{"id":"https://openalex.org/W3023288222","doi":"https://doi.org/10.1109/access.2020.2990501","title":"An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor Components","display_name":"An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor Components","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3023288222","doi":"https://doi.org/10.1109/access.2020.2990501","mag":"3023288222"},"language":"en","primary_location":{"id":"doi:10.1109/access.2020.2990501","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2990501","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09078740.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09078740.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101483101","display_name":"Yu-Min Fu","orcid":"https://orcid.org/0000-0002-2684-8072"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Yu-Min Fu","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-2684-8072","affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022773345","display_name":"Meng-Chuin Chou","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Meng-Chuin Chou","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-4088-8302","affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070305247","display_name":"Che-Hao Kang","orcid":"https://orcid.org/0000-0003-3517-6973"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Che-Hao Kang","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0003-3517-6973","affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101834213","display_name":"Yu\u2010Ting Cheng","orcid":"https://orcid.org/0000-0003-1191-8979"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Ting Cheng","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0003-1191-8979","affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101796376","display_name":"Pu\u2010Wei Wu","orcid":"https://orcid.org/0000-0002-0861-9911"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pu-Wei Wu","raw_affiliation_strings":["Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-0861-9911","affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100783379","display_name":"Guan\u2010Yu Chen","orcid":"https://orcid.org/0000-0002-3443-7943"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Guan-Yu Chen","raw_affiliation_strings":["Department of Biomedical Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-3443-7943","affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026067338","display_name":"Ethan B. Secor","orcid":"https://orcid.org/0000-0003-2324-1686"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ethan B. Secor","raw_affiliation_strings":["Department of Materials Science and Engineering, Northwestern University, Evanston, USA"],"raw_orcid":"https://orcid.org/0000-0003-2324-1686","affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, Northwestern University, Evanston, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020649130","display_name":"Mark C. Hersam","orcid":"https://orcid.org/0000-0003-4120-1426"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark C. Hersam","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Northwestern University, Evanston, USA","Department of Materials Science and Engineering, Northwestern University, Evanston, USA"],"raw_orcid":"https://orcid.org/0000-0003-4120-1426","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Northwestern University, Evanston, USA","institution_ids":["https://openalex.org/I111979921"]},{"raw_affiliation_string":"Department of Materials Science and Engineering, Northwestern University, Evanston, USA","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5101483101"],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.4885,"has_fulltext":true,"cited_by_count":7,"citation_normalized_percentile":{"value":0.56636367,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"8","issue":null,"first_page":"79338","last_page":"79346"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9939000010490417,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12627","display_name":"Graphene and Nanomaterials Applications","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/graphene","display_name":"Graphene","score":0.8710528612136841},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8424385190010071},{"id":"https://openalex.org/keywords/microfabrication","display_name":"Microfabrication","score":0.6642683744430542},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.6501729488372803},{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.6125423312187195},{"id":"https://openalex.org/keywords/polydimethylsiloxane","display_name":"Polydimethylsiloxane","score":0.49722030758857727},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.45377686619758606},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.44086840748786926},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4200570285320282},{"id":"https://openalex.org/keywords/micropatterning","display_name":"Micropatterning","score":0.4145657420158386},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.3507941961288452},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.33194929361343384},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.23742586374282837}],"concepts":[{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.8710528612136841},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8424385190010071},{"id":"https://openalex.org/C527607","wikidata":"https://www.wikidata.org/wiki/Q175538","display_name":"Microfabrication","level":4,"score":0.6642683744430542},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.6501729488372803},{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.6125423312187195},{"id":"https://openalex.org/C2779849746","wikidata":"https://www.wikidata.org/wiki/Q411955","display_name":"Polydimethylsiloxane","level":2,"score":0.49722030758857727},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.45377686619758606},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.44086840748786926},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4200570285320282},{"id":"https://openalex.org/C2859760","wikidata":"https://www.wikidata.org/wiki/Q6839807","display_name":"Micropatterning","level":2,"score":0.4145657420158386},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.3507941961288452},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.33194929361343384},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.23742586374282837},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2020.2990501","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2990501","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09078740.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:c8d6feb88d2a4370b8319ea6c286193e","is_oa":true,"landing_page_url":"https://doaj.org/article/c8d6feb88d2a4370b8319ea6c286193e","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 8, Pp 79338-79346 (2020)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2020.2990501","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2990501","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/09078740.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2922171469","display_name":null,"funder_award_id":"FA8650-15-","funder_id":"https://openalex.org/F4320338294","funder_display_name":"Air Force Research Laboratory"},{"id":"https://openalex.org/G298583090","display_name":null,"funder_award_id":"FA8650-15-2-5518","funder_id":"https://openalex.org/F4320338294","funder_display_name":"Air Force Research Laboratory"},{"id":"https://openalex.org/G5904171386","display_name":null,"funder_award_id":"MOST 108-2633-B-009-001","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"},{"id":"https://openalex.org/G723893407","display_name":null,"funder_award_id":"MOST 108-2321-B-009-007-MY2","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"},{"id":"https://openalex.org/G8736245220","display_name":null,"funder_award_id":"108-2221-E-009-003-MY2","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"},{"id":"https://openalex.org/G97242376","display_name":null,"funder_award_id":"MOST 109-2639-E-009-001","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"},{"id":"https://openalex.org/F4320323443","display_name":"National Chiao Tung University","ror":"https://ror.org/00se2k293"},{"id":"https://openalex.org/F4320338294","display_name":"Air Force Research Laboratory","ror":"https://ror.org/02e2egq70"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3023288222.pdf","grobid_xml":"https://content.openalex.org/works/W3023288222.grobid-xml"},"referenced_works_count":43,"referenced_works":["https://openalex.org/W76008554","https://openalex.org/W1505492670","https://openalex.org/W1510390429","https://openalex.org/W1967494093","https://openalex.org/W1976156302","https://openalex.org/W1976780894","https://openalex.org/W1983295489","https://openalex.org/W1985388560","https://openalex.org/W1990314543","https://openalex.org/W1992576502","https://openalex.org/W2000129545","https://openalex.org/W2002552547","https://openalex.org/W2010722037","https://openalex.org/W2014694192","https://openalex.org/W2022758665","https://openalex.org/W2025025292","https://openalex.org/W2071027495","https://openalex.org/W2079320605","https://openalex.org/W2082897264","https://openalex.org/W2084289697","https://openalex.org/W2085336918","https://openalex.org/W2087083173","https://openalex.org/W2092188263","https://openalex.org/W2094585121","https://openalex.org/W2113824756","https://openalex.org/W2125816206","https://openalex.org/W2141484758","https://openalex.org/W2146564548","https://openalex.org/W2158757477","https://openalex.org/W2160672537","https://openalex.org/W2257870988","https://openalex.org/W2281858351","https://openalex.org/W2283359012","https://openalex.org/W2521220820","https://openalex.org/W2522689323","https://openalex.org/W2533008382","https://openalex.org/W2593758551","https://openalex.org/W2593992900","https://openalex.org/W2784363986","https://openalex.org/W2798341923","https://openalex.org/W2883439437","https://openalex.org/W2883941732","https://openalex.org/W2969443314"],"related_works":["https://openalex.org/W2638393866","https://openalex.org/W2060870204","https://openalex.org/W4297921203","https://openalex.org/W2058238342","https://openalex.org/W2182584067","https://openalex.org/W1973153989","https://openalex.org/W2056759656","https://openalex.org/W2765232669","https://openalex.org/W2045498586","https://openalex.org/W2013803968"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,33,83,149],"versatile":[4],"and":[5,16,30,58,71,78,103,114,132,134,137],"precise":[6],"graphene":[7,56,100,105],"patterning":[8],"technique":[9,62,144],"using":[10,32],"the":[11,27,97,123],"combined":[12],"process":[13,130],"of":[14,55,87,99,125,140,151],"masking":[15,34],"inkjet":[17,53,141],"printing.":[18],"A":[19],"graphene-based":[20,67],"structure":[21],"is":[22],"fabricated":[23],"by":[24,52],"first":[25],"defining":[26],"structural":[28],"pattern":[29],"position":[31],"mold,":[35],"which":[36],"can":[37,63,95],"be":[38],"either":[39],"electroplated":[40],"copper":[41],"or":[42],"deep":[43],"reactive":[44],"ion":[45],"etching":[46],"(DRIE)":[47],"silicon":[48],"shadow":[49],"mask,":[50],"followed":[51],"deposition":[54],"ink":[57],"lift-off.":[59],"The":[60],"hybrid":[61],"realize":[64],"high-fidelity,":[65],"high-resolution":[66],"microstructures":[68],"including":[69],"free-standing":[70],"cantilever":[72],"beams,":[73],"four-point":[74],"resistive":[75],"measurement":[76],"structures,":[77],"piezoresistive":[79],"sensing":[80],"elements":[81],"with":[82],"minimum":[84],"line":[85],"width":[86],"$\\sim":[88],"20~\\mu":[89],"\\text{m}$":[90],".":[91],"Moreover,":[92],"this":[93,143],"method":[94],"facilitate":[96],"micropatterning":[98],"oxide":[101,106],"(GO)":[102],"reduced":[104],"(rGO)":[107],"on":[108],"substrates":[109],"such":[110],"as":[111],"polydimethylsiloxane":[112],"(PDMS)":[113],"SiO2/Si":[115],"for":[116,148],"selective":[117],"cell":[118],"culturing":[119],"applications.":[120,153],"Owing":[121],"to":[122],"characteristics":[124],"low":[126,129],"chemical":[127],"usage,":[128],"temperature":[131],"complexity,":[133],"high":[135],"flexibility":[136],"fault":[138],"tolerance":[139],"printing,":[142],"demonstrates":[145],"compelling":[146],"potential":[147],"variety":[150],"biomedical":[152]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}