{"id":"https://openalex.org/W2952977418","doi":"https://doi.org/10.1109/access.2019.2922975","title":"Techniques for Addressing Saddle Points in the Response Surface Methodology (RSM)","display_name":"Techniques for Addressing Saddle Points in the Response Surface Methodology (RSM)","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W2952977418","doi":"https://doi.org/10.1109/access.2019.2922975","mag":"2952977418"},"language":"en","primary_location":{"id":"doi:10.1109/access.2019.2922975","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2922975","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08736803.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08736803.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047511897","display_name":"Kheong Sann Chan","orcid":"https://orcid.org/0000-0002-6835-3895"},"institutions":[{"id":"https://openalex.org/I2799736854","display_name":"Nanjing Institute of Technology","ror":"https://ror.org/00n6txq60","country_code":"CN","type":"education","lineage":["https://openalex.org/I2799736854"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Kheong Sann Chan","raw_affiliation_strings":["Nanjing Institute of Technology, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Nanjing Institute of Technology, Nanjing, China","institution_ids":["https://openalex.org/I2799736854"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068956172","display_name":"Simon John Greaves","orcid":"https://orcid.org/0000-0002-9227-0600"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Simon J. Greaves","raw_affiliation_strings":["Research Institute of Electrical Communication, Tohoku University, Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Research Institute of Electrical Communication, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054558832","display_name":"Susanto Rahardja","orcid":"https://orcid.org/0000-0003-0831-6934"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Susanto Rahardja","raw_affiliation_strings":["School of Marine Science and Technology, Northwestern Polytechnical University, Xi\u2019an, China","School of Marine Science and Technology, Northwestern Polytechnical University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"School of Marine Science and Technology, Northwestern Polytechnical University, Xi\u2019an, China","institution_ids":["https://openalex.org/I17145004"]},{"raw_affiliation_string":"School of Marine Science and Technology, Northwestern Polytechnical University, Xi'an, China","institution_ids":["https://openalex.org/I17145004"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5047511897"],"corresponding_institution_ids":["https://openalex.org/I2799736854"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.4461,"has_fulltext":true,"cited_by_count":17,"citation_normalized_percentile":{"value":0.80648944,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":"7","issue":null,"first_page":"85613","last_page":"85621"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9897000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9761000275611877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6663837432861328},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6389940977096558},{"id":"https://openalex.org/keywords/response-surface-methodology","display_name":"Response surface methodology","score":0.6258963942527771},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5482401251792908},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.460290789604187},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.22937166690826416},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.1437186300754547},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12843531370162964},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.11177456378936768},{"id":"https://openalex.org/keywords/nuclear-magnetic-resonance","display_name":"Nuclear magnetic resonance","score":0.08965307474136353}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6663837432861328},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6389940977096558},{"id":"https://openalex.org/C150077022","wikidata":"https://www.wikidata.org/wiki/Q3136137","display_name":"Response surface methodology","level":2,"score":0.6258963942527771},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5482401251792908},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.460290789604187},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22937166690826416},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.1437186300754547},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12843531370162964},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.11177456378936768},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.08965307474136353},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2019.2922975","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2922975","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08736803.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:ade749abce96433aa40a3e8a1ba75512","is_oa":true,"landing_page_url":"https://doaj.org/article/ade749abce96433aa40a3e8a1ba75512","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 7, Pp 85613-85621 (2019)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2019.2922975","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2922975","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08736803.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2952977418.pdf","grobid_xml":"https://content.openalex.org/works/W2952977418.grobid-xml"},"referenced_works_count":19,"referenced_works":["https://openalex.org/W1923722","https://openalex.org/W54660896","https://openalex.org/W1672510814","https://openalex.org/W1972623370","https://openalex.org/W2000836282","https://openalex.org/W2042826631","https://openalex.org/W2044566963","https://openalex.org/W2126312990","https://openalex.org/W2137142464","https://openalex.org/W2163668118","https://openalex.org/W2171153116","https://openalex.org/W2342904641","https://openalex.org/W2404007804","https://openalex.org/W2523051309","https://openalex.org/W2625869391","https://openalex.org/W2753549390","https://openalex.org/W2789253593","https://openalex.org/W2801614130","https://openalex.org/W4242186041"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W4241625287"],"abstract_inverted_index":{"Industrial":[0],"systems":[1],"have":[2,28],"multiple":[3,114],"parameters":[4,40,70,145],"that":[5,16,175],"control":[6,39],"the":[7,33,38,47,54,64,68,84,89,95,104,108,132,141,144,154,158,165,172,179],"processes":[8],"and":[9,94,101,168],"one":[10,17,82,128],"or":[11,22,99],"more":[12],"output":[13],"performance":[14],"metrics":[15],"would":[18],"like":[19],"to":[20,36,66,87,106,146,170],"maximize":[21],"minimize.":[23],"The":[24,79,122],"design-of-experiment":[25],"(DoE)":[26],"techniques":[27,166],"been":[29],"proposed,":[30],"which":[31],"allows":[32],"system":[34],"designers":[35],"optimize":[37,67],"with":[41],"a":[42,72],"reasonable":[43],"number":[44],"of":[45,56,83,91,119,124,134,138,143,150,157],"experiments,":[46],"response":[48],"surface":[49],"methodology":[50],"(RSM)":[51],"being":[52],"among":[53],"primary":[55],"such":[57],"techniques.":[58],"In":[59,160],"this":[60,148,161],"paper,":[61,162],"we":[62,163],"use":[63],"RSM":[65],"design":[69],"in":[71,127],"multi-layer":[73,96],"microwave-assisted":[74],"magnetic":[75,92],"recording":[76,93,109,115],"(MAMR)":[77],"medium.":[78],"MAMR":[80,97],"is":[81,137,149],"technologies":[85],"proposed":[86],"extend":[88],"life":[90],"(ML-MAMR)":[98],"3D-MAMR,":[100],"it":[102],"has":[103],"potential":[105],"increase":[107],"densities":[110],"further":[111],"by":[112],"stacking":[113],"layers":[116],"on":[117],"top":[118],"each":[120],"other.":[121],"danger":[123],"overwriting":[125],"information":[126],"layer,":[129,136],"when":[130],"targeting":[131],"writing":[133],"another":[135],"concern;":[139],"hence,":[140],"optimization":[142],"minimize":[147],"paramount":[151],"importance":[152],"for":[153],"successful":[155],"implementation":[156],"3D-MAMR.":[159],"report":[164],"tried":[167],"used":[169],"overcome":[171],"saddle":[173],"points":[174],"were":[176],"encountered":[177],"during":[178],"DoE.":[180]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2}],"updated_date":"2026-02-28T09:26:25.869077","created_date":"2025-10-10T00:00:00"}