{"id":"https://openalex.org/W2959358690","doi":"https://doi.org/10.1109/access.2019.2927231","title":"An Improved 4H-SiC Trench MOS Barrier Schottky Diode With Lower On-Resistance","display_name":"An Improved 4H-SiC Trench MOS Barrier Schottky Diode With Lower On-Resistance","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W2959358690","doi":"https://doi.org/10.1109/access.2019.2927231","mag":"2959358690"},"language":"en","primary_location":{"id":"doi:10.1109/access.2019.2927231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2927231","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2019.2927231","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083961268","display_name":"Fei Cao","orcid":"https://orcid.org/0000-0001-8089-3416"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Fei Cao","raw_affiliation_strings":["The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China"],"raw_orcid":"https://orcid.org/0000-0001-8089-3416","affiliations":[{"raw_affiliation_string":"The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China","institution_ids":["https://openalex.org/I50760025"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084364398","display_name":"Meng-Tian Bao","orcid":"https://orcid.org/0000-0002-9866-0546"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Meng-tian Bao","raw_affiliation_strings":["The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China","institution_ids":["https://openalex.org/I50760025"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111572804","display_name":"Xue Wu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xue Wu","raw_affiliation_strings":["National Key Laboratory of Analog Integrated Circuits, Chongqin, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Analog Integrated Circuits, Chongqin, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010709242","display_name":"Wenju Wang","orcid":"https://orcid.org/0000-0001-7166-7986"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wen-Ju Wang","raw_affiliation_strings":["The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China","institution_ids":["https://openalex.org/I50760025"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039982278","display_name":"Chenghao Yu","orcid":"https://orcid.org/0000-0002-2542-944X"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cheng-Hao Yu","raw_affiliation_strings":["The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China","institution_ids":["https://openalex.org/I50760025"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5014105999","display_name":"Ying Wang","orcid":"https://orcid.org/0000-0002-1123-369X"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ying Wang","raw_affiliation_strings":["The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China","institution_ids":["https://openalex.org/I50760025"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5083961268"],"corresponding_institution_ids":["https://openalex.org/I50760025"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.3632,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.60955388,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"7","issue":null,"first_page":"95710","last_page":"95715"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9912999868392944,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/schottky-diode","display_name":"Schottky diode","score":0.7353546023368835},{"id":"https://openalex.org/keywords/jfet","display_name":"JFET","score":0.633537769317627},{"id":"https://openalex.org/keywords/breakdown-voltage","display_name":"Breakdown voltage","score":0.618807852268219},{"id":"https://openalex.org/keywords/schottky-barrier","display_name":"Schottky barrier","score":0.5438985228538513},{"id":"https://openalex.org/keywords/doping","display_name":"Doping","score":0.5425233840942383},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5141944885253906},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.488917738199234},{"id":"https://openalex.org/keywords/silicon-carbide","display_name":"Silicon carbide","score":0.44510412216186523},{"id":"https://openalex.org/keywords/electromagnetic-shielding","display_name":"Electromagnetic shielding","score":0.4272291660308838},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.42508378624916077},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4059341549873352},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.35465043783187866},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.35080984234809875},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32219019532203674},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.2958976924419403},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2042636275291443},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.125174880027771},{"id":"https://openalex.org/keywords/field-effect-transistor","display_name":"Field-effect transistor","score":0.1048397421836853},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.07969611883163452}],"concepts":[{"id":"https://openalex.org/C205200001","wikidata":"https://www.wikidata.org/wiki/Q176066","display_name":"Schottky diode","level":3,"score":0.7353546023368835},{"id":"https://openalex.org/C2778484494","wikidata":"https://www.wikidata.org/wiki/Q385520","display_name":"JFET","level":5,"score":0.633537769317627},{"id":"https://openalex.org/C119321828","wikidata":"https://www.wikidata.org/wiki/Q1267190","display_name":"Breakdown voltage","level":3,"score":0.618807852268219},{"id":"https://openalex.org/C16115445","wikidata":"https://www.wikidata.org/wiki/Q2391942","display_name":"Schottky barrier","level":3,"score":0.5438985228538513},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.5425233840942383},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5141944885253906},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.488917738199234},{"id":"https://openalex.org/C2780722187","wikidata":"https://www.wikidata.org/wiki/Q412356","display_name":"Silicon carbide","level":2,"score":0.44510412216186523},{"id":"https://openalex.org/C2265751","wikidata":"https://www.wikidata.org/wiki/Q332007","display_name":"Electromagnetic shielding","level":2,"score":0.4272291660308838},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.42508378624916077},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4059341549873352},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.35465043783187866},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.35080984234809875},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32219019532203674},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.2958976924419403},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2042636275291443},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.125174880027771},{"id":"https://openalex.org/C145598152","wikidata":"https://www.wikidata.org/wiki/Q176097","display_name":"Field-effect transistor","level":4,"score":0.1048397421836853},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.07969611883163452},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2019.2927231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2927231","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:5c058f6c8cf74229934b4b2fff7d048d","is_oa":true,"landing_page_url":"https://doaj.org/article/5c058f6c8cf74229934b4b2fff7d048d","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 7, Pp 95710-95715 (2019)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2019.2927231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2927231","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/6","score":0.4000000059604645,"display_name":"Clean water and sanitation"}],"awards":[{"id":"https://openalex.org/G2854811542","display_name":null,"funder_award_id":"61774052","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W267840210","https://openalex.org/W638260495","https://openalex.org/W1903325952","https://openalex.org/W1943095388","https://openalex.org/W1966714478","https://openalex.org/W1982186785","https://openalex.org/W1988781510","https://openalex.org/W2004715253","https://openalex.org/W2025938650","https://openalex.org/W2057436559","https://openalex.org/W2081584674","https://openalex.org/W2085804909","https://openalex.org/W2106498551","https://openalex.org/W2110336605","https://openalex.org/W2118176520","https://openalex.org/W2127407240","https://openalex.org/W2131457834","https://openalex.org/W2610520098","https://openalex.org/W2768392800","https://openalex.org/W2892142656","https://openalex.org/W2951050599","https://openalex.org/W3103426457","https://openalex.org/W6640568179","https://openalex.org/W6664959474"],"related_works":["https://openalex.org/W1881751082","https://openalex.org/W2247644913","https://openalex.org/W2538770235","https://openalex.org/W2034525911","https://openalex.org/W2147656057","https://openalex.org/W2153584619","https://openalex.org/W3045794768","https://openalex.org/W1540585561","https://openalex.org/W1981646027","https://openalex.org/W2917180890"],"abstract_inverted_index":{"An":[0],"improved":[1,132,158],"4H-SiC":[2],"trench":[3,45],"MOS":[4],"barrier":[5],"Schottky":[6],"(TMBS)":[7],"structure":[8,112,133],"that":[9,58],"can":[10,69,155],"significantly":[11,73],"reduce":[12],"the":[13,28,38,44,48,52,60,75,93,110,117,124,131,139,143],"specific":[14],"on-resistance":[15],"(R":[16],"<sub":[17,84,145,151],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[18,85,146,152],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">on,sp</sub>":[19,86,147,153],")":[20,154],"is":[21,35,55],"proposed":[22,49,111],"in":[23,47],"this":[24],"paper.":[25],"Compared":[26],"with":[27,138],"conventional":[29,140],"TMBS":[30],"structure,":[31,50],"an":[32],"N-type":[33],"region":[34,41,103],"added":[36],"around":[37],"P+":[39],"shielding":[40],"and":[42,51,66,96,105,127,148,161],"along":[43],"sidewall":[46],"doping":[53,107],"concentration":[54],"higher":[56],"than":[57],"of":[59,109,130],"drift":[61],"region.":[62],"The":[63,99],"JFET":[64],"resistance,":[65],"spread":[67],"resistance":[68],"both":[70],"be":[71,156],"reduced":[72],"during":[74],"forward":[76],"bias":[77],"to":[78],"produce":[79],"a":[80,122],"much":[81],"lower":[82],"R":[83,144],",":[87],"which":[88],"have":[89],"been":[90],"verified":[91],"through":[92],"numeric":[94],"simulations":[95],"modeling":[97],"analysis.":[98],"critical":[100],"parameters":[101],"(N-type":[102],"width":[104],"its":[106],"concentration)":[108],"are":[113],"mainly":[114],"optimized":[115],"by":[116,159],"ATLAS":[118],"simulation":[119],"tool.":[120],"As":[121],"result,":[123],"breakdown":[125],"voltage":[126],"leakage":[128],"current":[129],"remain":[134],"basically":[135],"unchanged":[136],"compared":[137],"TMBS.":[141],"However,":[142],"FoM":[149],"(BV2/R":[150],"effectively":[157],"41.9%":[160],"70.9%,":[162],"respectively.":[163]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
