{"id":"https://openalex.org/W2106399687","doi":"https://doi.org/10.1109/access.2015.2396474","title":"Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU","display_name":"Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU","publication_year":2015,"publication_date":"2015-01-01","ids":{"openalex":"https://openalex.org/W2106399687","doi":"https://doi.org/10.1109/access.2015.2396474","mag":"2106399687"},"language":"en","primary_location":{"id":"doi:10.1109/access.2015.2396474","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2015.2396474","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2015.2396474","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068403934","display_name":"Ryan Clarke","orcid":null},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ryan Clarke","raw_affiliation_strings":["Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103342202","display_name":"Philip Jacob","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Philip Jacob","raw_affiliation_strings":["IBM T. J. Watson Research Center, Yorktown Heights, NY, USA","IBM T. J. Watson Research Center, Yorktown Heights , NY, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T. J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T. J. Watson Research Center, Yorktown Heights , NY, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049647322","display_name":"Okan Erdogan","orcid":null},"institutions":[{"id":"https://openalex.org/I48912391","display_name":"Istanbul Technical University","ror":"https://ror.org/059636586","country_code":"TR","type":"education","lineage":["https://openalex.org/I48912391"]}],"countries":["TR"],"is_corresponding":false,"raw_author_name":"Okan Erdogan","raw_affiliation_strings":["National High Performance Center of Turkey, Istanbul Technical University, Istanbul, Turkey"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National High Performance Center of Turkey, Istanbul Technical University, Istanbul, Turkey","institution_ids":["https://openalex.org/I48912391"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037784685","display_name":"Paul Belemijian","orcid":null},"institutions":[{"id":"https://openalex.org/I1288214837","display_name":"United States Naval Research Laboratory","ror":"https://ror.org/04d23a975","country_code":"US","type":"facility","lineage":["https://openalex.org/I1288214837","https://openalex.org/I1330347796","https://openalex.org/I175003984","https://openalex.org/I3130687028"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul Belemijian","raw_affiliation_strings":["Naval Research Laboratory, Baltimore, MD, USA",", Naval Research Laboratory, Baltimore, MD, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Naval Research Laboratory, Baltimore, MD, USA","institution_ids":["https://openalex.org/I1288214837"]},{"raw_affiliation_string":", Naval Research Laboratory, Baltimore, MD, USA","institution_ids":["https://openalex.org/I1288214837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010706533","display_name":"Srikumar Raman","orcid":null},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Srikumar Raman","raw_affiliation_strings":["Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027729732","display_name":"Mitchell R. LeRoy","orcid":null},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mitchell R. Leroy","raw_affiliation_strings":["Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020619464","display_name":"Tuhin Guha Neogi","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tuhin Guha Neogi","raw_affiliation_strings":["GlobalFoundries, Malta, NY, USA",", GLOBALFOUNDRIES, Malta, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GlobalFoundries, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":", GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113702863","display_name":"Russell P. Kraft","orcid":null},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Russell P. Kraft","raw_affiliation_strings":["Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012623968","display_name":"Diana\u2010Andra Borca\u2010Tasciuc","orcid":"https://orcid.org/0000-0001-6520-1645"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Diana-Andra Borca-Tasciuc","raw_affiliation_strings":["Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA","[Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038903084","display_name":"J. F. McDonald","orcid":"https://orcid.org/0000-0003-1058-6845"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John F. McDonald","raw_affiliation_strings":["Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]},{"raw_affiliation_string":"[Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY, USA]","institution_ids":["https://openalex.org/I165799507"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5068403934"],"corresponding_institution_ids":["https://openalex.org/I165799507"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":0.4016,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.67650691,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"3","issue":null,"first_page":"43","last_page":"54"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7459944486618042},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.6510298848152161},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5346810817718506},{"id":"https://openalex.org/keywords/heat-spreader","display_name":"Heat spreader","score":0.5215535163879395},{"id":"https://openalex.org/keywords/bicmos","display_name":"BiCMOS","score":0.5037326216697693},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.48509132862091064},{"id":"https://openalex.org/keywords/heterojunction-bipolar-transistor","display_name":"Heterojunction bipolar transistor","score":0.48065340518951416},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4786199927330017},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4210900664329529},{"id":"https://openalex.org/keywords/diamond","display_name":"Diamond","score":0.4199938476085663},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38284537196159363},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.37780874967575073},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.3297908306121826},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18705233931541443},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.11199963092803955},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.10192430019378662},{"id":"https://openalex.org/keywords/bipolar-junction-transistor","display_name":"Bipolar junction transistor","score":0.09954923391342163},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09201797842979431}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7459944486618042},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.6510298848152161},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5346810817718506},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.5215535163879395},{"id":"https://openalex.org/C62427370","wikidata":"https://www.wikidata.org/wiki/Q173416","display_name":"BiCMOS","level":4,"score":0.5037326216697693},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.48509132862091064},{"id":"https://openalex.org/C173408217","wikidata":"https://www.wikidata.org/wiki/Q1428898","display_name":"Heterojunction bipolar transistor","level":5,"score":0.48065340518951416},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4786199927330017},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4210900664329529},{"id":"https://openalex.org/C2776921476","wikidata":"https://www.wikidata.org/wiki/Q5283","display_name":"Diamond","level":2,"score":0.4199938476085663},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38284537196159363},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.37780874967575073},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.3297908306121826},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18705233931541443},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.11199963092803955},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.10192430019378662},{"id":"https://openalex.org/C23061349","wikidata":"https://www.wikidata.org/wiki/Q188946","display_name":"Bipolar junction transistor","level":4,"score":0.09954923391342163},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09201797842979431},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/access.2015.2396474","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2015.2396474","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:0e37535f0afa4f08ab5422b299d0d98f","is_oa":true,"landing_page_url":"https://doaj.org/article/0e37535f0afa4f08ab5422b299d0d98f","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 3, Pp 43-54 (2015)","raw_type":"article"},{"id":"pmh:oai:polen.itu.edu.tr:11527/56984","is_oa":false,"landing_page_url":"https://hdl.handle.net/11527/56984","pdf_url":null,"source":{"id":"https://openalex.org/S4306400460","display_name":"Istanbul Technical University Academic Open Archive (Istanbul Technical University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I48912391","host_organization_name":"Istanbul Technical University","host_organization_lineage":["https://openalex.org/I48912391"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"}],"best_oa_location":{"id":"doi:10.1109/access.2015.2396474","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2015.2396474","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8500000238418579}],"awards":[{"id":"https://openalex.org/G7519355184","display_name":null,"funder_award_id":"1216354","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G7961020139","display_name":null,"funder_award_id":"HBCH3039004","funder_id":"https://openalex.org/F4320332180","funder_display_name":"Defense Advanced Research Projects Agency"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320309500","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94"},{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":36,"referenced_works":["https://openalex.org/W1498306018","https://openalex.org/W1661368752","https://openalex.org/W1662304383","https://openalex.org/W1870556774","https://openalex.org/W1965827571","https://openalex.org/W1974703790","https://openalex.org/W1986438129","https://openalex.org/W1994065680","https://openalex.org/W1994608866","https://openalex.org/W2032665264","https://openalex.org/W2040805158","https://openalex.org/W2046135507","https://openalex.org/W2047569150","https://openalex.org/W2050947087","https://openalex.org/W2094526852","https://openalex.org/W2095316396","https://openalex.org/W2108689740","https://openalex.org/W2110444864","https://openalex.org/W2111208920","https://openalex.org/W2121219842","https://openalex.org/W2121453093","https://openalex.org/W2144046036","https://openalex.org/W2145135695","https://openalex.org/W2150871235","https://openalex.org/W2154509365","https://openalex.org/W2158540919","https://openalex.org/W2159217072","https://openalex.org/W2162770311","https://openalex.org/W2483494823","https://openalex.org/W2504187118","https://openalex.org/W3155762550","https://openalex.org/W4210341450","https://openalex.org/W4230728857","https://openalex.org/W4247737288","https://openalex.org/W4254624278","https://openalex.org/W6722470246"],"related_works":["https://openalex.org/W1492027935","https://openalex.org/W2140183546","https://openalex.org/W1544173589","https://openalex.org/W2537721720","https://openalex.org/W2430182438","https://openalex.org/W1017676683","https://openalex.org/W4387933462","https://openalex.org/W2140681148","https://openalex.org/W1943862574","https://openalex.org/W2059344729"],"abstract_inverted_index":{"We":[0,41,70],"have":[1,50],"previously":[2],"evaluated":[3],"the":[4,17,38,43,63,80],"feasibility":[5,81],"of":[6,45,82],"a":[7,55,90],"serial":[8],"code":[9],"accelerator":[10],"core":[11,18,65],"with":[12,34],"3-D":[13,39,92],"DRAM":[14],"stacked":[15],"on":[16],"operating":[19,24],"at":[20,25],"high":[21,27,51],"frequencies.":[22],"While":[23],"such":[26],"frequencies":[28],"(>24":[29],"GHz),":[30],"there":[31],"are":[32],"concerns":[33],"removing":[35],"heat":[36,56,87],"from":[37],"stack.":[40,93],"propose":[42],"use":[44],"thin":[46],"diamond":[47,83],"sheets,":[48],"which":[49],"thermal":[52,73],"conductivity,":[53],"as":[54,84],"spreader":[57,88],"by":[58],"bonding":[59],"it":[60],"close":[61],"to":[62],"processor":[64],"substrate":[66],"and":[67],"memory":[68],"stacks.":[69],"show,":[71],"through":[72],"modeling":[74],"using":[75],"COMSOL":[76],"finite-element":[77],"analysis":[78],"tools,":[79],"an":[85],"effective":[86],"in":[89],"processor-memory":[91]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}