{"id":"https://openalex.org/W3081517420","doi":"https://doi.org/10.1109/access.2020.3019775","title":"Automotive Power Module Packaging: Current Status and Future Trends","display_name":"Automotive Power Module Packaging: Current Status and Future Trends","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3081517420","doi":"https://doi.org/10.1109/access.2020.3019775","mag":"3081517420"},"language":"en","primary_location":{"id":"doi:10.1109/access.2020.3019775","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.3019775","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09178734.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09178734.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052385675","display_name":"Yuhang Yang","orcid":"https://orcid.org/0000-0002-3268-131X"},"institutions":[{"id":"https://openalex.org/I98251732","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29","country_code":"CA","type":"education","lineage":["https://openalex.org/I98251732"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Yuhang Yang","raw_affiliation_strings":["Department of Mechanical Engineering, McMaster University, Hamilton, Canada"],"raw_orcid":"https://orcid.org/0000-0002-3268-131X","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061758855","display_name":"Lea Dorn-Gomba","orcid":null},"institutions":[{"id":"https://openalex.org/I98251732","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29","country_code":"CA","type":"education","lineage":["https://openalex.org/I98251732"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Lea Dorn-Gomba","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada"],"raw_orcid":"https://orcid.org/0000-0001-9954-0135","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103195994","display_name":"Romina Rodriguez","orcid":"https://orcid.org/0000-0003-2315-3440"},"institutions":[{"id":"https://openalex.org/I98251732","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29","country_code":"CA","type":"education","lineage":["https://openalex.org/I98251732"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Romina Rodriguez","raw_affiliation_strings":["Department of Mechanical Engineering, McMaster University, Hamilton, Canada"],"raw_orcid":"https://orcid.org/0000-0003-2315-3440","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030974526","display_name":"Christopher Mak","orcid":null},"institutions":[{"id":"https://openalex.org/I98251732","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29","country_code":"CA","type":"education","lineage":["https://openalex.org/I98251732"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Christopher Mak","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079326512","display_name":"Ali Emadi","orcid":"https://orcid.org/0000-0002-0676-1455"},"institutions":[{"id":"https://openalex.org/I98251732","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29","country_code":"CA","type":"education","lineage":["https://openalex.org/I98251732"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Ali Emadi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada","Department of Mechanical Engineering, McMaster University, Hamilton, Canada"],"raw_orcid":"https://orcid.org/0000-0002-0676-1455","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]},{"raw_affiliation_string":"Department of Mechanical Engineering, McMaster University, Hamilton, Canada","institution_ids":["https://openalex.org/I98251732"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":7.8049,"has_fulltext":true,"cited_by_count":184,"citation_normalized_percentile":{"value":0.98081913,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":99,"max":100},"biblio":{"volume":"8","issue":null,"first_page":"160126","last_page":"160144"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.8001476526260376},{"id":"https://openalex.org/keywords/packaging-engineering","display_name":"Packaging engineering","score":0.7037815451622009},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6169367432594299},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.5850041508674622},{"id":"https://openalex.org/keywords/automotive-electronics","display_name":"Automotive electronics","score":0.5693387389183044},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.5391223430633545},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.5263378024101257},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.50876384973526},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46285736560821533},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.4548710584640503},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4192194938659668},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.34774452447891235},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.3441625237464905},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3381759524345398},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24756169319152832},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.22800925374031067}],"concepts":[{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.8001476526260376},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.7037815451622009},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6169367432594299},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.5850041508674622},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.5693387389183044},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.5391223430633545},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5263378024101257},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.50876384973526},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46285736560821533},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.4548710584640503},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4192194938659668},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.34774452447891235},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.3441625237464905},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3381759524345398},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24756169319152832},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.22800925374031067},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2020.3019775","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.3019775","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09178734.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:f4be7a9dfea444d7bc4cb82c1a5f0298","is_oa":true,"landing_page_url":"https://doaj.org/article/f4be7a9dfea444d7bc4cb82c1a5f0298","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 8, Pp 160126-160144 (2020)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2020.3019775","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.3019775","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09178734.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.4399999976158142,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320334593","display_name":"Natural Sciences and Engineering Research Council of Canada","ror":"https://ror.org/01h531d29"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3081517420.pdf","grobid_xml":"https://content.openalex.org/works/W3081517420.grobid-xml"},"referenced_works_count":99,"referenced_works":["https://openalex.org/W560918766","https://openalex.org/W818661354","https://openalex.org/W1534243973","https://openalex.org/W1541335467","https://openalex.org/W1858232793","https://openalex.org/W1932616309","https://openalex.org/W1937467532","https://openalex.org/W1941602568","https://openalex.org/W1989240672","https://openalex.org/W1998289922","https://openalex.org/W2001428875","https://openalex.org/W2001932198","https://openalex.org/W2015241962","https://openalex.org/W2016884330","https://openalex.org/W2027596703","https://openalex.org/W2029705043","https://openalex.org/W2033378582","https://openalex.org/W2034659924","https://openalex.org/W2037897769","https://openalex.org/W2049000331","https://openalex.org/W2051518405","https://openalex.org/W2055896144","https://openalex.org/W2057299720","https://openalex.org/W2070483026","https://openalex.org/W2088921215","https://openalex.org/W2094598466","https://openalex.org/W2101801985","https://openalex.org/W2118489830","https://openalex.org/W2128414885","https://openalex.org/W2142281912","https://openalex.org/W2146113912","https://openalex.org/W2150705456","https://openalex.org/W2156505933","https://openalex.org/W2205668906","https://openalex.org/W2207453330","https://openalex.org/W2259626724","https://openalex.org/W2299429764","https://openalex.org/W2302040766","https://openalex.org/W2310785440","https://openalex.org/W2321065846","https://openalex.org/W2460534603","https://openalex.org/W2470344446","https://openalex.org/W2496880119","https://openalex.org/W2509632154","https://openalex.org/W2515788423","https://openalex.org/W2527700123","https://openalex.org/W2547051482","https://openalex.org/W2548896158","https://openalex.org/W2560628255","https://openalex.org/W2563846847","https://openalex.org/W2566068610","https://openalex.org/W2568457598","https://openalex.org/W2581620852","https://openalex.org/W2583036532","https://openalex.org/W2587941812","https://openalex.org/W2588218422","https://openalex.org/W2603776286","https://openalex.org/W2621336430","https://openalex.org/W2730537456","https://openalex.org/W2742169393","https://openalex.org/W2742905059","https://openalex.org/W2749008579","https://openalex.org/W2751764739","https://openalex.org/W2765994353","https://openalex.org/W2770927465","https://openalex.org/W2790324144","https://openalex.org/W2795329333","https://openalex.org/W2798305110","https://openalex.org/W2804292292","https://openalex.org/W2805741478","https://openalex.org/W2807881291","https://openalex.org/W2810821733","https://openalex.org/W2829421759","https://openalex.org/W2830467510","https://openalex.org/W2885647923","https://openalex.org/W2898904198","https://openalex.org/W2910218467","https://openalex.org/W2911688936","https://openalex.org/W2912946484","https://openalex.org/W2921847563","https://openalex.org/W2968940501","https://openalex.org/W2975322657","https://openalex.org/W2980339641","https://openalex.org/W2984801429","https://openalex.org/W3032903960","https://openalex.org/W3037255125","https://openalex.org/W3046796098","https://openalex.org/W3148644021","https://openalex.org/W3217540447","https://openalex.org/W6632023275","https://openalex.org/W6632488167","https://openalex.org/W6639206922","https://openalex.org/W6687819112","https://openalex.org/W6697428731","https://openalex.org/W6729002747","https://openalex.org/W6730546654","https://openalex.org/W6731480122","https://openalex.org/W6781457937","https://openalex.org/W6949662245"],"related_works":["https://openalex.org/W1556285067","https://openalex.org/W2135371070","https://openalex.org/W2357903062","https://openalex.org/W2070619027","https://openalex.org/W4234117135","https://openalex.org/W3162917068","https://openalex.org/W2099438907","https://openalex.org/W4213307373","https://openalex.org/W2788051635","https://openalex.org/W4243266941"],"abstract_inverted_index":{"Semiconductor":[0],"power":[1,7,33,97],"modules":[2,98,111],"are":[3,66,80,106,139,154],"core":[4],"components":[5],"of":[6,30,40,47,63,94,109,151],"electronics":[8],"in":[9,115],"electrified":[10],"vehicles.":[11,117],"Packaging":[12],"technology":[13,49],"often":[14],"has":[15],"a":[16,27,59,161],"critical":[17],"impact":[18],"on":[19,83],"module":[20,34,64],"performance":[21,164],"and":[22,58,77,91,102,136,149,156],"reliability.":[23],"This":[24],"paper":[25,42],"presents":[26],"comprehensive":[28],"review":[29],"the":[31,44,52,55,84,119,122],"automotive":[32,96,145],"packaging":[35,48,65,70,86],"technologies.":[36,171],"The":[37,147],"first":[38],"part":[39],"this":[41],"discusses":[43],"driving":[45],"factors":[46],"development.":[50],"In":[51,118],"second":[53],"section,":[54],"design":[56,61],"considerations":[57],"primary":[60],"process":[62],"summarized.":[67],"Besides,":[68],"major":[69,100],"components,":[71],"such":[72],"as":[73,141],"semiconductor":[74],"dies,":[75],"substrates,":[76],"die":[78],"bonding,":[79],"introduced":[81],"based":[82],"conventional":[85],"structure.":[87],"Next,":[88],"technical":[89],"details":[90],"innovative":[92],"features":[93],"state-of-the-art":[95],"from":[99],"suppliers":[101],"original":[103],"equipment":[104],"manufacturers":[105],"reviewed.":[107],"Most":[108],"these":[110,152],"have":[112],"been":[113],"applied":[114],"commercial":[116],"fourth":[120],"part,":[121],"system":[123],"integration":[124],"concept,":[125],"printed":[126],"circuit":[127],"board":[128],"embedded":[129],"packaging,":[130,132,135],"three-dimensional":[131],"press":[133],"pack":[134],"advanced":[137],"materials":[138],"categorized":[140],"promising":[142],"trends":[143,153],"for":[144],"applications.":[146],"advantages":[148],"drawbacks":[150],"discussed,":[155],"it":[157],"is":[158],"concluded":[159],"that":[160],"preferable":[162],"overall":[163],"could":[165],"be":[166],"achieved":[167],"by":[168],"combining":[169],"multiple":[170]},"counts_by_year":[{"year":2026,"cited_by_count":15},{"year":2025,"cited_by_count":55},{"year":2024,"cited_by_count":39},{"year":2023,"cited_by_count":33},{"year":2022,"cited_by_count":27},{"year":2021,"cited_by_count":15}],"updated_date":"2026-06-13T07:54:00.901334","created_date":"2025-10-10T00:00:00"}