{"id":"https://openalex.org/W3152832964","doi":"https://doi.org/10.1109/access.2021.3071486","title":"Effective Conductivity of Additive-Manufactured Metals for Microwave Feed Components","display_name":"Effective Conductivity of Additive-Manufactured Metals for Microwave Feed Components","publication_year":2021,"publication_date":"2021-01-01","ids":{"openalex":"https://openalex.org/W3152832964","doi":"https://doi.org/10.1109/access.2021.3071486","mag":"3152832964"},"language":"en","primary_location":{"id":"doi:10.1109/access.2021.3071486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3071486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9312710/09399343.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/9312710/09399343.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085125446","display_name":"Richard G. Edwards","orcid":"https://orcid.org/0000-0002-1934-1759"},"institutions":[{"id":"https://openalex.org/I223532165","display_name":"University of Utah","ror":"https://ror.org/03r0ha626","country_code":"US","type":"education","lineage":["https://openalex.org/I223532165"]},{"id":"https://openalex.org/I4210163537","display_name":"L3Harris (United States)","ror":"https://ror.org/05fhwtx59","country_code":"US","type":"company","lineage":["https://openalex.org/I4210163537"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Richard G. Edwards","raw_affiliation_strings":["L3Harris Technologies, Salt Lake City, UT, USA","The University of Utah, Salt Lake City, UT, USA"],"raw_orcid":"https://orcid.org/0000-0002-1934-1759","affiliations":[{"raw_affiliation_string":"L3Harris Technologies, Salt Lake City, UT, USA","institution_ids":["https://openalex.org/I4210163537"]},{"raw_affiliation_string":"The University of Utah, Salt Lake City, UT, USA","institution_ids":["https://openalex.org/I223532165"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030596300","display_name":"Craig M. Norton","orcid":null},"institutions":[{"id":"https://openalex.org/I4210163537","display_name":"L3Harris (United States)","ror":"https://ror.org/05fhwtx59","country_code":"US","type":"company","lineage":["https://openalex.org/I4210163537"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Craig M. Norton","raw_affiliation_strings":["L3Harris Technologies, Salt Lake City, UT, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"L3Harris Technologies, Salt Lake City, UT, USA","institution_ids":["https://openalex.org/I4210163537"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086381452","display_name":"Jared E. Campbell","orcid":null},"institutions":[{"id":"https://openalex.org/I4210163537","display_name":"L3Harris (United States)","ror":"https://ror.org/05fhwtx59","country_code":"US","type":"company","lineage":["https://openalex.org/I4210163537"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jared E. Campbell","raw_affiliation_strings":["L3Harris Technologies, Salt Lake City, UT, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"L3Harris Technologies, Salt Lake City, UT, USA","institution_ids":["https://openalex.org/I4210163537"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5056346042","display_name":"David Schurig","orcid":"https://orcid.org/0000-0002-2000-6966"},"institutions":[{"id":"https://openalex.org/I223532165","display_name":"University of Utah","ror":"https://ror.org/03r0ha626","country_code":"US","type":"education","lineage":["https://openalex.org/I223532165"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Schurig","raw_affiliation_strings":["The University of Utah, Salt Lake City, UT, USA"],"raw_orcid":"https://orcid.org/0000-0002-2000-6966","affiliations":[{"raw_affiliation_string":"The University of Utah, Salt Lake City, UT, USA","institution_ids":["https://openalex.org/I223532165"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5085125446"],"corresponding_institution_ids":["https://openalex.org/I223532165","https://openalex.org/I4210163537"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.0169,"has_fulltext":true,"cited_by_count":11,"citation_normalized_percentile":{"value":0.75348342,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":98},"biblio":{"volume":"9","issue":null,"first_page":"59979","last_page":"59986"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/conductivity","display_name":"Conductivity","score":0.7606066465377808},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7364063262939453},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.6841795444488525},{"id":"https://openalex.org/keywords/lossy-compression","display_name":"Lossy compression","score":0.5403187274932861},{"id":"https://openalex.org/keywords/microwave-cavity","display_name":"Microwave cavity","score":0.5347610712051392},{"id":"https://openalex.org/keywords/waveguide","display_name":"Waveguide","score":0.44958260655403137},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.4143785238265991},{"id":"https://openalex.org/keywords/gallium","display_name":"Gallium","score":0.41287505626678467},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.41078996658325195},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.40745797753334045},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3895342946052551},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3545629382133484},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.3293479084968567},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.25241968035697937},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.1549791395664215}],"concepts":[{"id":"https://openalex.org/C131540310","wikidata":"https://www.wikidata.org/wiki/Q907564","display_name":"Conductivity","level":2,"score":0.7606066465377808},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7364063262939453},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.6841795444488525},{"id":"https://openalex.org/C165021410","wikidata":"https://www.wikidata.org/wiki/Q55564","display_name":"Lossy compression","level":2,"score":0.5403187274932861},{"id":"https://openalex.org/C186397771","wikidata":"https://www.wikidata.org/wiki/Q5759014","display_name":"Microwave cavity","level":3,"score":0.5347610712051392},{"id":"https://openalex.org/C200687136","wikidata":"https://www.wikidata.org/wiki/Q11233438","display_name":"Waveguide","level":2,"score":0.44958260655403137},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4143785238265991},{"id":"https://openalex.org/C550372918","wikidata":"https://www.wikidata.org/wiki/Q861","display_name":"Gallium","level":2,"score":0.41287505626678467},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.41078996658325195},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.40745797753334045},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3895342946052551},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3545629382133484},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.3293479084968567},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.25241968035697937},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.1549791395664215},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2021.3071486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3071486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9312710/09399343.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:768ff32b204d46cdaada378a8ac462f6","is_oa":true,"landing_page_url":"https://doaj.org/article/768ff32b204d46cdaada378a8ac462f6","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 9, Pp 59979-59986 (2021)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2021.3071486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2021.3071486","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/9312710/09399343.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320316489","display_name":"Harris","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3152832964.pdf","grobid_xml":"https://content.openalex.org/works/W3152832964.grobid-xml"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W156865709","https://openalex.org/W595294994","https://openalex.org/W2042740616","https://openalex.org/W2050213796","https://openalex.org/W2068019452","https://openalex.org/W2088258348","https://openalex.org/W2093873541","https://openalex.org/W2123954022","https://openalex.org/W2301226181","https://openalex.org/W2377870808","https://openalex.org/W2520602741","https://openalex.org/W2567177733","https://openalex.org/W2576871218","https://openalex.org/W2579587846","https://openalex.org/W2585379367","https://openalex.org/W2591080038","https://openalex.org/W2616247636","https://openalex.org/W2621059491","https://openalex.org/W2621182377","https://openalex.org/W2758617546","https://openalex.org/W2762097399","https://openalex.org/W2762342601","https://openalex.org/W2762903834","https://openalex.org/W2781913914","https://openalex.org/W2781937134","https://openalex.org/W2782460718","https://openalex.org/W4240549567","https://openalex.org/W6709740425","https://openalex.org/W6732126155","https://openalex.org/W6732422941"],"related_works":["https://openalex.org/W1995805316","https://openalex.org/W2057485995","https://openalex.org/W2387503788","https://openalex.org/W2059658550","https://openalex.org/W4287903946","https://openalex.org/W50067980","https://openalex.org/W2999957348","https://openalex.org/W2964219139","https://openalex.org/W2803920876","https://openalex.org/W3042625184"],"abstract_inverted_index":{"This":[0],"paper":[1],"characterizes":[2],"the":[3,26,41,49,59,62,65,69,75,78,87,91,95,135],"effective":[4],"conductivity":[5,63,99],"of":[6,40,61,68,77,90,113,116,129],"lossy":[7],"metal":[8],"materials":[9],"fabricated":[10,105,117],"with":[11,100],"additive":[12,30],"manufacturing":[13,31],"processes":[14],"at":[15,36],"microwave":[16],"frequencies":[17],"using":[18],"a":[19],"resonant":[20,50],"cavity":[21,51,70],"approach.":[22],"Specifically":[23],"addressed":[24],"is":[25,84,110,132],"powder":[27],"bed":[28],"fusion":[29],"process":[32],"utilizing":[33],"AlSi10Mg":[34],"material":[35,53],"Ku-band.":[37],"The":[38,98,124],"details":[39],"procedure":[42,83],"for":[43,103],"converting":[44],"device":[45],"parameters":[46],"that":[47],"characterize":[48],"to":[52,74],"properties":[54],"are":[55,71,122],"given.":[56],"Trade-offs":[57],"between":[58,86],"precision":[60],"and":[64,94,126],"quality":[66],"factor":[67],"discussed":[72],"relevant":[73],"design":[76],"cavity.":[79],"A":[80],"best-fit":[81],"matching":[82],"made":[85],"measured":[88,127],"response":[89],"manufactured":[92],"cavities":[93,106],"simulated":[96],"results.":[97],"statistical":[101],"deviation":[102],"various":[104,114],"from":[107],"different":[108],"vendors":[109],"reported.":[111],"Examples":[112],"designs":[115],"prototype":[118],"waveguide":[119],"feed":[120],"components":[121],"presented.":[123],"predicted":[125],"performance":[128],"each":[130],"component":[131],"compared,":[133],"validating":[134],"process.":[136]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":5}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}