{"id":"https://openalex.org/W4406356360","doi":"https://doi.org/10.1109/3dic63395.2024.10830234","title":"Creep Behavior of Low-Temperature Sn-In Solder Using Nanoindentation Test","display_name":"Creep Behavior of Low-Temperature Sn-In Solder Using Nanoindentation Test","publication_year":2024,"publication_date":"2024-09-25","ids":{"openalex":"https://openalex.org/W4406356360","doi":"https://doi.org/10.1109/3dic63395.2024.10830234"},"language":"en","primary_location":{"id":"doi:10.1109/3dic63395.2024.10830234","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830234","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038739558","display_name":"S. Nitta","orcid":"https://orcid.org/0009-0005-7064-1836"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Shunya Nitta","raw_affiliation_strings":["Graduate School of Engineering, Osaka University,Osaka,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Osaka University,Osaka,Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010662041","display_name":"Hiroaki Tatsumi","orcid":"https://orcid.org/0000-0002-0561-3100"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroaki Tatsumi","raw_affiliation_strings":["Joining and Welding Research Institute, Osaka University,Osaka,Japan"],"affiliations":[{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University,Osaka,Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089636779","display_name":"Hiroshi Nishikawa","orcid":"https://orcid.org/0000-0002-4363-9520"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Nishikawa","raw_affiliation_strings":["Joining and Welding Research Institute, Osaka University,Osaka,Japan"],"affiliations":[{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University,Osaka,Japan","institution_ids":["https://openalex.org/I98285908"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5038739558"],"corresponding_institution_ids":["https://openalex.org/I98285908"],"apc_list":null,"apc_paid":null,"fwci":0.222,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.57157278,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9733999967575073,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nanoindentation","display_name":"Nanoindentation","score":0.9131381511688232},{"id":"https://openalex.org/keywords/creep","display_name":"Creep","score":0.886682391166687},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7878859639167786},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.7634196877479553},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4430635869503021},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.43662649393081665},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.40917378664016724},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.08960795402526855}],"concepts":[{"id":"https://openalex.org/C49326732","wikidata":"https://www.wikidata.org/wiki/Q1549892","display_name":"Nanoindentation","level":2,"score":0.9131381511688232},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.886682391166687},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7878859639167786},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7634196877479553},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4430635869503021},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.43662649393081665},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.40917378664016724},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.08960795402526855},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic63395.2024.10830234","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830234","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1966063851","https://openalex.org/W2017425167","https://openalex.org/W2238418030","https://openalex.org/W2313710330","https://openalex.org/W2554459264","https://openalex.org/W2587351878","https://openalex.org/W2602566551","https://openalex.org/W2755034877","https://openalex.org/W2892075485","https://openalex.org/W2909663553","https://openalex.org/W2968882524","https://openalex.org/W3126428927","https://openalex.org/W4388129384"],"related_works":["https://openalex.org/W2019128035","https://openalex.org/W2377912919","https://openalex.org/W2087591640","https://openalex.org/W2072954403","https://openalex.org/W2378057324","https://openalex.org/W2063705945","https://openalex.org/W2045519648","https://openalex.org/W2018120503","https://openalex.org/W2470215200","https://openalex.org/W3020920278"],"abstract_inverted_index":{"Low-temperature":[0],"solders":[1],"are":[2],"required":[3],"in":[4],"three-dimensional":[5],"integrated":[6],"circuit":[7],"(3D":[8],"ICs)":[9],"to":[10,82],"reduce":[11],"heat":[12],"input":[13],"during":[14],"soldering":[15],"and":[16,60],"for":[17],"stacking.":[18],"Sn-52mass%In":[19],"alloys":[20,36,59,78],"(Sn-In":[21],"alloys)":[22],"is":[23,79],"promising":[24],"because":[25],"it":[26],"has":[27],"a":[28],"melting":[29],"point":[30],"of":[31,57,76,94,101],"119":[32],"\u00b0C.":[33],"However,":[34],"Sn-In":[35,58,77,102],"may":[37,47,96],"cause":[38],"significant":[39,80],"creep":[40,49,55,63,74,99],"deformation":[41,64,75,100],"at":[42],"room":[43],"temperature.":[44],"Nanoparticle":[45],"addition":[46,93],"control":[48,65],"deformation.":[50],"This":[51],"study":[52,89],"investigates":[53],"the":[54,62,92,98],"behavior":[56],"tries":[61],"by":[66],"nanoparticle":[67],"addition.":[68],"Experimental":[69],"results":[70],"showed":[71],"that":[72,91],"The":[73],"compared":[81],"other":[83],"lead":[84],"free":[85],"solders,":[86],"but":[87],"this":[88],"shows":[90],"nanoparticles":[95],"improve":[97],"alloys.":[103]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}