{"id":"https://openalex.org/W2892333054","doi":"https://doi.org/10.1109/access.2018.2869017","title":"Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB","display_name":"Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB","publication_year":2018,"publication_date":"2018-01-01","ids":{"openalex":"https://openalex.org/W2892333054","doi":"https://doi.org/10.1109/access.2018.2869017","mag":"2892333054"},"language":"en","primary_location":{"id":"doi:10.1109/access.2018.2869017","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2869017","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","datacite","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2018.2869017","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5059247327","display_name":"Mahdi Soltani","orcid":"https://orcid.org/0000-0002-9493-7704"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mahdi Soltani","raw_affiliation_strings":["Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany"],"raw_orcid":"https://orcid.org/0000-0002-9493-7704","affiliations":[{"raw_affiliation_string":"Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088803774","display_name":"Moritz Freyburger","orcid":null},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Moritz Freyburger","raw_affiliation_strings":["Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001312457","display_name":"Romit Kulkarni","orcid":"https://orcid.org/0000-0001-7594-4207"},"institutions":[{"id":"https://openalex.org/I4210119362","display_name":"Hahn-Schickard-Gesellschaft f\u00fcr angewandte Forschung","ror":"https://ror.org/02reezy47","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210119362"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Romit Kulkarni","raw_affiliation_strings":["Hahn-Schickard, Stuttgart, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hahn-Schickard, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210119362"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070162333","display_name":"R. Mohr","orcid":null},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Rainer Mohr","raw_affiliation_strings":["Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081104828","display_name":"Tobias Groezinger","orcid":"https://orcid.org/0000-0002-1826-3592"},"institutions":[{"id":"https://openalex.org/I4210119362","display_name":"Hahn-Schickard-Gesellschaft f\u00fcr angewandte Forschung","ror":"https://ror.org/02reezy47","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210119362"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tobias Groezinger","raw_affiliation_strings":["Hahn-Schickard, Stuttgart, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hahn-Schickard, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210119362"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091750497","display_name":"Andr\u00e9 Zimmermann","orcid":"https://orcid.org/0000-0003-1824-9376"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andre Zimmermann","raw_affiliation_strings":["Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Micro Integration, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.435,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.83123251,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"6","issue":null,"first_page":"51669","last_page":"51679"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/light-emitting-diode","display_name":"Light-emitting diode","score":0.8300034999847412},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6253547668457031},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6161879897117615},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.5264419317245483},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5000545978546143},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.4677842855453491},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.46041303873062134},{"id":"https://openalex.org/keywords/solid-state-lighting","display_name":"Solid-state lighting","score":0.42670580744743347},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40193721652030945},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.3340703248977661},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2627298831939697},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.26217055320739746},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25375211238861084},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2370574176311493}],"concepts":[{"id":"https://openalex.org/C176666156","wikidata":"https://www.wikidata.org/wiki/Q25504","display_name":"Light-emitting diode","level":2,"score":0.8300034999847412},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6253547668457031},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6161879897117615},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.5264419317245483},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5000545978546143},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.4677842855453491},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.46041303873062134},{"id":"https://openalex.org/C61082081","wikidata":"https://www.wikidata.org/wiki/Q1370570","display_name":"Solid-state lighting","level":3,"score":0.42670580744743347},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40193721652030945},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.3340703248977661},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2627298831939697},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.26217055320739746},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25375211238861084},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2370574176311493},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/access.2018.2869017","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2869017","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:e37ad95c2d0341efb622c9eea1167b9f","is_oa":true,"landing_page_url":"https://doaj.org/article/e37ad95c2d0341efb622c9eea1167b9f","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 6, Pp 51669-51679 (2018)","raw_type":"article"},{"id":"pmh:oai:elib.uni-stuttgart.de:11682/11244","is_oa":true,"landing_page_url":"http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112446","pdf_url":null,"source":{"id":"https://openalex.org/S4306401556","display_name":"OPUS Publication Server of the University of Stuttgart (University of Stuttgart)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I100066346","host_organization_name":"University of Stuttgart","host_organization_lineage":["https://openalex.org/I100066346"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article"},{"id":"doi:10.18419/opus-11227","is_oa":true,"landing_page_url":"https://doi.org/10.18419/opus-11227","pdf_url":null,"source":{"id":"https://openalex.org/S7407052998","display_name":"Universit\u00e4tsbibliothek Stuttgart","issn_l":null,"issn":[],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":null,"raw_type":"Collection"}],"best_oa_location":{"id":"doi:10.1109/access.2018.2869017","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2869017","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320325850","display_name":"Universit\u00e4t Stuttgart","ror":"https://ror.org/04vnq7t77"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1487347259","https://openalex.org/W1972322692","https://openalex.org/W1975699451","https://openalex.org/W1983149712","https://openalex.org/W2011539370","https://openalex.org/W2041072610","https://openalex.org/W2067549689","https://openalex.org/W2092451631","https://openalex.org/W2096256139","https://openalex.org/W2134607678","https://openalex.org/W2136105791","https://openalex.org/W2139752984","https://openalex.org/W2149334484","https://openalex.org/W2151406039","https://openalex.org/W2152839995","https://openalex.org/W2168257502","https://openalex.org/W2188678634","https://openalex.org/W2222100596","https://openalex.org/W2325054724","https://openalex.org/W2504887638","https://openalex.org/W2520598575","https://openalex.org/W2552172458","https://openalex.org/W2766725516","https://openalex.org/W2802197112","https://openalex.org/W2900400477","https://openalex.org/W3159333077","https://openalex.org/W4254372166","https://openalex.org/W6674423132","https://openalex.org/W6701185346","https://openalex.org/W6756420345"],"related_works":["https://openalex.org/W2563520716","https://openalex.org/W1982196154","https://openalex.org/W2165995895","https://openalex.org/W4200173692","https://openalex.org/W4229673132","https://openalex.org/W2996357432","https://openalex.org/W2136509698","https://openalex.org/W2193909918","https://openalex.org/W4285152397","https://openalex.org/W3154285783"],"abstract_inverted_index":{"Light-emitting":[0],"diodes":[1],"(LEDs)":[2],"have":[3,45],"increasingly":[4,178],"replaced":[5],"conventional":[6,57],"lamps":[7],"in":[8,135,170],"the":[9,20,29,35,54,73,79,99,112,121,129,132,139,144,147,155,171,197,201,205,228,231,236,240,245,250,254,258,265,280,294],"fields":[10],"of":[11,50,56,82,89,102,123,131,141,149,196,204,222,230,239,244,249,257,286],"general":[12],"lighting":[13,113,180],"and":[14,34,43,63,72,164,182,200,218,226,248,292,301],"consumer":[15],"electronics.":[16],"In":[17,210],"addition":[18],"to":[19,28,97,104,111],"sharp":[21],"price":[22],"fall,":[23],"this":[24,90,150,160,211,213,223],"is":[25,260,298],"also":[26,46,108,299],"due":[27],"significantly":[30],"higher":[31],"energy":[32],"efficiency":[33],"smaller,":[36],"more":[37],"compact":[38],"design.":[39],"Recently,":[40],"their":[41],"robustness":[42],"reliability":[44,122,220],"reached":[47],"a":[48,216,261],"level":[49],"quality":[51],"that":[52],"surpasses":[53],"characteristics":[55],"light":[58],"sources":[59],"such":[60,67],"as":[61,68,125,127],"halogen":[62],"fluorescent":[64],"lamps.":[65],"Characteristics,":[66],"excellent":[69],"design":[70],"freedom":[71],"possibility":[74],"for":[75,188,192],"functional":[76],"integration,":[77],"highlight":[78],"main":[80],"qualities":[81],"molded":[83],"interconnect":[84],"devices":[85],"(MIDs).":[86],"The":[87,242],"use":[88],"technology":[91,134,161],"does":[92],"not":[93],"only":[94],"open":[95],"doors":[96],"extend":[98],"application":[100],"field":[101],"LEDs":[103,124,169],"new":[105],"products":[106],"but":[107],"presents":[109,215],"challenges":[110],"industry.":[114],"There":[115],"are":[116,183,207],"many":[117],"studies":[118],"dealing":[119],"with":[120,128],"well":[126],"usability":[130],"MID":[133,232,266],"different":[136,271],"fields.":[137],"But,":[138],"lack":[140],"experience":[142],"from":[143,162],"manufacturers":[145],"regarding":[146],"behavior":[148,203],"interesting":[151],"configuration":[152],"(LED/MID)":[153,225],"over":[154],"entire":[156],"life":[157],"cycle":[158],"prevents":[159],"establishing":[163],"consolidating":[165],"its":[166],"existence.":[167],"As":[168],"automotive":[172],"sector,":[173],"especially":[174],"within":[175],"headlamps,":[176],"assume":[177],"powerful":[179],"tasks":[181],"no":[184],"longer":[185],"used":[186],"exclusively":[187],"signal":[189],"transfer":[190],"or":[191],"displays,":[193],"thermal":[194,289],"properties":[195],"substrate":[198,233],"materials":[199],"thermo-mechanical":[202],"assembly":[206],"particularly":[208],"relevant.":[209],"context,":[212],"paper":[214],"deep":[217],"detailed":[219],"investigation":[221],"system":[224],"examines":[227],"influence":[229],"choice":[234],"on":[235,253,275],"long-term":[237],"performance":[238],"LED.":[241],"impact":[243],"forward":[246],"current":[247],"ambient":[251],"temperature":[252,256],"junction":[255],"LED":[259],"proven":[262],"fact.":[263],"Therefore,":[264],"effect":[267],"was":[268],"inspected":[269],"under":[270],"operating":[272],"conditions":[273],"based":[274],"infrared":[276],"thermography.":[277],"After":[278],"analyzing":[279],"occurred":[281],"failure":[282],"mechanisms,":[283],"by":[284],"means":[285],"X-ray":[287],"analysis,":[288],"transient":[290],"testing":[291],"microscopy,":[293],"resulting":[295],"lifetime":[296],"model":[297],"presented":[300],"discussed.":[302]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-01T08:55:40.977307","created_date":"2025-10-10T00:00:00"}