{"id":"https://openalex.org/W4312573474","doi":"https://doi.org/10.1109/access.2022.3225657","title":"A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate","display_name":"A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate","publication_year":2022,"publication_date":"2022-01-01","ids":{"openalex":"https://openalex.org/W4312573474","doi":"https://doi.org/10.1109/access.2022.3225657"},"language":"en","primary_location":{"id":"doi:10.1109/access.2022.3225657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3225657","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09966587.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09966587.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100753541","display_name":"Chi Zhang","orcid":"https://orcid.org/0000-0001-5819-8791"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chi Zhang","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":"https://orcid.org/0000-0001-5819-8791","affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100317639","display_name":"Cai Chen","orcid":"https://orcid.org/0000-0002-7596-6307"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cai Chen","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":"https://orcid.org/0000-0002-7596-6307","affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042956862","display_name":"Yi Zhang","orcid":"https://orcid.org/0000-0003-0248-7644"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi Zhang","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005020364","display_name":"Yiyang Yan","orcid":"https://orcid.org/0000-0003-4624-7669"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yiyang Yan","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043785255","display_name":"Yong Cheol Kang","orcid":"https://orcid.org/0000-0002-4299-5005"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yong Kang","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I47720641"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.1485,"has_fulltext":true,"cited_by_count":16,"citation_normalized_percentile":{"value":0.77343066,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":"10","issue":null,"first_page":"125735","last_page":"125743"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10717","display_name":"Aluminum Alloys Composites Properties","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7859069108963013},{"id":"https://openalex.org/keywords/dimple","display_name":"Dimple","score":0.7226223945617676},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.6956939101219177},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.5729916095733643},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.565536379814148},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5540025234222412},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.5374655723571777},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5211707949638367},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5145789980888367},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4854353070259094},{"id":"https://openalex.org/keywords/dbc","display_name":"dBc","score":0.46053317189216614},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.44197148084640503},{"id":"https://openalex.org/keywords/tribology","display_name":"Tribology","score":0.4117692708969116},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.25947511196136475},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12944862246513367}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7859069108963013},{"id":"https://openalex.org/C152327431","wikidata":"https://www.wikidata.org/wiki/Q521200","display_name":"Dimple","level":2,"score":0.7226223945617676},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.6956939101219177},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.5729916095733643},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.565536379814148},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5540025234222412},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.5374655723571777},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5211707949638367},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5145789980888367},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4854353070259094},{"id":"https://openalex.org/C193523891","wikidata":"https://www.wikidata.org/wiki/Q1771950","display_name":"dBc","level":3,"score":0.46053317189216614},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.44197148084640503},{"id":"https://openalex.org/C167310744","wikidata":"https://www.wikidata.org/wiki/Q193870","display_name":"Tribology","level":2,"score":0.4117692708969116},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.25947511196136475},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12944862246513367},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2022.3225657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3225657","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09966587.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:713e32d7e9824963a7d64cc5a7c36e01","is_oa":true,"landing_page_url":"https://doaj.org/article/713e32d7e9824963a7d64cc5a7c36e01","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 10, Pp 125735-125743 (2022)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2022.3225657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3225657","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09966587.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Responsible consumption and production","id":"https://metadata.un.org/sdg/12","score":0.47999998927116394}],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4312573474.pdf","grobid_xml":"https://content.openalex.org/works/W4312573474.grobid-xml"},"referenced_works_count":27,"referenced_works":["https://openalex.org/W1968523015","https://openalex.org/W1977935079","https://openalex.org/W1979680660","https://openalex.org/W2005082083","https://openalex.org/W2009217288","https://openalex.org/W2012241126","https://openalex.org/W2012775599","https://openalex.org/W2029705043","https://openalex.org/W2035065976","https://openalex.org/W2054270308","https://openalex.org/W2081577015","https://openalex.org/W2087104684","https://openalex.org/W2133365958","https://openalex.org/W2156092039","https://openalex.org/W2162827174","https://openalex.org/W2187562967","https://openalex.org/W2241108194","https://openalex.org/W2253118066","https://openalex.org/W2548470709","https://openalex.org/W2585145871","https://openalex.org/W2964889398","https://openalex.org/W3027997237","https://openalex.org/W4229680264","https://openalex.org/W6645020820","https://openalex.org/W6682820954","https://openalex.org/W6690462151","https://openalex.org/W6691585462"],"related_works":["https://openalex.org/W2146970644","https://openalex.org/W2946300596","https://openalex.org/W844106015","https://openalex.org/W2047367419","https://openalex.org/W2274972158","https://openalex.org/W4384823121","https://openalex.org/W2365810880","https://openalex.org/W2316217270","https://openalex.org/W4383748854","https://openalex.org/W2743625874"],"abstract_inverted_index":{"Traditionally,":[0],"reliability-improved":[1],"methods":[2,46],"like":[3],"etched":[4],"dimples":[5],"are":[6,47,145],"set":[7],"at":[8,50,213],"the":[9,12,17,26,30,37,41,51,55,60,85,88,98,113,117,124,129,135,148,155,190,206,211,214,229,240,245,249,273,283],"edge":[10],"of":[11,29,40,54,87,151,157,165,197,202,210,228,248,286],"copper":[13,23,27,32,38,43,140,216],"pattern":[14,33,94,270],"to":[15,78,96,217],"relieve":[16],"thermal-mechanical":[18],"stress":[19,114],"on":[20,101,116,128,147,154,172,236,256,263,282],"direct":[21],"bonded":[22],"(DBC).":[24],"When":[25],"ratio":[28,39],"top":[31,56,118,215],"is":[34,67,121],"less":[35,48],"than":[36],"bottom":[42,93,149,191,241,269],"pattern,":[44],"these":[45],"effective":[49],"inner":[52],"edges":[53],"ceramic":[57,119,131],"interface":[58,120],"where":[59],"initial":[61],"crack":[62],"appears.":[63],"Currently,":[64],"no":[65],"explanation":[66],"found":[68,111],"for":[69],"this":[70,79,82],"phenomenon":[71,89],"and":[72,90,105,160,178,199,220,259],"other":[73],"solutions":[74],"should":[75],"be":[76,110,218,279],"taken":[77],"problem.":[80,99],"Hence,":[81],"paper":[83],"analyzed":[84],"mechanism":[86],"proposed":[91],"a":[92,102,183,195,200,223],"design":[95,242,271,285],"solve":[97],"Based":[100],"bi-material":[103],"model":[104,234],"FE":[106,186,274],"analysis,":[107],"it":[108],"can":[109,204,243,278],"that":[112,189,239],"concentration":[115],"caused":[122],"by":[123,170,266],"opposite":[125],"bending":[126],"actions":[127],"two":[130,139],"interfaces.":[132],"To":[133],"eliminate":[134],"geometrical":[136],"difference":[137],"between":[138],"layers,":[141],"Parallel":[142],"dimple":[143,166,192],"traces":[144],"used":[146,281],"instead":[150],"mirror-copied":[152],"gap":[153,201],"consideration":[156],"thermal":[158,176,179,225,252,260],"resistance":[159,180,226,261],"mechanical":[161],"strength.":[162],"The":[163,251],"parameters":[164],"trace":[167,193],"were":[168],"chosen":[169],"simulations":[171],"stress-strain":[173],"results":[174,187],"under":[175],"cycling":[177,253],"calculations":[181],"in":[182],"module":[184,230,264,288],"packaging.":[185,231],"show":[188],"with":[194,268],"diameter":[196],"0.4mm":[198],"2mm":[203],"adjust":[205],"thermal-induced":[207],"strain":[208,237],"behavior":[209],"singularities":[212],"even":[219],"sacrifices":[221],"only":[222],"2%":[224],"rise":[227],"Life":[232],"prediction":[233],"based":[235],"shows":[238],"improve":[244],"life":[246],"time":[247],"substrate.":[250,292],"test":[254],"result":[255],"sample":[257],"DBC":[258,267,291],"measurement":[262],"packaged":[265],"verify":[272],"analysis.":[275],"This":[276],"method":[277],"widely":[280],"packaging":[284],"power":[287],"using":[289],"stand-alone":[290]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}