{"id":"https://openalex.org/W1980663193","doi":"https://doi.org/10.1109/acc.2008.4586818","title":"Control of nano- and micro-crystalline copper electrodeposits","display_name":"Control of nano- and micro-crystalline copper electrodeposits","publication_year":2008,"publication_date":"2008-06-01","ids":{"openalex":"https://openalex.org/W1980663193","doi":"https://doi.org/10.1109/acc.2008.4586818","mag":"1980663193"},"language":"en","primary_location":{"id":"doi:10.1109/acc.2008.4586818","is_oa":false,"landing_page_url":"https://doi.org/10.1109/acc.2008.4586818","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 American Control Conference","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057699277","display_name":"M. Trzaska","orcid":null},"institutions":[{"id":"https://openalex.org/I108403487","display_name":"Warsaw University of Technology","ror":"https://ror.org/00y0xnp53","country_code":"PL","type":"education","lineage":["https://openalex.org/I108403487"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"M. Trzaska","raw_affiliation_strings":["Faculty of Materials Science and Engineering, Warsaw University of Technology, Warsaw, Poland","Fac. of Mater. Sci. & Eng., Warsaw Univ. of Technol., Warsaw"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Materials Science and Engineering, Warsaw University of Technology, Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]},{"raw_affiliation_string":"Fac. of Mater. Sci. & Eng., Warsaw Univ. of Technol., Warsaw","institution_ids":["https://openalex.org/I108403487"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5000047309","display_name":"Z. Trzaska","orcid":"https://orcid.org/0000-0003-4786-7579"},"institutions":[{"id":"https://openalex.org/I108403487","display_name":"Warsaw University of Technology","ror":"https://ror.org/00y0xnp53","country_code":"PL","type":"education","lineage":["https://openalex.org/I108403487"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Z. W. Trzaska","raw_affiliation_strings":["Faculty of Materials Science and Engineering, Warsaw University of Technology, Warsaw, Poland","Fac. of Mater. Sci. & Eng., Warsaw Univ. of Technol., Warsaw"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Materials Science and Engineering, Warsaw University of Technology, Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]},{"raw_affiliation_string":"Fac. of Mater. Sci. & Eng., Warsaw Univ. of Technol., Warsaw","institution_ids":["https://openalex.org/I108403487"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I108403487"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.04564997,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"48","issue":null,"first_page":"2196","last_page":"2201"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.8163493275642395},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8084448575973511},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.6276824474334717},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.5987505912780762},{"id":"https://openalex.org/keywords/plating","display_name":"Plating (geology)","score":0.5695566534996033},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.562929630279541},{"id":"https://openalex.org/keywords/nano","display_name":"Nano-","score":0.5432785749435425},{"id":"https://openalex.org/keywords/surface-finish","display_name":"Surface finish","score":0.49925994873046875},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4893738627433777},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.46327802538871765},{"id":"https://openalex.org/keywords/double-layer-capacitance","display_name":"Double-layer capacitance","score":0.4553043246269226},{"id":"https://openalex.org/keywords/copper-plating","display_name":"Copper plating","score":0.44947877526283264},{"id":"https://openalex.org/keywords/electrical-resistance-and-conductance","display_name":"Electrical resistance and conductance","score":0.43905529379844666},{"id":"https://openalex.org/keywords/corrosion","display_name":"Corrosion","score":0.4278773367404938},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4198412299156189},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4048399031162262},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.32536959648132324},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.2565165162086487},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.1722811460494995},{"id":"https://openalex.org/keywords/electrochemistry","display_name":"Electrochemistry","score":0.1615513265132904}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8163493275642395},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8084448575973511},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6276824474334717},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.5987505912780762},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.5695566534996033},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.562929630279541},{"id":"https://openalex.org/C2780357685","wikidata":"https://www.wikidata.org/wiki/Q154357","display_name":"Nano-","level":2,"score":0.5432785749435425},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.49925994873046875},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4893738627433777},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.46327802538871765},{"id":"https://openalex.org/C2778026820","wikidata":"https://www.wikidata.org/wiki/Q15703126","display_name":"Double-layer capacitance","level":5,"score":0.4553043246269226},{"id":"https://openalex.org/C29216876","wikidata":"https://www.wikidata.org/wiki/Q1769505","display_name":"Copper plating","level":4,"score":0.44947877526283264},{"id":"https://openalex.org/C94857076","wikidata":"https://www.wikidata.org/wiki/Q106603432","display_name":"Electrical resistance and conductance","level":2,"score":0.43905529379844666},{"id":"https://openalex.org/C20625102","wikidata":"https://www.wikidata.org/wiki/Q137056","display_name":"Corrosion","level":2,"score":0.4278773367404938},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4198412299156189},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4048399031162262},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.32536959648132324},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.2565165162086487},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.1722811460494995},{"id":"https://openalex.org/C52859227","wikidata":"https://www.wikidata.org/wiki/Q7877","display_name":"Electrochemistry","level":3,"score":0.1615513265132904},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C7040849","wikidata":"https://www.wikidata.org/wiki/Q899580","display_name":"Dielectric spectroscopy","level":4,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/acc.2008.4586818","is_oa":false,"landing_page_url":"https://doi.org/10.1109/acc.2008.4586818","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 American Control Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.49000000953674316}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2068951696","https://openalex.org/W2075126769","https://openalex.org/W2147776263","https://openalex.org/W2214504069","https://openalex.org/W3149729898"],"related_works":["https://openalex.org/W2380173654","https://openalex.org/W2515690062","https://openalex.org/W2076205931","https://openalex.org/W2039945307","https://openalex.org/W3035982821","https://openalex.org/W627159299","https://openalex.org/W2069151110","https://openalex.org/W4243429347","https://openalex.org/W2883124016","https://openalex.org/W2133832016"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"electrodeposition":[3,34],"of":[4,25,72,94,102],"nano-":[5],"and":[6,10,14,22,31,54,75,107],"micro-crystalline":[7],"copper":[8,27,96],"films":[9,28],"thin-layers":[11],"with":[12],"direct":[13],"pulse":[15],"periodic":[16],"currents":[17],"is":[18,47],"effectively":[19],"controlled.":[20],"Electrical":[21],"physico-chemical":[23],"characterizations":[24],"the":[26,32,70,83,91,95,104,108],"are":[29,36,41],"realized,":[30],"optimized":[33],"parameters":[35,57],"so":[37],"determined.":[38],"Next,":[39],"they":[40],"applied":[42],"to":[43,59],"micromolding.":[44],"The":[45,65],"attention":[46],"focused":[48],"on":[49,55],"microstructure,":[50],"surface":[51],"roughness,":[52],"hardness,":[53],"process":[56],"leading":[58],"major":[60],"differences":[61],"in":[62,78,86,90,99],"final":[63],"products.":[64],"obtained":[66],"results":[67,98],"show":[68],"that":[69],"addition":[71],"a":[73,76],"spike":[74],"decrease":[77],"forward":[79],"current":[80],"can":[81],"improve":[82],"throwing":[84],"power":[85],"plating":[87],"quality.":[88],"Decrease":[89],"grains":[92],"dimension":[93],"layers":[97],"an":[100],"increase":[101],"both":[103],"corrosion":[105],"rate":[106],"double":[109],"layer":[110],"capacitance":[111],"but":[112],"then":[113],"charge":[114],"transfer":[115],"resistance":[116],"decreases.":[117]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}