{"id":"https://openalex.org/W4200550987","doi":"https://doi.org/10.1109/a-sscc53895.2021.9634704","title":"A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration","display_name":"A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration","publication_year":2021,"publication_date":"2021-11-07","ids":{"openalex":"https://openalex.org/W4200550987","doi":"https://doi.org/10.1109/a-sscc53895.2021.9634704"},"language":"en","primary_location":{"id":"doi:10.1109/a-sscc53895.2021.9634704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/a-sscc53895.2021.9634704","pdf_url":null,"source":{"id":"https://openalex.org/S4363608516","display_name":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103076876","display_name":"Xiping Jiang","orcid":"https://orcid.org/0000-0002-7942-9576"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"funder","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]},{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiping Jiang","raw_affiliation_strings":["Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China","University of Chinese Academy of Sciences, Beijing, China","Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I19820366"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]},{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045322301","display_name":"Fengguo Zuo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengguo Zuo","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101416294","display_name":"Song Wang","orcid":"https://orcid.org/0000-0002-7682-5987"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]},{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Song Wang","raw_affiliation_strings":["University of Science and Technology of China, Hefei, China","Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, China","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023696818","display_name":"Xiaofeng Zhou","orcid":"https://orcid.org/0000-0001-9837-1261"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaofeng Zhou","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045193860","display_name":"Bing Yu","orcid":"https://orcid.org/0000-0001-7752-592X"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bing Yu","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101820106","display_name":"Yubing Wang","orcid":"https://orcid.org/0000-0003-2444-1030"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yubing Wang","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101600614","display_name":"Qi Liu","orcid":"https://orcid.org/0000-0002-8485-3582"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Liu","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100347785","display_name":"Ming Liu","orcid":"https://orcid.org/0000-0002-4500-238X"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"funder","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Liu","raw_affiliation_strings":["Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China","University of Chinese Academy of Sciences, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I19820366"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033886915","display_name":"Yi Kang","orcid":"https://orcid.org/0009-0004-3092-5626"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi Kang","raw_affiliation_strings":["University of Science and Technology of China, Hefei, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049081005","display_name":"Qiwei Ren","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiwei Ren","raw_affiliation_strings":["Xi'an UniIC Semiconductors, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an UniIC Semiconductors, Xi'an, China","institution_ids":["https://openalex.org/I4210148388"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5103076876"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392","https://openalex.org/I4210148388","https://openalex.org/I4210165038"],"apc_list":null,"apc_paid":null,"fwci":3.0292,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.93058423,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.8852140307426453},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6202337145805359},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6085604429244995},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5453497767448425},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5357624292373657},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.42585891485214233},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.2367607057094574},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.1448531448841095},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09833383560180664}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.8852140307426453},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6202337145805359},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6085604429244995},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5453497767448425},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5357624292373657},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.42585891485214233},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2367607057094574},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.1448531448841095},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09833383560180664}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/a-sscc53895.2021.9634704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/a-sscc53895.2021.9634704","pdf_url":null,"source":{"id":"https://openalex.org/S4363608516","display_name":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2561559888","https://openalex.org/W2586428357","https://openalex.org/W2790546557","https://openalex.org/W2911774253","https://openalex.org/W2965769762","https://openalex.org/W3016139914","https://openalex.org/W3016166938","https://openalex.org/W3136346557"],"related_works":["https://openalex.org/W2036806516","https://openalex.org/W2065289416","https://openalex.org/W1967394420","https://openalex.org/W2565425548","https://openalex.org/W2392009442","https://openalex.org/W2087695844","https://openalex.org/W2017236304","https://openalex.org/W2154106283","https://openalex.org/W2912613323","https://openalex.org/W2142443274"],"abstract_inverted_index":{"The":[0,60,105],"emerging":[1],"high-performance":[2],"system-on-chip":[3],"(SoC)":[4],"is":[5,102],"quiet":[6],"hunger":[7],"for":[8],"high":[9,49],"bandwidth":[10,50],"and":[11,15,19,36,51,69],"energy":[12],"efficiency":[13],"memory,":[14],"72GB/s":[16],"GDDR6":[17],"[1]":[18],"640GB/s":[20],"HBM2E":[21],"[2]":[22],"are":[23,28,64],"alleviating":[24],"this":[25],"problem.":[26],"HBMs":[27],"realized":[29],"by":[30,66,113],"through":[31],"silicon":[32],"via":[33],"(TSV)":[34],"technology":[35],"large":[37],"number":[38],"of":[39],"I/Os":[40],"[3]":[41],"that":[42],"indicates":[43],"the":[44,55],"major":[45],"obstacle":[46],"to":[47],"obtain":[48],"low":[52],"power":[53],"from":[54],"heavy":[56],"capacitive":[57],"load":[58],"[4].":[59],"computing":[61,99],"performance":[62,111],"improvements":[63],"ensured":[65],"a":[67,92],"8.8um":[68],"below":[70],"pitch":[71],"hybrid":[72],"bonding":[73],"(HB)":[74],"wafer-level":[75],"integration":[76],"with":[77],"memory":[78],"[5].":[79],"Our":[80],"previous":[81],"work":[82],"[6]":[83],"reported":[84],"4Gb":[85],"LPDDR4/4X":[86],"based":[87],"on":[88],"SeDRAM.":[89],"This":[90],"work,":[91],"1596GB/s":[93],"48Gb":[94],"embedded":[95,114],"DRAM":[96],"384-core":[97],"cryptographic":[98],"[7]":[100],"SoC":[101],"first":[103],"presented.":[104],"results":[106],"show":[107],"an":[108],"expected":[109],"great":[110],"gain":[112],"DRAM.":[115]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":6}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}