{"id":"https://openalex.org/W4406356361","doi":"https://doi.org/10.1109/3dic63395.2024.10830177","title":"Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding","display_name":"Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding","publication_year":2024,"publication_date":"2024-09-25","ids":{"openalex":"https://openalex.org/W4406356361","doi":"https://doi.org/10.1109/3dic63395.2024.10830177"},"language":"en","primary_location":{"id":"doi:10.1109/3dic63395.2024.10830177","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830177","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103728835","display_name":"Murugesan Mariappan","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Murugesan Mariappan","raw_affiliation_strings":["Tohoku University,GINTI, NICHe,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku University,GINTI, NICHe,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035784645","display_name":"Hiroyuki Hashimoto","orcid":"https://orcid.org/0000-0001-6912-6953"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroyuki Hashimoto","raw_affiliation_strings":["Tohoku University,GINTI, NICHe,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku University,GINTI, NICHe,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109737884","display_name":"Kentaro Mihara","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115317","display_name":"Toray Industries, Inc. (Japan)","ror":"https://ror.org/029xh1r47","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210115317"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kentaro Mihara","raw_affiliation_strings":["Toray Engineering Co., Ltd.,Shiga,Japan"],"affiliations":[{"raw_affiliation_string":"Toray Engineering Co., Ltd.,Shiga,Japan","institution_ids":["https://openalex.org/I4210115317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111448564","display_name":"T. M. Hare","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115317","display_name":"Toray Industries, Inc. (Japan)","ror":"https://ror.org/029xh1r47","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210115317"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takashi Hare","raw_affiliation_strings":["Toray Engineering Co., Ltd.,Shiga,Japan"],"affiliations":[{"raw_affiliation_string":"Toray Engineering Co., Ltd.,Shiga,Japan","institution_ids":["https://openalex.org/I4210115317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046776334","display_name":"Fumihiro Inoue","orcid":"https://orcid.org/0000-0003-2292-846X"},"institutions":[{"id":"https://openalex.org/I180203408","display_name":"Yokohama National University","ror":"https://ror.org/03zyp6p76","country_code":"JP","type":"education","lineage":["https://openalex.org/I180203408"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Fumihiro Inoue","raw_affiliation_strings":["Yokohama National University,Yokohama,Japan"],"affiliations":[{"raw_affiliation_string":"Yokohama National University,Yokohama,Japan","institution_ids":["https://openalex.org/I180203408"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068817003","display_name":"Akira Uedono","orcid":"https://orcid.org/0000-0001-6224-4869"},"institutions":[{"id":"https://openalex.org/I146399215","display_name":"University of Tsukuba","ror":"https://ror.org/02956yf07","country_code":"JP","type":"education","lineage":["https://openalex.org/I146399215"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akira Uedono","raw_affiliation_strings":["University of Tsukuba,Ibaraki,Japan"],"affiliations":[{"raw_affiliation_string":"University of Tsukuba,Ibaraki,Japan","institution_ids":["https://openalex.org/I146399215"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5103728835"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.222,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.57157664,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.9926000237464905,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7251265645027161},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.7148320078849792},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.7147044539451599},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5789029598236084},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5663148164749146},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5519831776618958},{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.49758055806159973},{"id":"https://openalex.org/keywords/thermocompression-bonding","display_name":"Thermocompression bonding","score":0.4927850067615509},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.4652218818664551},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39594680070877075},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3490805923938751},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.30563440918922424},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2256908416748047},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.09188908338546753},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.06139570474624634}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7251265645027161},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.7148320078849792},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.7147044539451599},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5789029598236084},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5663148164749146},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5519831776618958},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.49758055806159973},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.4927850067615509},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.4652218818664551},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39594680070877075},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3490805923938751},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.30563440918922424},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2256908416748047},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09188908338546753},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06139570474624634}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic63395.2024.10830177","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830177","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1871938770","https://openalex.org/W2204836914","https://openalex.org/W2555891198","https://openalex.org/W2585597896","https://openalex.org/W3187148842","https://openalex.org/W4206738820","https://openalex.org/W4285103053","https://openalex.org/W4385517094","https://openalex.org/W4385541835","https://openalex.org/W4392905411","https://openalex.org/W4400033973","https://openalex.org/W4400034197","https://openalex.org/W4400063887"],"related_works":["https://openalex.org/W4289175612","https://openalex.org/W2066177426","https://openalex.org/W1990895528","https://openalex.org/W2625018053","https://openalex.org/W4249684911","https://openalex.org/W4292829104","https://openalex.org/W1580942132","https://openalex.org/W2070720201","https://openalex.org/W2952830176","https://openalex.org/W2090223096"],"abstract_inverted_index":{"The":[0],"role":[1],"of":[2,15,18,66],"metal":[3,35,71],"density":[4,36],"around":[5],"fiducial":[6,39],"marks":[7],"(used":[8],"for":[9],"chip":[10],"alignment)":[11],"on":[12],"the":[13,34,38,42,57,63,79],"quality":[14],"chemical-mechanical-planarization":[16],"(CMP)":[17],"Cu":[19,43,67],"bond-pads/electrodes":[20,44,68],"has":[21,46],"been":[22],"meticulously":[23],"studied":[24],"via":[25],"two":[26],"different":[27],"layout":[28],"designs.":[29],"A":[30],"gradual":[31],"increase":[32],"in":[33,48],"between":[37],"mark":[40],"and":[41,81],"region":[45],"resulted":[47],"improved":[49],"Cu-":[50],"CMP":[51],"quality.":[52],"We":[53],"have":[54],"successfully":[55],"minimized":[56],"dishing":[58],"amount":[59],"as":[60,62],"well":[61],"erosion":[64],"quantity":[65],"through":[69],"optimized":[70],"density,":[72],"which":[73],"are":[74],"highly":[75],"important":[76],"to":[77],"realize":[78],"high-quality":[80],"high-yield":[82],"chip-to-wafer":[83],"hybrid":[84],"bonding.":[85]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}