{"id":"https://openalex.org/W4384080723","doi":"https://doi.org/10.1109/access.2023.3294486","title":"Integrating Machine Learning Model and Digital Twin System for Additive Manufacturing","display_name":"Integrating Machine Learning Model and Digital Twin System for Additive Manufacturing","publication_year":2023,"publication_date":"2023-01-01","ids":{"openalex":"https://openalex.org/W4384080723","doi":"https://doi.org/10.1109/access.2023.3294486"},"language":"en","primary_location":{"id":"doi:10.1109/access.2023.3294486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3294486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10179224.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10179224.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043620040","display_name":"Nursultan Jyeniskhan","orcid":"https://orcid.org/0000-0001-9814-6742"},"institutions":[{"id":"https://openalex.org/I60559429","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98","country_code":"KZ","type":"education","lineage":["https://openalex.org/I60559429"]}],"countries":["KZ"],"is_corresponding":true,"raw_author_name":"Nursultan Jyeniskhan","raw_affiliation_strings":["Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan"],"affiliations":[{"raw_affiliation_string":"Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5092456205","display_name":"Aigerim Keutayeva","orcid":"https://orcid.org/0009-0009-2217-2157"},"institutions":[{"id":"https://openalex.org/I60559429","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98","country_code":"KZ","type":"education","lineage":["https://openalex.org/I60559429"]}],"countries":["KZ"],"is_corresponding":false,"raw_author_name":"Aigerim Keutayeva","raw_affiliation_strings":["Robotics Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan"],"affiliations":[{"raw_affiliation_string":"Robotics Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5092456206","display_name":"Gani Kazbek","orcid":"https://orcid.org/0009-0005-1611-5667"},"institutions":[{"id":"https://openalex.org/I60559429","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98","country_code":"KZ","type":"education","lineage":["https://openalex.org/I60559429"]}],"countries":["KZ"],"is_corresponding":false,"raw_author_name":"Gani Kazbek","raw_affiliation_strings":["Civil and Environmental Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan"],"affiliations":[{"raw_affiliation_string":"Civil and Environmental Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042735114","display_name":"Md. Hazrat Ali","orcid":"https://orcid.org/0000-0003-0428-957X"},"institutions":[{"id":"https://openalex.org/I60559429","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98","country_code":"KZ","type":"education","lineage":["https://openalex.org/I60559429"]}],"countries":["KZ"],"is_corresponding":false,"raw_author_name":"Md Hazrat Ali","raw_affiliation_strings":["Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan"],"affiliations":[{"raw_affiliation_string":"Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5014276053","display_name":"Essam Shehab","orcid":"https://orcid.org/0000-0003-3593-6944"},"institutions":[{"id":"https://openalex.org/I60559429","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98","country_code":"KZ","type":"education","lineage":["https://openalex.org/I60559429"]}],"countries":["KZ"],"is_corresponding":false,"raw_author_name":"Essam Shehab","raw_affiliation_strings":["Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","Head of Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan"],"affiliations":[{"raw_affiliation_string":"Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]},{"raw_affiliation_string":"Head of Mechanical and Aerospace Engineering Department, SEDS, Nazarbayev University, Astana, Kazakhstan","institution_ids":["https://openalex.org/I60559429"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5043620040"],"corresponding_institution_ids":["https://openalex.org/I60559429"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":6.35,"has_fulltext":true,"cited_by_count":58,"citation_normalized_percentile":{"value":0.97361829,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"11","issue":null,"first_page":"71113","last_page":"71126"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9865000247955322,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6996501684188843},{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.6296885013580322},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5659480094909668},{"id":"https://openalex.org/keywords/digital-manufacturing","display_name":"Digital manufacturing","score":0.50128173828125},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4855913519859314},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.47327566146850586},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.4557596445083618},{"id":"https://openalex.org/keywords/manufacturing-execution-system","display_name":"Manufacturing execution system","score":0.42008861899375916},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.37757161259651184},{"id":"https://openalex.org/keywords/computer-integrated-manufacturing","display_name":"Computer-integrated manufacturing","score":0.36056405305862427},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.32779964804649353},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.3243568241596222},{"id":"https://openalex.org/keywords/database","display_name":"Database","score":0.17438983917236328},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15100052952766418},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08632427453994751}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6996501684188843},{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.6296885013580322},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5659480094909668},{"id":"https://openalex.org/C2780841897","wikidata":"https://www.wikidata.org/wiki/Q25349015","display_name":"Digital manufacturing","level":2,"score":0.50128173828125},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4855913519859314},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.47327566146850586},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.4557596445083618},{"id":"https://openalex.org/C7923174","wikidata":"https://www.wikidata.org/wiki/Q1404943","display_name":"Manufacturing execution system","level":3,"score":0.42008861899375916},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.37757161259651184},{"id":"https://openalex.org/C53688548","wikidata":"https://www.wikidata.org/wiki/Q1122190","display_name":"Computer-integrated manufacturing","level":2,"score":0.36056405305862427},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.32779964804649353},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.3243568241596222},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.17438983917236328},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15100052952766418},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08632427453994751},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2023.3294486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3294486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10179224.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:d768160ce91844ad81799db875831ea7","is_oa":true,"landing_page_url":"https://doaj.org/article/d768160ce91844ad81799db875831ea7","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 11, Pp 71113-71126 (2023)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2023.3294486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2023.3294486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10179224.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.550000011920929,"id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G2800101622","display_name":null,"funder_award_id":"11022021FD2904","funder_id":"https://openalex.org/F4320327695","funder_display_name":"Nazarbayev University"}],"funders":[{"id":"https://openalex.org/F4320327695","display_name":"Nazarbayev University","ror":"https://ror.org/052bx8q98"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4384080723.pdf","grobid_xml":"https://content.openalex.org/works/W4384080723.grobid-xml"},"referenced_works_count":39,"referenced_works":["https://openalex.org/W2886783527","https://openalex.org/W2895417602","https://openalex.org/W2911458570","https://openalex.org/W2955425717","https://openalex.org/W2963283627","https://openalex.org/W2966906878","https://openalex.org/W2971499434","https://openalex.org/W2987683755","https://openalex.org/W2996788668","https://openalex.org/W2999135634","https://openalex.org/W3003667836","https://openalex.org/W3034971973","https://openalex.org/W3102456404","https://openalex.org/W3160483696","https://openalex.org/W3161012226","https://openalex.org/W3161266551","https://openalex.org/W3163928685","https://openalex.org/W3174255936","https://openalex.org/W3178362888","https://openalex.org/W3194717752","https://openalex.org/W3200257441","https://openalex.org/W3205420558","https://openalex.org/W3209720383","https://openalex.org/W3213039526","https://openalex.org/W3216100969","https://openalex.org/W4200271076","https://openalex.org/W4200546072","https://openalex.org/W4206616861","https://openalex.org/W4225154039","https://openalex.org/W4225657263","https://openalex.org/W4226082522","https://openalex.org/W4288492587","https://openalex.org/W4291894926","https://openalex.org/W6755082174","https://openalex.org/W6762718338","https://openalex.org/W6795206101","https://openalex.org/W6800841924","https://openalex.org/W6806688266","https://openalex.org/W6810972529"],"related_works":["https://openalex.org/W1511570191","https://openalex.org/W2807405351","https://openalex.org/W1977090892","https://openalex.org/W1992778955","https://openalex.org/W3176927215","https://openalex.org/W1515667823","https://openalex.org/W2063156396","https://openalex.org/W2058171005","https://openalex.org/W2041444655","https://openalex.org/W1600974942"],"abstract_inverted_index":{"Additive":[0],"manufacturing":[1,5,44,56,123,196],"is":[2,20,113],"a":[3,21,30,49,130,213],"promising":[4,214],"process":[6,124],"with":[7,91],"diverse":[8],"applications,":[9],"but":[10],"ensuring":[11],"the":[12,17,43,74,134,144,149,157,160,174,194,202,218,223],"quality":[13,219],"and":[14,40,65,71,100,118,139,148,166,183,187,191,209,220],"reliability":[15,221],"of":[16,42,89,95,133,159,193,205,225],"manufactured":[18],"products":[19],"key":[22],"challenge.":[23],"The":[24,108,169],"digital":[25,50,136,176,206],"twin":[26,51,137,177,207],"has":[27],"emerged":[28],"as":[29],"technology":[31,208],"solution":[32,215],"to":[33,201],"address":[34],"this":[35],"challenge,":[36],"allowing":[37],"real-time":[38,69,189],"monitoring":[39,192],"control":[41,70,117,190],"process.":[45,197],"This":[46,126,198],"paper":[47,199],"proposes":[48],"system":[52,75,162,178],"framework":[53,138],"for":[54,68,80,97,102,116,142,216],"additive":[55,122,195,210,226],"that":[57,173],"integrates":[58],"machine":[59,77,145],"learning":[60,78,146],"models,":[61,147],"employing":[62],"Unity,":[63],"OctoPrint,":[64],"Raspberry":[66],"Pi":[67],"monitoring.":[72,125],"Particularly,":[73],"utilizes":[76],"models":[79],"defect":[81],"detection,":[82],"achieving":[83],"an":[84],"Average":[85],"Precision":[86],"(AP)":[87],"score":[88],"92%,":[90],"specific":[92],"performance":[93],"metrics":[94],"91%":[96],"defected":[98],"objects":[99],"94%":[101],"non-defected":[103],"objects,":[104],"demonstrating":[105],"high":[106],"efficiency.":[107],"Unity":[109,150],"client":[110,151],"user":[111,152],"interface":[112],"also":[114,155],"developed":[115],"visualization,":[119],"facilitating":[120],"easy":[121],"research":[127],"article":[128],"presents":[129],"detailed":[131],"description":[132],"proposed":[135,175],"its":[140,180],"workflow":[141],"implementation,":[143],"interface.":[153],"It":[154],"demonstrates":[156],"effectiveness":[158],"integrated":[161],"through":[163],"case":[164],"studies":[165],"experimental":[167],"results.":[168],"main":[170],"findings":[171],"show":[172],"met":[179],"functional":[181],"requirements":[182],"effectively":[184],"detects":[185],"defects":[186],"provides":[188],"contributes":[200],"growing":[203],"field":[204,224],"manufacturing,":[211],"providing":[212],"enhancing":[217],"in":[222],"manufacturing.":[227]},"counts_by_year":[{"year":2026,"cited_by_count":9},{"year":2025,"cited_by_count":26},{"year":2024,"cited_by_count":20},{"year":2023,"cited_by_count":3}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}