{"id":"https://openalex.org/W2125708340","doi":"https://doi.org/10.1109/access.2013.2293018","title":"A Low-Cost Open-Source Metal 3-D Printer","display_name":"A Low-Cost Open-Source Metal 3-D Printer","publication_year":2013,"publication_date":"2013-01-01","ids":{"openalex":"https://openalex.org/W2125708340","doi":"https://doi.org/10.1109/access.2013.2293018","mag":"2125708340"},"language":"en","primary_location":{"id":"doi:10.1109/access.2013.2293018","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2013.2293018","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1109/access.2013.2293018","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034926567","display_name":"Gerald C. Anzalone","orcid":null},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Gerald C. Anzalone","raw_affiliation_strings":["Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103107060","display_name":"Chenlong Zhang","orcid":"https://orcid.org/0009-0006-3215-222X"},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chenlong Zhang","raw_affiliation_strings":["Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047930705","display_name":"Bas Wijnen","orcid":null},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bas Wijnen","raw_affiliation_strings":["Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021529831","display_name":"Paul G. Sanders","orcid":"https://orcid.org/0000-0003-0334-1540"},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul G. Sanders","raw_affiliation_strings":["Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064793135","display_name":"Joshua M. Pearce","orcid":"https://orcid.org/0000-0001-9802-3056"},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joshua M. Pearce","raw_affiliation_strings":["Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Mater. Sci. & Eng., Michigan Technol. Univ., Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5034926567"],"corresponding_institution_ids":["https://openalex.org/I11957088"],"apc_list":{"value":1850,"currency":"USD","value_usd":1850},"apc_paid":{"value":1850,"currency":"USD","value_usd":1850},"fwci":17.0119,"has_fulltext":false,"cited_by_count":137,"citation_normalized_percentile":{"value":0.99180142,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"1","issue":null,"first_page":"803","last_page":"810"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9898999929428101,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9398000240325928,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/open-source","display_name":"Open source","score":0.5409584641456604},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5314618349075317},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.17305868864059448},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.15890294313430786}],"concepts":[{"id":"https://openalex.org/C3018397939","wikidata":"https://www.wikidata.org/wiki/Q3644502","display_name":"Open source","level":3,"score":0.5409584641456604},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5314618349075317},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.17305868864059448},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.15890294313430786}],"mesh":[],"locations_count":6,"locations":[{"id":"doi:10.1109/access.2013.2293018","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2013.2293018","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:digitalcommons.mtu.edu:materials_fp-1068","is_oa":false,"landing_page_url":"https://digitalcommons.mtu.edu/materials_fp/120","pdf_url":null,"source":{"id":"https://openalex.org/S4377196391","display_name":"Digital Commons - Michigan Tech (Michigan Technological University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I11957088","host_organization_name":"Michigan Technological University","host_organization_lineage":["https://openalex.org/I11957088"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Department of Materials Science and Engineering Publications","raw_type":"text"},{"id":"pmh:oai:digitalcommons.mtu.edu:michigantech-p-3126","is_oa":false,"landing_page_url":"https://digitalcommons.mtu.edu/michigantech-p/2136","pdf_url":null,"source":{"id":"https://openalex.org/S4377196391","display_name":"Digital Commons - Michigan Tech (Michigan Technological University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I11957088","host_organization_name":"Michigan Technological University","host_organization_lineage":["https://openalex.org/I11957088"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Michigan Tech Publications","raw_type":"text"},{"id":"pmh:oai:HAL:hal-02119701v1","is_oa":true,"landing_page_url":"https://hal.science/hal-02119701","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, 2013, 1, pp.803-810. ⟨10.1109/ACCESS.2013.2293018⟩","raw_type":"Journal articles"},{"id":"pmh:oai:doaj.org/article:45c7c53231c74000b4c53a8204767686","is_oa":true,"landing_page_url":"https://doaj.org/article/45c7c53231c74000b4c53a8204767686","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 1, Pp 803-810 (2013)","raw_type":"article"},{"id":"pmh:oai:ir.lib.uwo.ca:electricalpub-1447","is_oa":false,"landing_page_url":"https://ir.lib.uwo.ca/electricalpub/439","pdf_url":null,"source":{"id":"https://openalex.org/S4306400648","display_name":"Scholarship@Western (Western University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I125749732","host_organization_name":"Western University","host_organization_lineage":["https://openalex.org/I125749732"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Electrical and Computer Engineering Publications","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2013.2293018","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2013.2293018","pdf_url":null,"source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.6600000262260437,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W45346846","https://openalex.org/W144691722","https://openalex.org/W603961186","https://openalex.org/W746067135","https://openalex.org/W1508369527","https://openalex.org/W1969040490","https://openalex.org/W1988383009","https://openalex.org/W1991363801","https://openalex.org/W1997556497","https://openalex.org/W2000196103","https://openalex.org/W2002419320","https://openalex.org/W2023401480","https://openalex.org/W2046843502","https://openalex.org/W2049089255","https://openalex.org/W2063921372","https://openalex.org/W2065848795","https://openalex.org/W2072427348","https://openalex.org/W2081183384","https://openalex.org/W2092399590","https://openalex.org/W2106365938","https://openalex.org/W2107596955","https://openalex.org/W2132544811","https://openalex.org/W2135660333","https://openalex.org/W2135702713","https://openalex.org/W2160678375","https://openalex.org/W2161153826","https://openalex.org/W2162668866","https://openalex.org/W2467910805","https://openalex.org/W2566718014","https://openalex.org/W4242280504","https://openalex.org/W6605836329","https://openalex.org/W6683909250"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W4391913857","https://openalex.org/W2350741829","https://openalex.org/W2530322880"],"abstract_inverted_index":{"Technical":[0],"progress":[1],"in":[2,88],"the":[3,26,34,72,75,82,94,128,155,158,162,183,186,189,194],"open-source":[4,30,99,111],"self":[5],"replicating":[6],"rapid":[7,63],"prototyper":[8],"(RepRap)":[9],"community":[10],"has":[11,47],"enabled":[12],"a":[13,97,115,118,125,130],"distributed":[14],"form":[15],"of":[16,28,41,54,74,96,117,127,135,154,157,170,197],"additive":[17],"manufacturing":[18],"to":[19,61],"expand":[20],"rapidly":[21],"using":[22],"polymer-based":[23],"materials.":[24],"However,":[25],"lack":[27],"an":[29,110],"metal":[31,44,56,100,104,174],"alternative":[32],"and":[33,38,65,79,85,113,124,138,142,145,161,178,188],"high":[35],"capital":[36],"costs":[37],"slow":[39],"throughput":[40],"proprietary":[42],"commercialized":[43,55],"3-D":[45,57,101,105,159],"printers":[46,58],"severely":[48,70],"restricted":[49],"their":[50],"deployment.":[51],"The":[52,103,133,168],"applications":[53],"are":[59,148,166,176,180],"limited":[60],"only":[62],"prototyping":[64],"expensive":[66],"nished":[67],"products.":[68],"This":[69,90],"restricts":[71],"access":[73],"technology":[76,187],"for":[77,86,185,193],"small":[78],"medium":[80],"enterprises,":[81],"developing":[83],"world":[84],"use":[87],"laboratories.":[89],"paper":[91],"reports":[92],"on":[93],"development":[95],"2000":[98],"printer.":[102],"printer":[106,160],"is":[107,114],"controlled":[108],"with":[109],"micro-controller":[112],"combination":[116],"low-cost":[119],"commercial":[120],"gas-metal":[121],"arc":[122],"welder":[123],"derivative":[126],"Rostock,":[129],"deltabot":[131],"RepRap.":[132],"bill":[134],"materials,":[136],"electrical":[137],"mechanical":[139],"design":[140],"schematics,":[141],"basic":[143],"construction":[144],"operating":[146],"procedures":[147],"provided.":[149],"A":[150],"preliminary":[151],"technical":[152],"analysis":[153],"properties":[156],"resultant":[163],"steel":[164],"products":[165],"performed.":[167],"results":[169],"printing":[171],"customized":[172],"functional":[173],"parts":[175],"discussed":[177],"conclusions":[179],"drawn":[181],"about":[182],"potential":[184],"future":[190],"work":[191],"necessary":[192],"mass":[195],"distribution":[196],"this":[198],"technology.":[199],"\u00a9":[200],"2013":[201],"IEEE.":[202]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":9},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":18},{"year":2020,"cited_by_count":7},{"year":2019,"cited_by_count":10},{"year":2018,"cited_by_count":12},{"year":2017,"cited_by_count":20},{"year":2016,"cited_by_count":14},{"year":2015,"cited_by_count":15},{"year":2014,"cited_by_count":8},{"year":2013,"cited_by_count":1}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}