{"id":"https://openalex.org/W4205823980","doi":"https://doi.org/10.1109/access.2021.3133530","title":"Iterative Electrical\u2013Thermal Coupled Simulation Method of Automotive Power Module Used in Electric Power Steering System","display_name":"Iterative Electrical\u2013Thermal Coupled Simulation Method of Automotive Power Module Used in Electric Power Steering System","publication_year":2021,"publication_date":"2021-01-01","ids":{"openalex":"https://openalex.org/W4205823980","doi":"https://doi.org/10.1109/access.2021.3133530"},"language":"en","primary_location":{"id":"doi:10.1109/access.2021.3133530","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3133530","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09641783.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09641783.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088035080","display_name":"Jangmuk Lim","orcid":"https://orcid.org/0000-0003-4701-4277"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jangmuk Lim","raw_affiliation_strings":["Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea"],"raw_orcid":"https://orcid.org/0000-0003-4701-4277","affiliations":[{"raw_affiliation_string":"Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101873963","display_name":"Jae-Jin Jeon","orcid":"https://orcid.org/0000-0001-7747-1722"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaejin Jeon","raw_affiliation_strings":["Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea"],"raw_orcid":"https://orcid.org/0000-0001-7747-1722","affiliations":[{"raw_affiliation_string":"Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040880601","display_name":"Jihwan Seong","orcid":"https://orcid.org/0000-0003-3601-1740"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jihwan Seong","raw_affiliation_strings":["Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea"],"raw_orcid":"https://orcid.org/0000-0003-3601-1740","affiliations":[{"raw_affiliation_string":"Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102708327","display_name":"Jaehyun Cho","orcid":"https://orcid.org/0000-0002-6190-6151"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaehyun Cho","raw_affiliation_strings":["Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041839476","display_name":"Seong Moo Cho","orcid":null},"institutions":[{"id":"https://openalex.org/I2818286","display_name":"LG (United States)","ror":"https://ror.org/02b948n83","country_code":"US","type":"company","lineage":["https://openalex.org/I2818286","https://openalex.org/I4210131320"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seong Moo Cho","raw_affiliation_strings":["Power Electronics Lab, LG Electronics Inc., 04763 Seoul, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Power Electronics Lab, LG Electronics Inc., 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I2818286"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040644416","display_name":"Kwang Soo Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2818286","display_name":"LG (United States)","ror":"https://ror.org/02b948n83","country_code":"US","type":"company","lineage":["https://openalex.org/I2818286","https://openalex.org/I4210131320"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kwang Soo Kim","raw_affiliation_strings":["Power Electronics Lab, LG Electronics Inc., 04763 Seoul, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Power Electronics Lab, LG Electronics Inc., 04763 Seoul, South Korea","institution_ids":["https://openalex.org/I2818286"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102957011","display_name":"Sang Won Yoon","orcid":"https://orcid.org/0000-0002-0201-8031"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sang Won Yoon","raw_affiliation_strings":["Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea. (e-mail: swyoon@hanyang.ac.kr)"],"raw_orcid":"https://orcid.org/0000-0002-0201-8031","affiliations":[{"raw_affiliation_string":"Automotive Engineering Department, Hanyang University, 04763 Seoul, South Korea. (e-mail: swyoon@hanyang.ac.kr)","institution_ids":["https://openalex.org/I4575257"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.5085,"has_fulltext":true,"cited_by_count":8,"citation_normalized_percentile":{"value":0.65668104,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"9","issue":null,"first_page":"164712","last_page":"164719"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14156","display_name":"Engineering Applied Research","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multiphysics","display_name":"Multiphysics","score":0.5859357118606567},{"id":"https://openalex.org/keywords/power-module","display_name":"Power module","score":0.5714174509048462},{"id":"https://openalex.org/keywords/workbench","display_name":"Workbench","score":0.5571573972702026},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5319291353225708},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5122184157371521},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.4761262536048889},{"id":"https://openalex.org/keywords/electric-power","display_name":"Electric power","score":0.44979241490364075},{"id":"https://openalex.org/keywords/power-density","display_name":"Power density","score":0.4484640061855316},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.441588819026947},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.38422486186027527},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34953945875167847},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3400861322879791},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.19945472478866577},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19016161561012268},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09586817026138306}],"concepts":[{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.5859357118606567},{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.5714174509048462},{"id":"https://openalex.org/C2779145975","wikidata":"https://www.wikidata.org/wiki/Q347690","display_name":"Workbench","level":3,"score":0.5571573972702026},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5319291353225708},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5122184157371521},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4761262536048889},{"id":"https://openalex.org/C40293303","wikidata":"https://www.wikidata.org/wiki/Q27137","display_name":"Electric power","level":3,"score":0.44979241490364075},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.4484640061855316},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.441588819026947},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38422486186027527},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34953945875167847},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3400861322879791},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.19945472478866577},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19016161561012268},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09586817026138306},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C36464697","wikidata":"https://www.wikidata.org/wiki/Q451553","display_name":"Visualization","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2021.3133530","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3133530","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09641783.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:1130b00e328c45df8aa43671b642f2a2","is_oa":true,"landing_page_url":"https://doaj.org/article/1130b00e328c45df8aa43671b642f2a2","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 9, Pp 164712-164719 (2021)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2021.3133530","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3133530","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/09641783.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.8399999737739563,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G1998617242","display_name":null,"funder_award_id":"NRF-2020R1A4A4079701","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G8744553980","display_name":null,"funder_award_id":"2020R1A4A4079701","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"}],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320329803","display_name":"LG Electronics","ror":"https://ror.org/03ddh2c27"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4205823980.pdf","grobid_xml":"https://content.openalex.org/works/W4205823980.grobid-xml"},"referenced_works_count":35,"referenced_works":["https://openalex.org/W1503757190","https://openalex.org/W2004731663","https://openalex.org/W2026012753","https://openalex.org/W2053389350","https://openalex.org/W2057447531","https://openalex.org/W2058404321","https://openalex.org/W2077045507","https://openalex.org/W2077760225","https://openalex.org/W2079575204","https://openalex.org/W2084721197","https://openalex.org/W2084736311","https://openalex.org/W2116075244","https://openalex.org/W2138623588","https://openalex.org/W2251987984","https://openalex.org/W2329749079","https://openalex.org/W2344110434","https://openalex.org/W2518955089","https://openalex.org/W2568603120","https://openalex.org/W2582421809","https://openalex.org/W2584057151","https://openalex.org/W2601519006","https://openalex.org/W2806818631","https://openalex.org/W2891983913","https://openalex.org/W2894920743","https://openalex.org/W2922047137","https://openalex.org/W2973191513","https://openalex.org/W2975350496","https://openalex.org/W2978991624","https://openalex.org/W2982139064","https://openalex.org/W2999120521","https://openalex.org/W3027521505","https://openalex.org/W3031630999","https://openalex.org/W3094244298","https://openalex.org/W3200851171","https://openalex.org/W6670556187"],"related_works":["https://openalex.org/W4403163652","https://openalex.org/W4360832148","https://openalex.org/W2954181161","https://openalex.org/W3141100782","https://openalex.org/W2885827376","https://openalex.org/W2996017886","https://openalex.org/W2592344676","https://openalex.org/W2161246214","https://openalex.org/W2546318482","https://openalex.org/W4211096866"],"abstract_inverted_index":{"This":[0,60],"paper":[1,61],"presents":[2],"a":[3,13,63,71,169,184],"multi-physics":[4],"analysis":[5],"coupling":[6],"the":[7,54,67,93,109,128,139,148,156,165,176,179,186,199,216],"electrical":[8,99,122,172],"and":[9,96,100,116,121,132,151],"thermal":[10,101,120,181,188],"properties":[11],"of":[12,31,57,70,155,178,202],"power":[14,17,58,72,87,157],"module.":[15],"As":[16,183],"modules":[18],"have":[19,34],"multi-physical":[20,28,55],"behaviors,":[21],"it":[22,48],"is":[23,49,81,195],"important":[24],"to":[25,51,65,127,164,175,191,198],"simulate":[26],"their":[27],"characteristics.":[29],"Simulations":[30],"these":[32,43],"characteristics":[33,44,69],"been":[35],"separately":[36,170],"conducted":[37,133,171],"using":[38],"specific":[39],"software;":[40],"however,":[41],"as":[42],"are":[45,159],"often":[46],"coupled,":[47],"difficult":[50],"fully":[52],"understand":[53],"nature":[56],"modules.":[59],"proposes":[62],"method":[64],"analyze":[66],"coupled":[68,110,144,209],"module":[73,80,95,158],"in":[74],"an":[75,84,134],"iterative":[76,135,207],"manner.":[77],"The":[78,143],"analyzed":[79],"designed":[82],"for":[83,106,119],"automotive":[85],"electric":[86],"steering":[88],"(EPS)":[89],"system.":[90],"We":[91],"fabricated":[92],"EPS":[94],"measured":[97,200],"its":[98],"characteristics,":[102],"which":[103,194],"were":[104],"used":[105],"reference.":[107],"For":[108],"simulation,":[111],"we":[112],"employed":[113],"ANSYS":[114,129],"Icepak":[115],"Q3D":[117],"Extractor":[118],"simulations,":[123],"respectively,":[124],"linked":[125,180],"them":[126],"workbench":[130],"environment,":[131],"feedback":[136],"simulation":[137,145,173,210],"until":[138],"simulated":[140,187],"results":[141,214],"converged.":[142],"demonstrated":[146],"that":[147],"parasitic":[149],"resistance":[150,189],"volume":[152],"loss":[153],"density":[154],"increased":[160,190],"by":[161],"~50%":[162],"compared":[163],"those":[166],"obtained":[167],"from":[168],"due":[174],"impact":[177],"simulation.":[182],"result,":[185],"0.26":[192],"K/W,":[193],"almost":[196],"identical":[197],"value":[201],"~0.27":[203],"K/W.":[204],"Therefore,":[205],"our":[206],"electrical\u2013thermal":[208],"exhibits":[211],"more":[212],"accurate":[213],"than":[215],"conventional":[217],"separate":[218],"simulations.":[219]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}