{"id":"https://openalex.org/W2774370237","doi":"https://doi.org/10.1109/access.2017.2781249","title":"Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing","display_name":"Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing","publication_year":2017,"publication_date":"2017-12-08","ids":{"openalex":"https://openalex.org/W2774370237","doi":"https://doi.org/10.1109/access.2017.2781249","mag":"2774370237"},"language":"en","primary_location":{"id":"doi:10.1109/access.2017.2781249","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2017.2781249","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2017.2781249","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083852027","display_name":"Callum Bailey","orcid":null},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]},{"id":"https://openalex.org/I4401726811","display_name":"Hartford Financial Services (United States)","ror":"https://ror.org/00mwq1g96","country_code":null,"type":"company","lineage":["https://openalex.org/I4401726811"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Callum Bailey","raw_affiliation_strings":["United Technologies Research Center, East Hartford, CT, USA","W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"United Technologies Research Center, East Hartford, CT, USA","institution_ids":["https://openalex.org/I4401726811"]},{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110085554","display_name":"Efrain Aguilera","orcid":null},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]},{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Efrain Aguilera","raw_affiliation_strings":["Texas Instruments, Dallas, TX, USA","W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039259767","display_name":"David Espalin","orcid":"https://orcid.org/0000-0002-9975-8975"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Espalin","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084824657","display_name":"Jos\u00e9 Maur\u00edcio Santos Torres da Motta","orcid":"https://orcid.org/0000-0003-3970-4219"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jose Motta","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046585439","display_name":"Alfonso Fern\u00e1ndez","orcid":"https://orcid.org/0000-0001-6999-0776"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alfonso Fernandez","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090538148","display_name":"Mireya A. Perez","orcid":"https://orcid.org/0000-0003-2647-1655"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mireya A. Perez","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088753690","display_name":"Christopher M. DiBiasio","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Christopher Dibiasio","raw_affiliation_strings":["Draper Laboratory, Cambridge, MA, USA"],"affiliations":[{"raw_affiliation_string":"Draper Laboratory, Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065894654","display_name":"Dariusz R. Pryputniewicz","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dariusz Pryputniewicz","raw_affiliation_strings":["Draper Laboratory, Cambridge, MA, USA"],"affiliations":[{"raw_affiliation_string":"Draper Laboratory, Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009216243","display_name":"Eric MacDonald","orcid":"https://orcid.org/0000-0002-9356-1223"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]},{"id":"https://openalex.org/I161203489","display_name":"Youngstown State University","ror":"https://ror.org/038zf2n28","country_code":"US","type":"education","lineage":["https://openalex.org/I161203489"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric Macdonald","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA","Youngstown State University, Youngstown, OH, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation and the Department of Electrical and Computer Engineering, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"Youngstown State University, Youngstown, OH, USA","institution_ids":["https://openalex.org/I161203489"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076591183","display_name":"Ryan B. Wicker","orcid":"https://orcid.org/0000-0002-8761-7438"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ryan B. Wicker","raw_affiliation_strings":["W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA"],"affiliations":[{"raw_affiliation_string":"W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5083852027"],"corresponding_institution_ids":["https://openalex.org/I164936912","https://openalex.org/I4401726811"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":1.755,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.87070889,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"6","issue":null,"first_page":"1985","last_page":"1994"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9941999912261963,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9836000204086304,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6006674766540527},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5768527388572693},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5671510696411133},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5591908693313599},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5450610518455505},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5448676347732544},{"id":"https://openalex.org/keywords/usb","display_name":"USB","score":0.5381866693496704},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5138140320777893},{"id":"https://openalex.org/keywords/microcontroller","display_name":"Microcontroller","score":0.4344092905521393},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.43033531308174133},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.42609933018684387},{"id":"https://openalex.org/keywords/design-cycle","display_name":"Design cycle","score":0.4152304232120514},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.21773800253868103},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19999203085899353},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1765194833278656},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.14238464832305908},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.10425961017608643}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6006674766540527},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5768527388572693},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5671510696411133},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5591908693313599},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5450610518455505},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5448676347732544},{"id":"https://openalex.org/C507366226","wikidata":"https://www.wikidata.org/wiki/Q42378","display_name":"USB","level":3,"score":0.5381866693496704},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5138140320777893},{"id":"https://openalex.org/C173018170","wikidata":"https://www.wikidata.org/wiki/Q165678","display_name":"Microcontroller","level":2,"score":0.4344092905521393},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.43033531308174133},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.42609933018684387},{"id":"https://openalex.org/C2982740150","wikidata":"https://www.wikidata.org/wiki/Q5249230","display_name":"Design cycle","level":2,"score":0.4152304232120514},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.21773800253868103},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19999203085899353},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1765194833278656},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.14238464832305908},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.10425961017608643}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2017.2781249","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2017.2781249","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:9d5bb1ad58df4c1e8de93538c74dd3e8","is_oa":true,"landing_page_url":"https://doaj.org/article/9d5bb1ad58df4c1e8de93538c74dd3e8","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 6, Pp 1985-1994 (2018)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2017.2781249","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2017.2781249","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5400000214576721}],"awards":[{"id":"https://openalex.org/G1840164549","display_name":null,"funder_award_id":"FA8650-12-2-7230","funder_id":"https://openalex.org/F4320338294","funder_display_name":"Air Force Research Laboratory"}],"funders":[{"id":"https://openalex.org/F4320338294","display_name":"Air Force Research Laboratory","ror":"https://ror.org/02e2egq70"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1484204811","https://openalex.org/W1533271294","https://openalex.org/W1945113260","https://openalex.org/W1985334168","https://openalex.org/W2006441045","https://openalex.org/W2012606450","https://openalex.org/W2017581442","https://openalex.org/W2023792278","https://openalex.org/W2036931096","https://openalex.org/W2045279221","https://openalex.org/W2047947115","https://openalex.org/W2080574972","https://openalex.org/W2131196137","https://openalex.org/W2340946588","https://openalex.org/W2474167986","https://openalex.org/W2581175371","https://openalex.org/W2993377219","https://openalex.org/W3206142963","https://openalex.org/W6631866984","https://openalex.org/W6732488142","https://openalex.org/W6802632384","https://openalex.org/W6922646750"],"related_works":["https://openalex.org/W2188146187","https://openalex.org/W2036494154","https://openalex.org/W4372294755","https://openalex.org/W2379772394","https://openalex.org/W3015105709","https://openalex.org/W3123114176","https://openalex.org/W16482907","https://openalex.org/W2364791190","https://openalex.org/W2374335651","https://openalex.org/W2163019679"],"abstract_inverted_index":{"The":[0],"ability":[1],"to":[2,20,45,195,205],"access":[3],"individual":[4],"layers":[5],"of":[6,27,81,100,114,128,146,154],"a":[7,89,141,151,158,165,169,175,187],"part":[8],"as":[9,37,135,137],"they":[10],"are":[11],"being":[12],"printed":[13,39,161,209],"has":[14,43,59,63],"allowed":[15],"additive":[16],"manufacturing":[17],"(AM)":[18],"researchers":[19],"experiment":[21],"with":[22,33,74],"the":[23,112,129,155,211],"in":[24,56,66],"situ":[25],"placement":[26],"components,":[28],"thereby":[29],"creating":[30,51],"multi-process":[31,57,68,102,142],"parts":[32],"additional":[34],"functionality,":[35],"such":[36],"customized":[38],"electronics.":[40],"As":[41,150],"AM":[42,73],"evolved":[44],"become":[46],"an":[47,95],"established":[48],"method":[49],"for":[50,140],"end-use":[52],"parts,":[53],"this":[54,93],"interest":[55],"printing":[58,104],"increased.":[60],"Although":[61],"progress":[62],"been":[64],"made":[65],"developing":[67,87],"hardware,":[69],"which":[70,163],"can":[71],"combine":[72],"other":[75],"technologies,":[76],"holistic":[77],"design":[78,106,194,203],"software,":[79],"capable":[80,99,145],"readily":[82],"integrating":[83],"these":[84],"processes,":[85],"is":[86,109],"at":[88],"slower":[90],"rate.":[91],"In":[92],"paper,":[94],"integrated":[96],"software":[97],"solution":[98,124],"supporting":[101],"3D":[103,143,160],"from":[105,193],"through":[107],"manufacture":[108],"described,":[110],"featuring":[111],"integration":[113],"electronic":[115,133],"components":[116,134],"and":[117,174,208],"circuits":[118],"interconnected":[119,179],"by":[120,180],"copper":[121,182],"wires.":[122],"This":[123],"features":[125],"automated":[126,147],"generation":[127,139],"cavities":[130],"that":[131],"accommodate":[132],"well":[136],"toolpath":[138],"printer":[144],"wire":[148],"embedding.":[149],"case":[152],"study":[153],"developed":[156],"technology,":[157],"hexagonal":[159],"body,":[162],"included":[164],"microcontroller,":[166],"four":[167],"LEDs,":[168],"USB":[170],"connector,":[171],"two":[172],"resistors,":[173],"Zener":[176],"diode,":[177],"all":[178],"embedded":[181],"wires,":[183],"was":[184],"fabricated":[185,196],"within":[186,210],"short":[188],"cycle":[189,199],"time:":[190],"5.75":[191],"h":[192],"part.":[197],"Short":[198],"times":[200],"allow":[201],"multiple":[202],"iterations":[204],"be":[206],"realized":[207],"same":[212],"day.":[213]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":7},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}