{"id":"https://openalex.org/W2923899293","doi":"https://doi.org/10.1109/access.2019.2904654","title":"Water-Resistant Smartphone Technologies","display_name":"Water-Resistant Smartphone Technologies","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W2923899293","doi":"https://doi.org/10.1109/access.2019.2904654","mag":"2923899293"},"language":"en","primary_location":{"id":"doi:10.1109/access.2019.2904654","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2904654","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08671469.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08671469.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014211453","display_name":"Quanqing Yu","orcid":"https://orcid.org/0000-0003-1146-5340"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]},{"id":"https://openalex.org/I4210156197","display_name":"Life Cycle Engineering (United States)","ror":"https://ror.org/056hm0802","country_code":"US","type":"company","lineage":["https://openalex.org/I4210156197"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Quanqing Yu","raw_affiliation_strings":["Center for Advanced Life Cycle Engineering, University of Maryland at College Park, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Center for Advanced Life Cycle Engineering, University of Maryland at College Park, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132","https://openalex.org/I4210156197"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041924424","display_name":"Rui Xiong","orcid":"https://orcid.org/0000-0003-4608-7597"},"institutions":[{"id":"https://openalex.org/I125839683","display_name":"Beijing Institute of Technology","ror":"https://ror.org/01skt4w74","country_code":"CN","type":"education","lineage":["https://openalex.org/I125839683","https://openalex.org/I890469752"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Rui Xiong","raw_affiliation_strings":["National Engineering Laboratory for Electric Vehicles, Beijing Institute of Technology, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Engineering Laboratory for Electric Vehicles, Beijing Institute of Technology, Beijing, China","institution_ids":["https://openalex.org/I125839683"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100404427","display_name":"Chuan Li","orcid":"https://orcid.org/0000-0003-0004-1497"},"institutions":[{"id":"https://openalex.org/I145581781","display_name":"Chongqing Technology and Business University","ror":"https://ror.org/05hqf1284","country_code":"CN","type":"education","lineage":["https://openalex.org/I145581781"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chuan Li","raw_affiliation_strings":["National Research Base of Intelligent Manufacturing Service, Chongqing Technology and Business University, Chongqing, China"],"affiliations":[{"raw_affiliation_string":"National Research Base of Intelligent Manufacturing Service, Chongqing Technology and Business University, Chongqing, China","institution_ids":["https://openalex.org/I145581781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013287421","display_name":"Michael Pecht","orcid":"https://orcid.org/0000-0003-1126-8662"},"institutions":[{"id":"https://openalex.org/I4210156197","display_name":"Life Cycle Engineering (United States)","ror":"https://ror.org/056hm0802","country_code":"US","type":"company","lineage":["https://openalex.org/I4210156197"]},{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael G. Pecht","raw_affiliation_strings":["Center for Advanced Life Cycle Engineering, University of Maryland at College Park, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Center for Advanced Life Cycle Engineering, University of Maryland at College Park, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132","https://openalex.org/I4210156197"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5014211453"],"corresponding_institution_ids":["https://openalex.org/I4210156197","https://openalex.org/I66946132"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.4307,"has_fulltext":false,"cited_by_count":29,"citation_normalized_percentile":{"value":0.81891905,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"7","issue":null,"first_page":"42757","last_page":"42773"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10986","display_name":"RFID technology advancements","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9786999821662903,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/warranty","display_name":"Warranty","score":0.875718355178833},{"id":"https://openalex.org/keywords/gasket","display_name":"Gasket","score":0.4820433557033539},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.4558925926685333},{"id":"https://openalex.org/keywords/commission","display_name":"Commission","score":0.4161986708641052},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37439996004104614},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22272175550460815}],"concepts":[{"id":"https://openalex.org/C2779056723","wikidata":"https://www.wikidata.org/wiki/Q329717","display_name":"Warranty","level":2,"score":0.875718355178833},{"id":"https://openalex.org/C128421294","wikidata":"https://www.wikidata.org/wiki/Q1132541","display_name":"Gasket","level":2,"score":0.4820433557033539},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.4558925926685333},{"id":"https://openalex.org/C2776034101","wikidata":"https://www.wikidata.org/wiki/Q1509347","display_name":"Commission","level":2,"score":0.4161986708641052},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37439996004104614},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22272175550460815},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2019.2904654","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2904654","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08671469.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:bebbd0ecca6e4a1bbb9fbd6a1fe5b408","is_oa":true,"landing_page_url":"https://doaj.org/article/bebbd0ecca6e4a1bbb9fbd6a1fe5b408","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 7, Pp 42757-42773 (2019)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2019.2904654","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2019.2904654","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/8600701/08671469.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.4399999976158142,"id":"https://metadata.un.org/sdg/6","display_name":"Clean water and sanitation"}],"awards":[{"id":"https://openalex.org/G7630465253","display_name":null,"funder_award_id":"2018YFB0104100","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"}],"funders":[{"id":"https://openalex.org/F4320311057","display_name":"Center for Advanced Life Cycle Engineering","ror":"https://ror.org/047s2c258"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2923899293.pdf","grobid_xml":"https://content.openalex.org/works/W2923899293.grobid-xml"},"referenced_works_count":4,"referenced_works":["https://openalex.org/W272672763","https://openalex.org/W2050857452","https://openalex.org/W2668177578","https://openalex.org/W2791032415"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2261968709","https://openalex.org/W1963941882","https://openalex.org/W1995324141","https://openalex.org/W2347657670","https://openalex.org/W2095015958","https://openalex.org/W1991477449","https://openalex.org/W3197725777"],"abstract_inverted_index":{"Smartphone":[0],"manufacturers":[1],"have":[2],"begun":[3],"to":[4,10,47,74],"market":[5,12],"their":[6,49],"products":[7],"as":[8,25],"water-resistant":[9,89,100],"gain":[11],"share.":[13],"However,":[14],"many":[15,26],"consumers":[16],"report":[17],"that":[18],"these":[19],"smartphones":[20,50,59,101],"are":[21,45,102,122,127],"not":[22,35],"actually":[23],"waterproof":[24],"of":[27,78,99,106,108],"the":[28,38,76,109,114],"advertisements":[29],"suggest,":[30],"and":[31,66,81,84,91,125],"water":[32,52],"damage":[33],"is":[34],"included":[36],"in":[37,104],"warranty":[39],"policy.":[40],"To":[41],"understand":[42],"how":[43],"companies":[44],"attempting":[46],"protect":[48],"against":[51],"damage,":[53],"this":[54],"paper":[55],"evaluates":[56],"three":[57],"popular":[58],"(iPhone":[60],"7":[61],"Plus,":[62],"Samsung":[63],"S7":[64],"Edge,":[65],"Huawei":[67],"P9":[68],"Lite).":[69],"The":[70],"phones":[71],"were":[72],"disassembled":[73],"assess":[75],"use":[77],"gaskets,":[79],"glues,":[80],"other":[82],"adhesives":[83],"emerging":[85],"high-end":[86],"technologies":[87],"including":[88],"coatings":[90],"breathable":[92],"fabric":[93],"membranes.":[94],"In":[95],"addition,":[96],"failure":[97],"causes":[98],"discussed":[103],"terms":[105],"limitations":[107],"ingress":[110],"protection":[111],"tests":[112],"within":[113],"International":[115],"Electrotechnical":[116],"Commission":[117],"60529":[118],"standard.":[119],"Warranty":[120],"issues":[121],"then":[123],"presented":[124],"recommendations":[126],"given.":[128]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}