{"id":"https://openalex.org/W2045279221","doi":"https://doi.org/10.1109/access.2014.2311810","title":"3D Printing for the Rapid Prototyping of Structural Electronics","display_name":"3D Printing for the Rapid Prototyping of Structural Electronics","publication_year":2014,"publication_date":"2014-03-13","ids":{"openalex":"https://openalex.org/W2045279221","doi":"https://doi.org/10.1109/access.2014.2311810","mag":"2045279221"},"language":"en","primary_location":{"id":"doi:10.1109/access.2014.2311810","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2014.2311810","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6705689/06766751.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6705689/06766751.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009216243","display_name":"Eric MacDonald","orcid":"https://orcid.org/0000-0002-9356-1223"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric Macdonald","raw_affiliation_strings":["Department of Electrical Engineering, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072555805","display_name":"Rudy Salas","orcid":null},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rudy Salas","raw_affiliation_strings":["W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039259767","display_name":"David Espalin","orcid":"https://orcid.org/0000-0002-9975-8975"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Espalin","raw_affiliation_strings":["W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090538148","display_name":"Mireya A. Perez","orcid":"https://orcid.org/0000-0003-2647-1655"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mireya Perez","raw_affiliation_strings":["W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110085554","display_name":"Efrain Aguilera","orcid":null},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Efrain Aguilera","raw_affiliation_strings":["W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108621981","display_name":"Dan Muse","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dan Muse","raw_affiliation_strings":["Printed Device Concepts, Inc., El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Printed Device Concepts, Inc., El Paso, TX, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076591183","display_name":"Ryan B. Wicker","orcid":"https://orcid.org/0000-0002-8761-7438"},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ryan B. Wicker","raw_affiliation_strings":["Department of Mechanical Engineering, The University of Texas at El Paso, El Paso, TX, USA","W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, The University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]},{"raw_affiliation_string":"W. M. Keck Center for 3D Innovation, University of Texas at El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":45.1191,"has_fulltext":true,"cited_by_count":600,"citation_normalized_percentile":{"value":0.99930863,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":98,"max":100},"biblio":{"volume":"2","issue":null,"first_page":"234","last_page":"242"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9871000051498413,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9800999760627747,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6469739675521851},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6330580711364746},{"id":"https://openalex.org/keywords/fused-deposition-modeling","display_name":"Fused deposition modeling","score":0.628841757774353},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.6200578212738037},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.6038234829902649},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4594036638736725},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"Printed electronics","score":0.4461306035518646},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.44245535135269165},{"id":"https://openalex.org/keywords/virtual-prototyping","display_name":"Virtual prototyping","score":0.4267638921737671},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.41656509041786194},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4089997410774231},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.339890718460083},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2675092816352844},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.23506072163581848},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19957399368286133}],"concepts":[{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6469739675521851},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6330580711364746},{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.628841757774353},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.6200578212738037},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.6038234829902649},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4594036638736725},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.4461306035518646},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.44245535135269165},{"id":"https://openalex.org/C2780991453","wikidata":"https://www.wikidata.org/wiki/Q3408177","display_name":"Virtual prototyping","level":2,"score":0.4267638921737671},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.41656509041786194},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4089997410774231},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.339890718460083},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2675092816352844},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.23506072163581848},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19957399368286133},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/access.2014.2311810","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2014.2311810","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6705689/06766751.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:digitalcommons.utep.edu:elec_comp_papers-1114","is_oa":false,"landing_page_url":"https://ieeexplore.ieee.org/abstract/document/6766751/","pdf_url":null,"source":{"id":"https://openalex.org/S4377196403","display_name":"scholarworks - UTEP (The University of Texas at El Paso)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I164936912","host_organization_name":"The University of Texas at El Paso","host_organization_lineage":["https://openalex.org/I164936912"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Departmental Papers (E&C)","raw_type":"text"},{"id":"pmh:oai:doaj.org/article:7f3f624ae53449b8a1fcd0b9a7294356","is_oa":true,"landing_page_url":"https://doaj.org/article/7f3f624ae53449b8a1fcd0b9a7294356","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 2, Pp 234-242 (2014)","raw_type":"article"},{"id":"pmh:oai:scholarworks.utep.edu:elec_comp_papers-1114","is_oa":false,"landing_page_url":"https://scholarworks.utep.edu/elec_comp_papers/115","pdf_url":null,"source":{"id":"https://openalex.org/S4377196403","display_name":"scholarworks - UTEP (The University of Texas at El Paso)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I164936912","host_organization_name":"The University of Texas at El Paso","host_organization_lineage":["https://openalex.org/I164936912"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Departmental Papers (E&C)","raw_type":"text"}],"best_oa_location":{"id":"doi:10.1109/access.2014.2311810","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2014.2311810","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6705689/06766751.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.5199999809265137,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[{"id":"https://openalex.org/G4078255104","display_name":"THE CAPABILITY TO BE ADDRESSED IS RELATED TO THE ENHANCED ADDITIVE MANUFACTURING (AM POPULARLY REFERRED TO AS 3D PRINTING)TECHNOLOGY FOR RAPID PROTOT","funder_award_id":"NNX13AR17A","funder_id":"https://openalex.org/F4320306101","funder_display_name":"National Aeronautics and Space Administration"}],"funders":[{"id":"https://openalex.org/F4320306101","display_name":"National Aeronautics and Space Administration","ror":"https://ror.org/027ka1x80"},{"id":"https://openalex.org/F4320309385","display_name":"Texas Emerging Technology Fund","ror":"https://ror.org/02yyzvz79"},{"id":"https://openalex.org/F4320333121","display_name":"University of Texas at El Paso","ror":"https://ror.org/04d5vba33"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2045279221.pdf","grobid_xml":"https://content.openalex.org/works/W2045279221.grobid-xml"},"referenced_works_count":31,"referenced_works":["https://openalex.org/W85426754","https://openalex.org/W580020498","https://openalex.org/W1945113260","https://openalex.org/W1972896236","https://openalex.org/W1998639535","https://openalex.org/W2032913108","https://openalex.org/W2034972690","https://openalex.org/W2035707072","https://openalex.org/W2036931096","https://openalex.org/W2047947115","https://openalex.org/W2053846703","https://openalex.org/W2074161060","https://openalex.org/W2081350642","https://openalex.org/W2158282787","https://openalex.org/W2238697120","https://openalex.org/W2253036391","https://openalex.org/W2802453271","https://openalex.org/W2900018190","https://openalex.org/W3015620667","https://openalex.org/W3035462784","https://openalex.org/W3128985762","https://openalex.org/W4300842563","https://openalex.org/W6603526296","https://openalex.org/W6650215462","https://openalex.org/W6690440483","https://openalex.org/W6691738203","https://openalex.org/W6751516838","https://openalex.org/W6756176459","https://openalex.org/W6776078542","https://openalex.org/W6779253360","https://openalex.org/W6790396117"],"related_works":["https://openalex.org/W2510227772","https://openalex.org/W2522247727","https://openalex.org/W2349811626","https://openalex.org/W2364251614","https://openalex.org/W2369866083","https://openalex.org/W2085127655","https://openalex.org/W1998524096","https://openalex.org/W2373851425","https://openalex.org/W2384464911","https://openalex.org/W2363918801"],"abstract_inverted_index":{"In":[0],"new":[1],"product":[2],"development,":[3],"time":[4,71],"to":[5,94,131,147,175,193,235,245],"market":[6],"(TTM)":[7],"is":[8],"critical":[9],"for":[10,224],"the":[11,83,100,123,161,189,215,238],"success":[12],"and":[13,32,55,114,151,163,205,211,220],"profitability":[14],"of":[15,46,85,125,232],"next":[16],"generation":[17],"products.":[18],"When":[19],"these":[20,79],"products":[21,97],"include":[22,82],"sophisticated":[23],"electronics":[24,127,135,234],"encased":[25],"in":[26,41,69,92,99,122],"3D":[27,48,80,108,126,133,137,141,169,230],"packaging":[28],"with":[29,52,156],"complex":[30],"geometries":[31],"intricate":[33],"detail,":[34],"TTM":[35],"can":[36,59,65,172],"be":[37,66,145,173],"compromised":[38],"-":[39,129],"resulting":[40],"lost":[42],"opportunity.":[43],"The":[44,103,200],"use":[45],"advanced":[47,181],"printing":[49,109,142,170,231],"technology":[50],"enhanced":[51],"component":[53],"placement":[54],"electrical":[56],"interconnect":[57],"deposition":[58,116],"provide":[60],"electronic":[61,184],"prototypes":[62,81],"that":[63],"now":[64],"rapidly":[67],"fabricated":[68],"comparable":[70],"frames":[72],"as":[73,112,132],"traditional":[74],"2D":[75],"bread-boarded":[76],"prototypes;":[77],"however,":[78,159],"advantage":[84],"being":[86],"embedded":[87],"within":[88],"more":[89],"appropriate":[90,183],"shapes":[91],"order":[93],"authentically":[95],"prototype":[96],"earlier":[98],"development":[101,177,190,239],"cycle.":[102],"fabrication":[104],"freedom":[105],"offered":[106],"by":[107,179],"techniques,":[110],"such":[111],"stereolithography":[113],"fused":[115],"modeling":[117],"have":[118],"recently":[119],"been":[120],"explored":[121],"context":[124],"integration":[128],"referred":[130],"structural":[134,233],"or":[136],"printed":[138],"electronics.":[139],"Enhanced":[140],"may":[143],"eventually":[144],"employed":[146,174],"manufacture":[148],"end-use":[149],"parts":[150],"thus":[152],"offer":[153],"unit-level":[154],"customization":[155],"local":[157],"manufacturing;":[158],"until":[160],"materials":[162],"dimensional":[164],"accuracies":[165],"improve":[166],"(an":[167],"eventuality),":[168],"technologies":[171],"reduce":[176],"times":[178],"providing":[180],"geometrically":[182],"prototypes.":[185],"This":[186],"paper":[187],"describes":[188],"process":[191],"used":[192],"design":[194],"a":[195,203,225],"novelty":[196],"six-sided":[197],"gaming":[198],"die.":[199],"die":[201],"includes":[202],"microprocessor":[204],"accelerometer,":[206],"which":[207],"together":[208],"detect":[209],"motion":[210],"upon":[212],"halting,":[213],"identify":[214],"top":[216],"surface":[217],"through":[218],"gravity":[219],"illuminate":[221],"light-emitting":[222],"diodes":[223],"striking":[226],"effect.":[227],"By":[228],"applying":[229],"expedite":[236],"prototyping,":[237],"cycle":[240],"was":[241],"reduced":[242],"from":[243],"weeks":[244],"hours.":[246]},"counts_by_year":[{"year":2026,"cited_by_count":16},{"year":2025,"cited_by_count":35},{"year":2024,"cited_by_count":41},{"year":2023,"cited_by_count":42},{"year":2022,"cited_by_count":63},{"year":2021,"cited_by_count":70},{"year":2020,"cited_by_count":68},{"year":2019,"cited_by_count":66},{"year":2018,"cited_by_count":63},{"year":2017,"cited_by_count":62},{"year":2016,"cited_by_count":43},{"year":2015,"cited_by_count":26},{"year":2014,"cited_by_count":5}],"updated_date":"2026-08-01T09:00:35.917206","created_date":"2025-10-10T00:00:00"}