{"id":"https://openalex.org/W2806135850","doi":"https://doi.org/10.1109/access.2018.2842199","title":"Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moir\u00e9 Technique","display_name":"Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moir\u00e9 Technique","publication_year":2018,"publication_date":"2018-01-01","ids":{"openalex":"https://openalex.org/W2806135850","doi":"https://doi.org/10.1109/access.2018.2842199","mag":"2806135850"},"language":"en","primary_location":{"id":"doi:10.1109/access.2018.2842199","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2842199","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2018.2842199","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100700696","display_name":"Fulong Zhu","orcid":"https://orcid.org/0000-0002-0756-9051"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fulong Zhu","raw_affiliation_strings":["School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":"https://orcid.org/0000-0002-0756-9051","affiliations":[{"raw_affiliation_string":"School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109315724","display_name":"Xinxin Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xinxin Lin","raw_affiliation_strings":["School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101766670","display_name":"Wei Zhang","orcid":"https://orcid.org/0000-0002-6450-5724"},"institutions":[{"id":"https://openalex.org/I4210126203","display_name":"Hubei University of Automotive Technology","ror":"https://ror.org/039m95m06","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210126203"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Zhang","raw_affiliation_strings":["Department of Mechanical Engineering, Hubei University of Automotive Technology, Shiyan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Hubei University of Automotive Technology, Shiyan, China","institution_ids":["https://openalex.org/I4210126203"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066887582","display_name":"Jiajie Fan","orcid":"https://orcid.org/0000-0001-5400-737X"},"institutions":[{"id":"https://openalex.org/I163340411","display_name":"Hohai University","ror":"https://ror.org/01wd4xt90","country_code":"CN","type":"education","lineage":["https://openalex.org/I163340411"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiajie Fan","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Hohai University, Changzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Hohai University, Changzhou, China","institution_ids":["https://openalex.org/I163340411"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100319990","display_name":"Sheng Liu","orcid":"https://orcid.org/0000-0001-6033-078X"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Sheng Liu","raw_affiliation_strings":["School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.0,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.04980836,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"6","issue":null,"first_page":"33099","last_page":"33110"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.9237796068191528},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6547127962112427},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.49682214856147766},{"id":"https://openalex.org/keywords/flatness","display_name":"Flatness (cosmology)","score":0.4963589310646057},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4945313632488251},{"id":"https://openalex.org/keywords/shadow-mask","display_name":"Shadow mask","score":0.4945034682750702},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.426917165517807},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4123150110244751},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3314964771270752},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.2654356360435486},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1318473219871521}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.9237796068191528},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6547127962112427},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.49682214856147766},{"id":"https://openalex.org/C2778530986","wikidata":"https://www.wikidata.org/wiki/Q5457948","display_name":"Flatness (cosmology)","level":3,"score":0.4963589310646057},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4945313632488251},{"id":"https://openalex.org/C2776326872","wikidata":"https://www.wikidata.org/wiki/Q1192335","display_name":"Shadow mask","level":2,"score":0.4945034682750702},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.426917165517807},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4123150110244751},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3314964771270752},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2654356360435486},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1318473219871521},{"id":"https://openalex.org/C26405456","wikidata":"https://www.wikidata.org/wiki/Q338","display_name":"Cosmology","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2018.2842199","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2842199","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:6f83775604f5405796e2babe683e3a35","is_oa":true,"landing_page_url":"https://doaj.org/article/6f83775604f5405796e2babe683e3a35","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 6, Pp 33099-33110 (2018)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2018.2842199","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2018.2842199","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2262826897","display_name":null,"funder_award_id":"51675211","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320324856","display_name":"Southeast University","ror":"https://ror.org/04ct4d772"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":39,"referenced_works":["https://openalex.org/W69349949","https://openalex.org/W418442035","https://openalex.org/W585975565","https://openalex.org/W1599561640","https://openalex.org/W1973200137","https://openalex.org/W1977139688","https://openalex.org/W1981110736","https://openalex.org/W2000796760","https://openalex.org/W2001681564","https://openalex.org/W2009545425","https://openalex.org/W2029041194","https://openalex.org/W2034989919","https://openalex.org/W2046325683","https://openalex.org/W2067098895","https://openalex.org/W2070387537","https://openalex.org/W2084742457","https://openalex.org/W2086297014","https://openalex.org/W2086540848","https://openalex.org/W2091922217","https://openalex.org/W2111285689","https://openalex.org/W2114720982","https://openalex.org/W2137039559","https://openalex.org/W2137636839","https://openalex.org/W2143089665","https://openalex.org/W2146388386","https://openalex.org/W2148784363","https://openalex.org/W2151689591","https://openalex.org/W2151757917","https://openalex.org/W2161809066","https://openalex.org/W2163277966","https://openalex.org/W2170405595","https://openalex.org/W2181107352","https://openalex.org/W2182913591","https://openalex.org/W2481445051","https://openalex.org/W4232908003","https://openalex.org/W4234492595","https://openalex.org/W4237129380","https://openalex.org/W4238957398","https://openalex.org/W6644629064"],"related_works":["https://openalex.org/W2505001544","https://openalex.org/W2116752984","https://openalex.org/W1938201706","https://openalex.org/W2612219704","https://openalex.org/W2806135850","https://openalex.org/W2543820493","https://openalex.org/W2480841789","https://openalex.org/W4403420742","https://openalex.org/W2135371070","https://openalex.org/W4241952706"],"abstract_inverted_index":{"The":[0,122,146],"surface":[1,62,99],"quality":[2,63,100],"and":[3,64,83,98,117,137,154],"long-term":[4],"reliability":[5],"of":[6,16,28,66,73,104,131],"packaging":[7,11,35,68,74,107,133],"substrates":[8,75],"in":[9],"microelectronic":[10,67,106,132],"processes":[12],"have":[13],"become":[14],"subjects":[15],"increasing":[17],"concern":[18],"as":[19],"circuit":[20],"board":[21],"component":[22],"density":[23],"increases":[24],"while":[25],"the":[26,61,79,84,91,96,102,105,157],"pitches":[27],"these":[29],"components":[30],"decrease.":[31],"As":[32],"a":[33,49,55,135,138],"result,":[34],"substrate":[36],"morphology":[37,65,97,111],"inspection":[38],"is":[39],"becoming":[40],"more":[41],"crucial":[42],"than":[43],"ever":[44],"before.":[45],"This":[46],"paper":[47],"presents":[48],"noncontact":[50,80],"measurement":[51,81,112,118,123,147],"technology":[52],"based":[53],"on":[54],"shadow":[56],"moir\u00e9":[57],"technique":[58,93],"to":[59,94,150],"evaluate":[60],"substrates.":[69,108],"Fringe":[70],"pattern":[71],"images":[72,86],"are":[76,87],"acquired":[77],"through":[78],"technology,":[82],"resulting":[85],"then":[88],"analyzed":[89],"using":[90,127],"phase-shifting":[92],"determine":[95],"(specifically,":[101],"flatness)":[103],"A":[109],"full-field":[110],"system":[113,124,148],"with":[114],"adjustable":[115],"sensitivity":[116],"range":[119],"was":[120,125],"developed.":[121],"tested":[126],"three":[128],"typical":[129],"types":[130],"substrate,":[134],"coin":[136],"step":[139],"made":[140],"from":[141],"two":[142],"standard":[143],"gauge":[144],"blocks.":[145],"proved":[149],"be":[151],"both":[152],"feasible":[153],"effective":[155],"by":[156],"test":[158],"results.":[159]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}