{"id":"https://openalex.org/W2129104878","doi":"https://doi.org/10.1109/acc.2005.1469942","title":"Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging","display_name":"Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging","publication_year":2005,"publication_date":"2005-08-10","ids":{"openalex":"https://openalex.org/W2129104878","doi":"https://doi.org/10.1109/acc.2005.1469942","mag":"2129104878"},"language":"en","primary_location":{"id":"doi:10.1109/acc.2005.1469942","is_oa":false,"landing_page_url":"https://doi.org/10.1109/acc.2005.1469942","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005, American Control Conference, 2005.","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113555025","display_name":"Hua Deng","orcid":"https://orcid.org/0000-0003-2075-2990"},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Hua Deng","raw_affiliation_strings":["Department of ManufacturingEngineering andEngineering Management, City University of Hong Kong, Hong Kong, China","Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of ManufacturingEngineering andEngineering Management, City University of Hong Kong, Hong Kong, China","institution_ids":["https://openalex.org/I168719708"]},{"raw_affiliation_string":"Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China","institution_ids":["https://openalex.org/I168719708"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090216201","display_name":"Han\u2010Xiong Li","orcid":"https://orcid.org/0000-0002-0707-5940"},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Han-Xiong Li","raw_affiliation_strings":["Department of ManufacturingEngineering andEngineering Management, City University of Hong Kong, Hong Kong, China","Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of ManufacturingEngineering andEngineering Management, City University of Hong Kong, Hong Kong, China","institution_ids":["https://openalex.org/I168719708"]},{"raw_affiliation_string":"Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China","institution_ids":["https://openalex.org/I168719708"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I168719708"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"256","last_page":"261"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11749","display_name":"Iterative Learning Control Systems","score":0.9901000261306763,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/schedule","display_name":"Schedule","score":0.6720702648162842},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.6687827110290527},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5777643322944641},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.5665455460548401},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5355019569396973},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5252168774604797},{"id":"https://openalex.org/keywords/process-control","display_name":"Process control","score":0.515528678894043},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4935969114303589},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.4385804235935211},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.43708425760269165},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4005521833896637},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24119064211845398},{"id":"https://openalex.org/keywords/control-engineering","display_name":"Control engineering","score":0.20745906233787537},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.202424556016922},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.0975845456123352}],"concepts":[{"id":"https://openalex.org/C68387754","wikidata":"https://www.wikidata.org/wiki/Q7271585","display_name":"Schedule","level":2,"score":0.6720702648162842},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.6687827110290527},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5777643322944641},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.5665455460548401},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5355019569396973},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5252168774604797},{"id":"https://openalex.org/C155386361","wikidata":"https://www.wikidata.org/wiki/Q1649571","display_name":"Process control","level":3,"score":0.515528678894043},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4935969114303589},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.4385804235935211},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.43708425760269165},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4005521833896637},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24119064211845398},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.20745906233787537},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.202424556016922},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0975845456123352},{"id":"https://openalex.org/C188027245","wikidata":"https://www.wikidata.org/wiki/Q750446","display_name":"Polymer chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/acc.2005.1469942","is_oa":false,"landing_page_url":"https://doi.org/10.1109/acc.2005.1469942","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005, American Control Conference, 2005.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6499999761581421}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W40130861","https://openalex.org/W181789436","https://openalex.org/W613358724","https://openalex.org/W1481834144","https://openalex.org/W1487127700","https://openalex.org/W1595065160","https://openalex.org/W1603273475","https://openalex.org/W1997138061","https://openalex.org/W2102219693","https://openalex.org/W2104836730","https://openalex.org/W2113792082","https://openalex.org/W2120818273","https://openalex.org/W2125974863","https://openalex.org/W2136848349","https://openalex.org/W2145002951","https://openalex.org/W2541130610","https://openalex.org/W4386445991"],"related_works":["https://openalex.org/W2311047242","https://openalex.org/W2016970881","https://openalex.org/W1998676331","https://openalex.org/W4295038339","https://openalex.org/W244827817","https://openalex.org/W2546216849","https://openalex.org/W2333804548","https://openalex.org/W2377982568","https://openalex.org/W584365561","https://openalex.org/W1990828594"],"abstract_inverted_index":{"It":[0],"is":[1,27,39,66,76],"difficult":[2],"to":[3,14,68,85],"achieve":[4],"optimal":[5],"curing":[6,87],"for":[7,19],"die":[8,50],"attachment":[9],"in":[10,30,89],"IC":[11],"packaging":[12],"due":[13],"the":[15,24,45,48,86],"lack":[16],"of":[17,47,58],"tools":[18],"on-line":[20],"measurement.":[21],"In":[22],"practice,":[23],"cure":[25,59],"schedule":[26,60],"typically":[28],"determined":[29],"a":[31],"trial":[32],"and":[33,41,63,72,78,80],"error":[34],"process":[35],"even":[36],"though":[37],"it":[38],"costly":[40],"may":[42],"not":[43],"guarantee":[44],"reliability":[46,71],"adhesive":[49],"attach.":[51],"A":[52],"novel":[53],"spectral":[54],"model":[55],"based":[56],"integration":[57],"optimization,":[61],"supervision":[62,88],"decoupling":[64],"control":[65],"introduced":[67],"maintain":[69],"both":[70],"throughput.":[73],"The":[74],"method":[75],"straightforward":[77],"effective,":[79],"can":[81],"be":[82],"easily":[83],"applied":[84],"electronics":[90],"industry.":[91]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}