{"id":"https://openalex.org/W2025288680","doi":"https://doi.org/10.1109/4.156441","title":"Thermal design and simulation of bipolar integrated circuits","display_name":"Thermal design and simulation of bipolar integrated circuits","publication_year":1992,"publication_date":"1992-01-01","ids":{"openalex":"https://openalex.org/W2025288680","doi":"https://doi.org/10.1109/4.156441","mag":"2025288680"},"language":"en","primary_location":{"id":"doi:10.1109/4.156441","is_oa":false,"landing_page_url":"https://doi.org/10.1109/4.156441","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5055542996","display_name":"K. Poulton","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Poulton","raw_affiliation_strings":["Hewlett Packard Laboratories, Palo Alto, CA, USA","Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Laboratories, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065640565","display_name":"K.L. Knudesn","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K.L. Knudesn","raw_affiliation_strings":["Hewlett-Packard Lab., Palo Alto, CA, USA","Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Lab., Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091446213","display_name":"John Corcoran","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.J. Corcoran","raw_affiliation_strings":["Hewlett Packard Laboratories, Palo Alto, CA, USA","Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Laboratories, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett\u2013Packard Laboratories, Palo Alto, CA, USA#TAB#","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018535359","display_name":"K.-C. Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I57053284","display_name":"Rockwell Automation (United States)","ror":"https://ror.org/01sx1pm50","country_code":"US","type":"company","lineage":["https://openalex.org/I57053284"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K.-C. Wang","raw_affiliation_strings":["Rockwell International Science Center, Thousand Oaks, CA, USA","[Rockwell International Science Center, Thousand Oaks, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rockwell International Science Center, Thousand Oaks, CA, USA","institution_ids":["https://openalex.org/I57053284"]},{"raw_affiliation_string":"[Rockwell International Science Center, Thousand Oaks, CA, USA]","institution_ids":["https://openalex.org/I57053284"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005412896","display_name":"R.L. Pierson","orcid":null},"institutions":[{"id":"https://openalex.org/I57053284","display_name":"Rockwell Automation (United States)","ror":"https://ror.org/01sx1pm50","country_code":"US","type":"company","lineage":["https://openalex.org/I57053284"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R.L. Pierson","raw_affiliation_strings":["Rockwell International Science Center, Thousand Oaks, CA, USA","[Rockwell International Science Center, Thousand Oaks, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rockwell International Science Center, Thousand Oaks, CA, USA","institution_ids":["https://openalex.org/I57053284"]},{"raw_affiliation_string":"[Rockwell International Science Center, Thousand Oaks, CA, USA]","institution_ids":["https://openalex.org/I57053284"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081377001","display_name":"R.B. Nubling","orcid":null},"institutions":[{"id":"https://openalex.org/I57053284","display_name":"Rockwell Automation (United States)","ror":"https://ror.org/01sx1pm50","country_code":"US","type":"company","lineage":["https://openalex.org/I57053284"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R.B. Nubling","raw_affiliation_strings":["Rockwell International Science Center, Thousand Oaks, CA, USA","[Rockwell International Science Center, Thousand Oaks, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rockwell International Science Center, Thousand Oaks, CA, USA","institution_ids":["https://openalex.org/I57053284"]},{"raw_affiliation_string":"[Rockwell International Science Center, Thousand Oaks, CA, USA]","institution_ids":["https://openalex.org/I57053284"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051454330","display_name":"Mau-Chung Frank Chang","orcid":"https://orcid.org/0000-0002-2934-9359"},"institutions":[{"id":"https://openalex.org/I57053284","display_name":"Rockwell Automation (United States)","ror":"https://ror.org/01sx1pm50","country_code":"US","type":"company","lineage":["https://openalex.org/I57053284"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.-C.F. Chang","raw_affiliation_strings":["Rockwell International Science Center, Thousand Oaks, CA, USA","[Rockwell International Science Center, Thousand Oaks, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rockwell International Science Center, Thousand Oaks, CA, USA","institution_ids":["https://openalex.org/I57053284"]},{"raw_affiliation_string":"[Rockwell International Science Center, Thousand Oaks, CA, USA]","institution_ids":["https://openalex.org/I57053284"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.2377,"has_fulltext":false,"cited_by_count":52,"citation_normalized_percentile":{"value":0.93533544,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"27","issue":"10","first_page":"1379","last_page":"1387"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heterojunction-bipolar-transistor","display_name":"Heterojunction bipolar transistor","score":0.7911712527275085},{"id":"https://openalex.org/keywords/bipolar-junction-transistor","display_name":"Bipolar junction transistor","score":0.7053233981132507},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6536148190498352},{"id":"https://openalex.org/keywords/junction-temperature","display_name":"Junction temperature","score":0.5893554091453552},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.501392126083374},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4896448254585266},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.46655577421188354},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.4434787333011627},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.43929746747016907},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.43552684783935547},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3661958873271942},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.33413201570510864},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3293032646179199},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2970810532569885},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1992795467376709},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18363723158836365},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.10168778896331787}],"concepts":[{"id":"https://openalex.org/C173408217","wikidata":"https://www.wikidata.org/wiki/Q1428898","display_name":"Heterojunction bipolar transistor","level":5,"score":0.7911712527275085},{"id":"https://openalex.org/C23061349","wikidata":"https://www.wikidata.org/wiki/Q188946","display_name":"Bipolar junction transistor","level":4,"score":0.7053233981132507},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6536148190498352},{"id":"https://openalex.org/C167781694","wikidata":"https://www.wikidata.org/wiki/Q6311800","display_name":"Junction temperature","level":3,"score":0.5893554091453552},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.501392126083374},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4896448254585266},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.46655577421188354},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.4434787333011627},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.43929746747016907},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.43552684783935547},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3661958873271942},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.33413201570510864},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3293032646179199},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2970810532569885},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1992795467376709},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18363723158836365},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.10168778896331787},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/4.156441","is_oa":false,"landing_page_url":"https://doi.org/10.1109/4.156441","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7699999809265137}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1519896349","https://openalex.org/W1677979352","https://openalex.org/W1967779367","https://openalex.org/W2022524605","https://openalex.org/W2022705936","https://openalex.org/W2127354688","https://openalex.org/W2150702881","https://openalex.org/W2164993408","https://openalex.org/W2166852020","https://openalex.org/W2473709368","https://openalex.org/W4252376071","https://openalex.org/W6721082511"],"related_works":["https://openalex.org/W1567282658","https://openalex.org/W2393767093","https://openalex.org/W112868940","https://openalex.org/W2370543964","https://openalex.org/W1169114565","https://openalex.org/W2102511360","https://openalex.org/W1013142806","https://openalex.org/W2066462051","https://openalex.org/W2086501367","https://openalex.org/W2351481448"],"abstract_inverted_index":{"Keeping":[0],"device":[1,34,77],"operating":[2],"temperatures":[3],"within":[4],"reasonable":[5],"limits":[6],"is":[7,85],"necessary":[8],"for":[9,16,21,40,64],"reliability":[10],"of":[11,57,80,105,136],"all":[12],"ICs":[13],"and":[14,32,69,108],"important":[15],"achieving":[17],"the":[18,54,102,124,129],"expected":[19],"performance":[20],"many":[22,41],"ICs.":[23],"GaAs":[24],"heterojunction":[25],"bipolar":[26],"transistors":[27],"(HBTs)":[28],"offer":[29],"high":[30,59],"speed":[31],"good":[33],"matching":[35],"characteristics":[36],"that":[37,75],"are":[38,46,67],"attractive":[39],"high-speed":[42],"circuits,":[43],"but":[44],"they":[45],"more":[47],"susceptible":[48],"than":[49],"other":[50],"IC":[51,107,126],"technologies":[52],"to":[53,112,122,127],"unexpected":[55],"generation":[56],"very":[58],"junction":[60],"temperatures.":[61],"The":[62],"reasons":[63],"this":[65,89],"tendency":[66],"discussed,":[68],"an":[70,106],"HBT":[71],"sample-and-hold":[72],"(S/H)":[73],"circuit":[74,143],"had":[76],"temperature":[78,103,131],"rises":[79],"over":[81],"300":[82],"degrees":[83],"C":[84],"described.":[86],"To":[87],"address":[88],"problem,":[90],"a":[91,116,134,139],"new":[92],"thermal":[93],"simulation":[94],"tool":[95],"called":[96],"ThCalc":[97,100,119],"was":[98,120],"created.":[99],"calculates":[101],"profile":[104],"runs":[109],"fast":[110],"enough":[111],"allow":[113],"calculations":[114],"on":[115,142],"whole":[117],"chip.":[118],"used":[121],"redesign":[123],"S/H":[125],"reduce":[128],"largest":[130],"rise":[132],"by":[133],"factor":[135],"2.7":[137],"with":[138],"minimal":[140],"impact":[141],"size.<":[144],"<ETX":[145],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[146],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">&gt;</ETX>":[147]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}