{"id":"https://openalex.org/W2971312518","doi":"https://doi.org/10.1109/access.2019.2937636","title":"Detection and Characterization Method for Interface Bonding Defects of New Composite Materials","display_name":"Detection and Characterization Method for Interface Bonding Defects of New Composite Materials","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W2971312518","doi":"https://doi.org/10.1109/access.2019.2937636","mag":"2971312518"},"language":"en","primary_location":{"id":"doi:10.1109/access.2019.2937636","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2937636","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08813064.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08813064.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020982041","display_name":"Yintang Wen","orcid":"https://orcid.org/0009-0001-8909-612X"},"institutions":[{"id":"https://openalex.org/I39333907","display_name":"Yanshan University","ror":"https://ror.org/02txfnf15","country_code":"CN","type":"education","lineage":["https://openalex.org/I39333907"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yintang Wen","raw_affiliation_strings":["Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China","institution_ids":["https://openalex.org/I39333907"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100366559","display_name":"Song Zhang","orcid":"https://orcid.org/0000-0003-2047-3991"},"institutions":[{"id":"https://openalex.org/I39333907","display_name":"Yanshan University","ror":"https://ror.org/02txfnf15","country_code":"CN","type":"education","lineage":["https://openalex.org/I39333907"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Song Zhang","raw_affiliation_strings":["Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China","institution_ids":["https://openalex.org/I39333907"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100741683","display_name":"Yuyan Zhang","orcid":"https://orcid.org/0000-0002-6062-6668"},"institutions":[{"id":"https://openalex.org/I39333907","display_name":"Yanshan University","ror":"https://ror.org/02txfnf15","country_code":"CN","type":"education","lineage":["https://openalex.org/I39333907"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuyan Zhang","raw_affiliation_strings":["Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of Measuring and Testing Technologies and Instrumentation of Hebei Province, Yanshan University, Qinhuangdao, China","institution_ids":["https://openalex.org/I39333907"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5020982041"],"corresponding_institution_ids":["https://openalex.org/I39333907"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.3612,"has_fulltext":true,"cited_by_count":4,"citation_normalized_percentile":{"value":0.56651685,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"7","issue":null,"first_page":"134330","last_page":"134337"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12386","display_name":"Advanced X-ray and CT Imaging","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.7670519351959229},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.741790771484375},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6033351421356201},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.571829617023468},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5267851948738098},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4754371643066406},{"id":"https://openalex.org/keywords/segmentation","display_name":"Segmentation","score":0.43066638708114624},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4261133372783661},{"id":"https://openalex.org/keywords/matrix","display_name":"Matrix (chemical analysis)","score":0.41496044397354126},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.4143627882003784},{"id":"https://openalex.org/keywords/fuzzy-logic","display_name":"Fuzzy logic","score":0.41077566146850586},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3872496485710144},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.17041659355163574},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.0783596932888031}],"concepts":[{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.7670519351959229},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.741790771484375},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6033351421356201},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.571829617023468},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5267851948738098},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4754371643066406},{"id":"https://openalex.org/C89600930","wikidata":"https://www.wikidata.org/wiki/Q1423946","display_name":"Segmentation","level":2,"score":0.43066638708114624},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4261133372783661},{"id":"https://openalex.org/C106487976","wikidata":"https://www.wikidata.org/wiki/Q685816","display_name":"Matrix (chemical analysis)","level":2,"score":0.41496044397354126},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.4143627882003784},{"id":"https://openalex.org/C58166","wikidata":"https://www.wikidata.org/wiki/Q224821","display_name":"Fuzzy logic","level":2,"score":0.41077566146850586},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3872496485710144},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.17041659355163574},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0783596932888031},{"id":"https://openalex.org/C28413391","wikidata":"https://www.wikidata.org/wiki/Q785542","display_name":"Capillary number","level":3,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C196806460","wikidata":"https://www.wikidata.org/wiki/Q188603","display_name":"Capillary action","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2019.2937636","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2937636","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08813064.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:7f3bef38aaf14505b3a265c62b766171","is_oa":true,"landing_page_url":"https://doaj.org/article/7f3bef38aaf14505b3a265c62b766171","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 7, Pp 134330-134337 (2019)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2019.2937636","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2937636","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08813064.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2995540892","display_name":null,"funder_award_id":"E2017203240","funder_id":"https://openalex.org/F4320322163","funder_display_name":"Natural Science Foundation of Hebei Province"}],"funders":[{"id":"https://openalex.org/F4320322163","display_name":"Natural Science Foundation of Hebei Province","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2971312518.pdf","grobid_xml":"https://content.openalex.org/works/W2971312518.grobid-xml"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W78906906","https://openalex.org/W315845051","https://openalex.org/W618059485","https://openalex.org/W1017500853","https://openalex.org/W1974969716","https://openalex.org/W1976132088","https://openalex.org/W1976869977","https://openalex.org/W1978965462","https://openalex.org/W1988105415","https://openalex.org/W2006476492","https://openalex.org/W2016727280","https://openalex.org/W2026462585","https://openalex.org/W2056912831","https://openalex.org/W2078251098","https://openalex.org/W2133205863","https://openalex.org/W2495966615","https://openalex.org/W2504850843","https://openalex.org/W2550713413","https://openalex.org/W2611505653","https://openalex.org/W2737925915","https://openalex.org/W2765287370","https://openalex.org/W2773229455","https://openalex.org/W2802791989","https://openalex.org/W2805780363","https://openalex.org/W2901540305","https://openalex.org/W2919886848","https://openalex.org/W2920025840","https://openalex.org/W2956089136","https://openalex.org/W2960742722","https://openalex.org/W6723898482"],"related_works":["https://openalex.org/W3107994849","https://openalex.org/W4247143848","https://openalex.org/W2009883749","https://openalex.org/W2735573198","https://openalex.org/W29442446","https://openalex.org/W330727063","https://openalex.org/W2896904446","https://openalex.org/W1483407203","https://openalex.org/W4206825956","https://openalex.org/W651098627"],"abstract_inverted_index":{"The":[0,99],"defects":[1,85,129],"such":[2],"as":[3],"voids":[4,87],"and":[5,14,67,77,88,93,123],"debonding":[6,89],"within":[7,114],"the":[8,12,15,18,22,50,71,83,104,109,118,141],"bonding":[9,41,111,127],"interface":[10,126],"between":[11],"composite":[13,131],"substrate":[16],"are":[17,46],"key":[19],"factors":[20],"affecting":[21],"safe":[23],"use":[24],"of":[25,40,64,86,108,120,125,130,144],"materials.":[26],"In":[27],"this":[28],"study,":[29],"Industrial":[30],"Computed":[31],"Tomography":[32],"(ICT)":[33],"was":[34],"used":[35],"to":[36,48],"perform":[37],"non-destructive":[38],"tests":[39],"defects.":[42,51],"High-precision":[43],"characterization":[44,124],"methods":[45],"required":[47],"quantify":[49],"This":[52,133],"paper":[53],"proposes":[54],"an":[55],"improved":[56],"image":[57],"segmentation":[58],"processing":[59],"method":[60,73],"for":[61,140],"accurate":[62,121],"extraction":[63],"defect":[65,105],"edges":[66],"quantitative":[68,97],"characterization.":[69],"With":[70],"proposed":[72],"combining":[74],"mathematical":[75],"morphology":[76],"Fuzzy":[78],"C-Means":[79],"(FCM)":[80],"threshold":[81],"segmentation,":[82],"irregular":[84],"can":[90],"be":[91],"visualized":[92],"established":[94],"with":[95],"corresponding":[96],"indicators.":[98],"experimental":[100],"results":[101],"show":[102],"that":[103],"area":[106],"error":[107],"tested":[110],"layer":[112,128],"is":[113],"\u00b16%,":[115],"which":[116],"satisfies":[117],"requirements":[119],"detection":[122],"components.":[132],"work":[134],"provides":[135],"a":[136],"strong":[137],"technical":[138],"basis":[139],"reliability":[142],"assessment":[143],"new":[145],"ceramic":[146],"matrix":[147],"composites":[148],"(CMCs)":[149],"bonded":[150],"structural":[151],"members.":[152]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}