{"id":"https://openalex.org/W4213155881","doi":"https://doi.org/10.1109/access.2022.3152195","title":"Modeling TPU Thermal Maps Under Superlattice Thermoelectric Cooling","display_name":"Modeling TPU Thermal Maps Under Superlattice Thermoelectric Cooling","publication_year":2022,"publication_date":"2022-01-01","ids":{"openalex":"https://openalex.org/W4213155881","doi":"https://doi.org/10.1109/access.2022.3152195"},"language":"en","primary_location":{"id":"doi:10.1109/access.2022.3152195","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3152195","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9668973/09715098.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/9668973/09715098.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060026970","display_name":"Tim B\u00fccher","orcid":"https://orcid.org/0000-0003-2974-7960"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Tim Bucher","raw_affiliation_strings":["Chair of Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany"],"raw_orcid":"https://orcid.org/0000-0003-2974-7960","affiliations":[{"raw_affiliation_string":"Chair of Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059133190","display_name":"Hussam Amrouch","orcid":"https://orcid.org/0000-0002-5649-3102"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["Chair of Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany"],"raw_orcid":"https://orcid.org/0000-0002-5649-3102","affiliations":[{"raw_affiliation_string":"Chair of Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5060026970"],"corresponding_institution_ids":["https://openalex.org/I100066346"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":2002,"currency":"EUR","value_usd":2159},"fwci":0.7538,"has_fulltext":true,"cited_by_count":10,"citation_normalized_percentile":{"value":0.64279151,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"10","issue":null,"first_page":"21970","last_page":"21978"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9898999929428101,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11315","display_name":"Phase-change materials and chalcogenides","score":0.978600025177002,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/superlattice","display_name":"Superlattice","score":0.7532777786254883},{"id":"https://openalex.org/keywords/thermoelectric-cooling","display_name":"Thermoelectric cooling","score":0.6313133239746094},{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.6190147995948792},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5849624872207642},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4953538179397583},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.332925409078598},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.18559995293617249},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14972540736198425}],"concepts":[{"id":"https://openalex.org/C105382558","wikidata":"https://www.wikidata.org/wiki/Q332431","display_name":"Superlattice","level":2,"score":0.7532777786254883},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.6313133239746094},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.6190147995948792},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5849624872207642},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4953538179397583},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.332925409078598},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.18559995293617249},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14972540736198425}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2022.3152195","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3152195","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9668973/09715098.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:de7d2bb8bf94472a8d007e88d2f3952f","is_oa":true,"landing_page_url":"https://doaj.org/article/de7d2bb8bf94472a8d007e88d2f3952f","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 10, Pp 21970-21978 (2022)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2022.3152195","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2022.3152195","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9668973/09715098.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7400000095367432,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G2914956538","display_name":null,"funder_award_id":"428566201","funder_id":"https://openalex.org/F4320320879","funder_display_name":"Deutsche Forschungsgemeinschaft"}],"funders":[{"id":"https://openalex.org/F4320320879","display_name":"Deutsche Forschungsgemeinschaft","ror":"https://ror.org/018mejw64"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4213155881.pdf","grobid_xml":"https://content.openalex.org/works/W4213155881.grobid-xml"},"referenced_works_count":14,"referenced_works":["https://openalex.org/W1502152410","https://openalex.org/W1901632646","https://openalex.org/W2006980464","https://openalex.org/W2111062303","https://openalex.org/W2137983211","https://openalex.org/W2163517070","https://openalex.org/W2252676268","https://openalex.org/W2606183703","https://openalex.org/W2606722458","https://openalex.org/W2742644411","https://openalex.org/W3091745343","https://openalex.org/W3132769547","https://openalex.org/W4287204036","https://openalex.org/W6794426595"],"related_works":["https://openalex.org/W3035164232","https://openalex.org/W2037363130","https://openalex.org/W2149020627","https://openalex.org/W2514821055","https://openalex.org/W1986125854","https://openalex.org/W4386543406","https://openalex.org/W2080249650","https://openalex.org/W3165776358","https://openalex.org/W2026434255","https://openalex.org/W2971777703"],"abstract_inverted_index":{"The":[0,232,240],"recent":[1],"renaissance":[2],"in":[3,36,155,247,285],"machine":[4],"learning":[5],"is":[6,49,94,127,237,245],"requesting":[7],"computing":[8],"power":[9,39,120,312],"at":[10,105],"an":[11,292],"ever-increasing":[12],"rate.":[13],"In":[14,206],"order":[15,248],"to":[16,32,46,60,96,109,117,150,171,183,249,263,274,287],"meet":[17],"this":[18,70,144,173,176,207],"demand,":[19],"tensor":[20],"processing":[21],"units":[22,58],"(TPU)":[23],"are":[24,195,340],"becoming":[25],"popular":[26],"because":[27],"they":[28],"hold":[29],"the":[30,83,102,106,114,118,203,218,256,266,271,329,335,344],"promise":[31],"be":[33,151],"more":[34,159],"efficient":[35],"terms":[37],"of":[38,56,65,85,101,220,228,296,304],"usage":[40],"as":[41,43,308],"well":[42],"throughput":[44],"compared":[45],"GPUs.":[47],"This":[48],"achieved":[50],"by":[51,88],"integrating":[52],"a":[53,62,211,221,229,276,301],"huge":[54],"number":[55],"matrix-multiply":[57],"(MMU)":[59],"perform":[61],"massive":[63],"amount":[64],"parallel":[66],"multiply-accumulate":[67],"operations.":[68],"However,":[69,191],"causes":[71],"excessive":[72],"localized":[73],"hot-spots.":[74],"Elevated":[75],"on-chip":[76],"temperatures":[77],"jeopardize":[78],"reliability":[79,111],"and":[80,188,314,334],"significantly":[81],"reduce":[82],"lifetime":[84],"semiconductor":[86],"devices":[87],"accelerating":[89],"aging":[90],"defects.":[91],"Therefore,":[92],"it":[93,137],"vital":[95],"obtain":[97,250],"accurate":[98],"thermal":[99,278,331],"maps":[100],"TPU":[103,230],"die":[104],"design":[107,305],"time":[108,272],"ensure":[110],"requirements":[112],"during":[113],"run-time.":[115],"Due":[116],"high":[119,251],"density,":[121],"traditional":[122],"forced":[123],"air":[124],"convection":[125,309],"cooling":[126,132,147,189,235,317],"often":[128],"insufficient.":[129],"Hence,":[130],"liquid":[131],"may":[133],"seem":[134],"promising,":[135],"but":[136],"requires":[138],"substantial":[139],"maintenance":[140],"effort.":[141],"To":[142,175],"overcome":[143],"challenge,":[145],"novel":[146],"concepts":[148],"need":[149],"explored.":[152],"Recent":[153],"advances":[154],"thermoelectric":[156,164],"coolers":[157],"(TEC),":[158],"specifically":[160],"ultra":[161],"thin-film":[162],"superlattice":[163,222,315],"(TE)":[165],"devices,":[166],"have":[167],"opened":[168],"new":[169],"doors":[170],"combat":[172],"obstacle.":[174],"end,":[177],"finite-element":[178],"(FEM)":[179],"simulations":[180,194],"enable":[181],"designers":[182,200],"find":[184],"tradeoffs":[185],"between":[186],"temperature":[187],"cost.":[190],"such":[192,307],"multi-physics":[193,242],"extremely":[196],"time-consuming,":[197],"which":[198],"prevents":[199],"from":[201],"exploring":[202],"available":[204,342],"design-space.":[205],"work,":[208],"we":[209],"demonstrate":[210],"neural":[212,337],"network":[213,338],"(NN)":[214],"model":[215,261,299],"that":[216],"captures":[217],"effects":[219],"TEC":[223,316],"device":[224],"mounted":[225],"on":[226,281],"top":[227],"die.":[231],"additional":[233],"required":[234,273],"cost":[236],"also":[238],"estimated.":[239],"commercial":[241],"tool":[243],"ANSYS":[244,286],"employed":[246],"resolution":[252],"data":[253],"towards":[254],"training":[255],"NN":[257,260],"model.":[258],"Our":[259,298,326],"allows":[262],"speed":[264],"up":[265],"design-space":[267],"exploration":[268],"considerably,":[269],"reducing":[270],"generate":[275],"single":[277],"map":[279],"from,":[280],"average,":[282],"45":[283],"min":[284],"merely":[288],"70":[289],"ms":[290],"with":[291],"average":[293],"prediction":[294],"error":[295],"0.26\u00b0C.":[297],"covers":[300],"wide":[302],"range":[303],"parameters,":[306],"film":[310],"coefficient,":[311],"density":[313],"intensity.":[318],"<bold":[319],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[320,324],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">Open":[321],"Source:</b>":[322],"<uri":[323],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">https://github.com/ML-CAD/TPU-Thermal-Map-Prediction.git</uri>":[325],"framework":[327],"including":[328],"generated":[330],"image":[332],"dataset":[333],"trained":[336],"models":[339],"publicly":[341],"under":[343],"above":[345],"link.":[346]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}