{"id":"https://openalex.org/W4323022449","doi":"https://doi.org/10.1109/access.2023.3251340","title":"Leveraging Public Information to Fit a Compact Hot Carrier Injection Model to a Target Technology","display_name":"Leveraging Public Information to Fit a Compact Hot Carrier Injection Model to a Target Technology","publication_year":2023,"publication_date":"2023-01-01","ids":{"openalex":"https://openalex.org/W4323022449","doi":"https://doi.org/10.1109/access.2023.3251340"},"language":"en","primary_location":{"id":"doi:10.1109/access.2023.3251340","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2023.3251340","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10057381.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"public-domain","license_id":"https://openalex.org/licenses/public-domain","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10057381.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074415474","display_name":"Alexandros Dimopoulos","orcid":"https://orcid.org/0000-0002-8929-5321"},"institutions":[{"id":"https://openalex.org/I212119943","display_name":"University of Victoria","ror":"https://ror.org/04s5mat29","country_code":"CA","type":"education","lineage":["https://openalex.org/I212119943"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Alexandros Dimopoulos","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","institution_ids":["https://openalex.org/I212119943"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada","institution_ids":["https://openalex.org/I212119943"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057365306","display_name":"Mihai Sima","orcid":"https://orcid.org/0000-0002-1945-5190"},"institutions":[{"id":"https://openalex.org/I212119943","display_name":"University of Victoria","ror":"https://ror.org/04s5mat29","country_code":"CA","type":"education","lineage":["https://openalex.org/I212119943"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Mihai Sima","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","institution_ids":["https://openalex.org/I212119943"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada","institution_ids":["https://openalex.org/I212119943"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103437012","display_name":"Stephen W. Neville","orcid":null},"institutions":[{"id":"https://openalex.org/I212119943","display_name":"University of Victoria","ror":"https://ror.org/04s5mat29","country_code":"CA","type":"education","lineage":["https://openalex.org/I212119943"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Stephen W. Neville","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, Canada","institution_ids":["https://openalex.org/I212119943"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC, Canada","institution_ids":["https://openalex.org/I212119943"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5074415474"],"corresponding_institution_ids":["https://openalex.org/I212119943"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.2678,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.50729726,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"11","issue":null,"first_page":"21417","last_page":"21426"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9753000140190125,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5800900459289551}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5800900459289551}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2023.3251340","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2023.3251340","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10057381.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"public-domain","license_id":"https://openalex.org/licenses/public-domain","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:325b13cdc031482593e03939c59c22ad","is_oa":true,"landing_page_url":"https://doaj.org/article/325b13cdc031482593e03939c59c22ad","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 11, Pp 21417-21426 (2023)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2023.3251340","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1109/access.2023.3251340","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10057381.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"public-domain","license_id":"https://openalex.org/licenses/public-domain","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4699999988079071}],"awards":[],"funders":[{"id":"https://openalex.org/F4320310709","display_name":"CMC Microsystems","ror":"https://ror.org/03k70ea39"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4323022449.pdf","grobid_xml":"https://content.openalex.org/works/W4323022449.grobid-xml"},"referenced_works_count":9,"referenced_works":["https://openalex.org/W1996594407","https://openalex.org/W2133807254","https://openalex.org/W2139747641","https://openalex.org/W2485848341","https://openalex.org/W2797482815","https://openalex.org/W2964495811","https://openalex.org/W3135104530","https://openalex.org/W3189020414","https://openalex.org/W3217233231"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"The":[0],"design":[1,19],"of":[2,57,142],"countermeasures":[3],"against":[4,99],"integrated":[5],"circuit":[6],"counterfeit":[7],"recycling":[8],"requires":[9,40],"the":[10,100],"ability":[11],"to":[12,75,90],"simulate":[13],"aging":[14,93],"in":[15],"CMOS":[16],"devices.":[17],"Electronic":[18],"automation":[20],"tools":[21],"commonly":[22],"provide":[23],"this":[24],"ability;":[25],"however,":[26],"their":[27],"models":[28],"must":[29],"be":[30,52],"tuned":[31],"for":[32,117],"use":[33,118],"with":[34,119,138,144],"a":[35,47,55,61,69,110,126,139,145],"specific":[36,127],"target":[37,101],"technology.":[38,130],"This":[39],"data":[41,85],"which":[42],"is":[43],"ideally":[44],"provided":[45],"by":[46,108],"fab.":[48],"It":[49],"may":[50],"also":[51],"collected":[53],"from":[54,87,125],"set":[56],"purpose-built":[58],"test":[59],"devices,":[60],"costly":[62],"and":[63,72,122],"time-consuming":[64],"process.":[65],"Here":[66],"we":[67],"describe":[68],"novel,":[70],"low-cost,":[71],"rapid":[73],"approach":[74,107],"tuning":[76],"such":[77],"models.":[78],"Our":[79,131],"iterative":[80],"method":[81],"leverages":[82],"public":[83],"domain":[84],"sourced":[86],"published":[88],"studies":[89],"fit":[91],"an":[92],"model.":[94],"Results":[95],"are":[96,136],"statistically":[97],"validated":[98,137],"technology\u2019s":[102],"specification.":[103],"We":[104],"demonstrate":[105],"our":[106],"fitting":[109],"compact":[111],"hot":[112],"carrier":[113],"injection":[114],"degradation":[115],"model":[116,133],"both":[120],"core":[121],"I/O":[123],"nMOSFETs":[124],"65":[128],"nm":[129],"resulting":[132],"parameter":[134],"values":[135],"maximum":[140],"error":[141],"0.5%":[143],"99%":[146],"confidence":[147],"bound.":[148]},"counts_by_year":[{"year":2024,"cited_by_count":2}],"updated_date":"2025-12-21T01:58:51.020947","created_date":"2025-10-10T00:00:00"}