{"id":"https://openalex.org/W2999735491","doi":"https://doi.org/10.1109/access.2020.2966520","title":"Hybrid Feature Selection for Wafer Acceptance Test Parameters in Semiconductor Manufacturing","display_name":"Hybrid Feature Selection for Wafer Acceptance Test Parameters in Semiconductor Manufacturing","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W2999735491","doi":"https://doi.org/10.1109/access.2020.2966520","mag":"2999735491"},"language":"en","primary_location":{"id":"doi:10.1109/access.2020.2966520","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2966520","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/08959151.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/08959151.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053751333","display_name":"Hongwei Xu","orcid":"https://orcid.org/0000-0003-4220-5154"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Hongwei Xu","raw_affiliation_strings":["College of Mechanical Engineering, Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"College of Mechanical Engineering, Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100436775","display_name":"Jie Zhang","orcid":"https://orcid.org/0000-0002-6215-0237"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Zhang","raw_affiliation_strings":["College of Mechanical Engineering, Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"College of Mechanical Engineering, Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056025791","display_name":"Youlong Lv","orcid":"https://orcid.org/0000-0001-7201-8603"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Youlong Lv","raw_affiliation_strings":["College of Mechanical Engineering, Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"College of Mechanical Engineering, Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020008724","display_name":"Peng Zheng","orcid":"https://orcid.org/0000-0001-8208-4057"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Zheng","raw_affiliation_strings":["School of Mechanical Engineering, Institute of Intelligent Manufacturing and Information Engineering, Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Institute of Intelligent Manufacturing and Information Engineering, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5053751333"],"corresponding_institution_ids":["https://openalex.org/I181326427"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":4.1011,"has_fulltext":true,"cited_by_count":38,"citation_normalized_percentile":{"value":0.94200284,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"8","issue":null,"first_page":"17320","last_page":"17330"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9861000180244446,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9700000286102295,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.6650711894035339},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6188229322433472},{"id":"https://openalex.org/keywords/minimum-redundancy-feature-selection","display_name":"Minimum redundancy feature selection","score":0.5793167352676392},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5767624378204346},{"id":"https://openalex.org/keywords/feature-selection","display_name":"Feature selection","score":0.5146056413650513},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4654427766799927},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.4392244219779968},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.42281484603881836},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3837626278400421},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21270215511322021}],"concepts":[{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.6650711894035339},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6188229322433472},{"id":"https://openalex.org/C16811321","wikidata":"https://www.wikidata.org/wiki/Q17138905","display_name":"Minimum redundancy feature selection","level":3,"score":0.5793167352676392},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5767624378204346},{"id":"https://openalex.org/C148483581","wikidata":"https://www.wikidata.org/wiki/Q446488","display_name":"Feature selection","level":2,"score":0.5146056413650513},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4654427766799927},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.4392244219779968},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.42281484603881836},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3837626278400421},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21270215511322021},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2020.2966520","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2966520","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/08959151.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:4b3a78d95c9a4a5bbc3c02d064e0a1f8","is_oa":true,"landing_page_url":"https://doaj.org/article/4b3a78d95c9a4a5bbc3c02d064e0a1f8","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 8, Pp 17320-17330 (2020)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2020.2966520","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2020.2966520","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8948470/08959151.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G7537576970","display_name":null,"funder_award_id":"2018M641890","funder_id":"https://openalex.org/F4320321543","funder_display_name":"China Postdoctoral Science Foundation"},{"id":"https://openalex.org/G8399998424","display_name":null,"funder_award_id":"51435009","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320311776","display_name":"Commercial Aircraft of China","ror":"https://ror.org/05gxmms51"},{"id":"https://openalex.org/F4320317145","display_name":"National Engineering and Research Center for Commercial Aircraft Manufacturing","ror":null},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321543","display_name":"China Postdoctoral Science Foundation","ror":"https://ror.org/0426zh255"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2999735491.pdf","grobid_xml":"https://content.openalex.org/works/W2999735491.grobid-xml"},"referenced_works_count":31,"referenced_works":["https://openalex.org/W1597240684","https://openalex.org/W2012452609","https://openalex.org/W2020355555","https://openalex.org/W2021909223","https://openalex.org/W2044855549","https://openalex.org/W2154053567","https://openalex.org/W2186937468","https://openalex.org/W2282289695","https://openalex.org/W2320942828","https://openalex.org/W2401537403","https://openalex.org/W2413370544","https://openalex.org/W2438698564","https://openalex.org/W2476849799","https://openalex.org/W2554724315","https://openalex.org/W2594052357","https://openalex.org/W2595481439","https://openalex.org/W2617959447","https://openalex.org/W2755267339","https://openalex.org/W2765907903","https://openalex.org/W2768260451","https://openalex.org/W2781476508","https://openalex.org/W2783094354","https://openalex.org/W2791471386","https://openalex.org/W2796977285","https://openalex.org/W2801752756","https://openalex.org/W2900772550","https://openalex.org/W2903805501","https://openalex.org/W2913856343","https://openalex.org/W2914671974","https://openalex.org/W3147280420","https://openalex.org/W4242090204"],"related_works":["https://openalex.org/W3120617324","https://openalex.org/W2156571267","https://openalex.org/W2998727463","https://openalex.org/W1838735596","https://openalex.org/W2350815964","https://openalex.org/W2805829984","https://openalex.org/W4388573469","https://openalex.org/W3036204000","https://openalex.org/W3135058836","https://openalex.org/W2747166117"],"abstract_inverted_index":{"Wafer":[0],"acceptance":[1],"test":[2],"(WAT)":[3],"is":[4,65,77,106,118,130,171],"a":[5,60,155],"key":[6,69,157],"process":[7,211],"of":[8,20,24,29,79,128,177,191,197,212,231],"semiconductor":[9],"manufacturing.":[10],"The":[11,108,173,185],"collected":[12],"testing":[13,219],"parameters":[14,34,71,180],"can":[15],"be":[16],"used":[17,131,226],"in":[18],"identification":[19,159],"wafer":[21,48,73,115,186],"defects,":[22],"improvement":[23],"product":[25],"yield,":[26],"and":[27,42,53,85,113,145,166,175,194,222],"control":[28],"production":[30],"costs.":[31],"However,":[32],"WAT":[33,70],"regularly":[35],"have":[36],"characteristics":[37],"such":[38],"as":[39,203],"high":[40],"dimensions":[41],"strong":[43],"redundancy,":[44],"which":[45],"prevent":[46],"the":[47,91,114,123,126,134,141,192,195,198,204,209,213,229],"yield":[49,116,187],"from":[50],"accurate":[51],"prediction":[52,188],"effective":[54],"improvement.":[55],"To":[56],"overcome":[57],"these":[58],"shortcomings,":[59],"hybrid":[61],"feature":[62,147],"selection":[63,84,210],"method":[64,76],"proposed":[66,233],"to":[67,132,139,207,227],"identify":[68],"influencing":[72],"yields.":[74],"This":[75],"composed":[78],"two":[80],"stages,":[81],"i.e.":[82],"filter":[83,89],"wrapper":[86,153],"selection.":[87],"In":[88,152,216],"selection,":[90,154],"minimum":[92,142],"Redundancy":[93],"Maximum":[94],"Relevance":[95],"(mRMR)":[96],"filtering":[97],"parameter":[98,112,138,158],"pre-screening":[99],"criterion":[100,127],"based":[101,161],"on":[102,162],"mutual":[103],"information":[104],"(MI)":[105],"proposed.":[107],"relevance":[109],"between":[110,136],"each":[111,137],"value":[117,190],"calculated":[119],"by":[120,183],"MI.":[121],"At":[122],"same":[124],"time,":[125],"MI":[129],"measure":[133],"redundancy":[135,143],"select":[140],"parameters,":[144],"reduce":[146],"size":[148],"for":[149],"further":[150],"searches.":[151],"wrapped":[156],"model":[160],"genetic":[163],"algorithm":[164],"(GA)":[165],"deep":[167],"belief":[168],"network":[169],"(DBN)":[170],"designed.":[172],"coding":[174],"optimization":[176],"candidate":[178],"input":[179],"are":[181,201,225],"realized":[182],"GA.":[184],"error":[189],"DBN":[193],"weight":[196],"selected":[199],"features":[200],"solved":[202],"fitness":[205],"function":[206],"realize":[208],"combined":[214],"parameters.":[215],"experiment,":[217],"both":[218],"data":[220,224],"sets":[221],"industrial":[223],"demonstrate":[228],"efficiency":[230],"this":[232],"method.":[234]},"counts_by_year":[{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":7},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}