based":[88],"on":[89],"coupled":[91],"U-shaped":[92],"resonator":[93],"resonance":[96],"UHF":[99],"band":[102],"from":[103],"0-4":[104],"GHz.":[105],"Reconfigurability":[106],"achieved":[108],"introducing":[110],"diode":[112],"modulated":[114],"bandstop":[115],"filtering":[116],"resonator.":[119],"proposed":[121],"antenna":[122],"uses":[123],"FPCB":[125],"board":[126],"total":[128],"dimensions":[129],"100":[131],"mm":[132,135],"\u00d7":[133,136],"71.4":[134],"0.508":[137],"mm.":[138],"It":[139],"subjected":[141],"thermal":[143],"stability":[144],"experiments,":[145],"four-point":[146],"bending":[147],"inside":[152],"concrete,":[153],"simulation":[156],"measurement":[158],"results":[159],"verify":[160],"feasibility":[162],"design.":[165],"This":[166],"important":[168],"for":[169],"realizing":[170],"high-performance":[171],"integrated":[172],"using":[179],"technology.":[181]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}