{"id":"https://openalex.org/W4406355914","doi":"https://doi.org/10.1109/3dic63395.2024.10830202","title":"Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC","display_name":"Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC","publication_year":2024,"publication_date":"2024-09-25","ids":{"openalex":"https://openalex.org/W4406355914","doi":"https://doi.org/10.1109/3dic63395.2024.10830202"},"language":"en","primary_location":{"id":"doi:10.1109/3dic63395.2024.10830202","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830202","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100766007","display_name":"Jiayi Shen","orcid":"https://orcid.org/0000-0002-5849-2357"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Jiayi Shen","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100353307","display_name":"Chang Liu","orcid":"https://orcid.org/0000-0002-8574-2681"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Chang Liu","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["Graduate School of Engineering, Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering, Dept. Mechanical Systems Engineering,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Graduate School of Engineering, Tohoku University,Dept. Mechanical Systems Engineering, Dept. Mechanical Systems Engineering,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Graduate School of Biomedical Engineering, Graduate School of Engineering, Tohoku University,Dept. of Biomedical Engineering, Dept. Mechanical Systems Engineering,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Biomedical Engineering, Graduate School of Engineering, Tohoku University,Dept. of Biomedical Engineering, Dept. Mechanical Systems Engineering,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100766007"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.23699344,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9839000105857849,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.685073971748352},{"id":"https://openalex.org/keywords/metal","display_name":"Metal","score":0.5687161684036255},{"id":"https://openalex.org/keywords/compressive-strength","display_name":"Compressive strength","score":0.5387009978294373},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3763197958469391},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3358684182167053},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.33254194259643555},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.3011918067932129}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.685073971748352},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.5687161684036255},{"id":"https://openalex.org/C30407753","wikidata":"https://www.wikidata.org/wiki/Q186191","display_name":"Compressive strength","level":2,"score":0.5387009978294373},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3763197958469391},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3358684182167053},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.33254194259643555},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3011918067932129}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic63395.2024.10830202","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830202","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W3048126884","https://openalex.org/W3192379842","https://openalex.org/W4320001363","https://openalex.org/W4389575377"],"related_works":["https://openalex.org/W2382537406","https://openalex.org/W2901332380","https://openalex.org/W4381956357","https://openalex.org/W4382457920","https://openalex.org/W2987371371","https://openalex.org/W4389042095","https://openalex.org/W2980842226","https://openalex.org/W4368368606","https://openalex.org/W4386867366","https://openalex.org/W4387843870"],"abstract_inverted_index":{"This":[0,102],"paper":[1],"presents":[2],"enhanced":[3,50],"room-temperature":[4],"bonding":[5,27],"for":[6,90,108],"micro-LEDs":[7,70],"tailored":[8],"to":[9],"Smart":[10],"Skin":[11],"Display":[12],"applications.":[13],"While":[14],"our":[15],"prior":[16],"work":[17],"utilizing":[18],"a":[19,25,55,60,105],"Semi-Additive":[20],"Plating":[21],"(SAP)":[22],"process":[23,53,98],"achieved":[24],"micro-LED":[26,57,112],"yield":[28],"of":[29,67,78],"90%,":[30],"further":[31],"advancements":[32],"necessitate":[33],"addressing":[34],"challenges":[35],"in":[36],"sidewall":[37],"GaN":[38],"layer":[39,45,93],"insulation":[40],"deposition":[41],"and":[42,59,99],"complete":[43],"seed":[44,63,92],"removal.":[46],"We":[47],"propose":[48],"an":[49,79],"SAP":[51,81],"(eSAP)":[52],"incorporating":[54],"novel":[56],"structure":[58],"well-designed":[61],"Cu":[62],"pattern.":[64],"Successful":[65],"illumination":[66],"the":[68,76,88,97],"fabricated":[69],"was":[71],"demonstrated.":[72],"Furthermore,":[73],"we":[74],"investigated":[75],"possibility":[77],"advanced":[80],"(aSAP)":[82],"with":[83],"electroless":[84],"Ni":[85],"plating,":[86],"eliminating":[87],"need":[89],"final":[91],"removal,":[94],"thereby":[95],"simplifying":[96],"enhancing":[100],"reliability.":[101],"approach":[103],"represents":[104],"promising":[106],"solution":[107],"room-":[109],"or":[110],"low-temperature":[111],"bonding.":[113]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}