{"id":"https://openalex.org/W4406355695","doi":"https://doi.org/10.1109/3dic63395.2024.10830136","title":"Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane","display_name":"Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane","publication_year":2024,"publication_date":"2024-09-25","ids":{"openalex":"https://openalex.org/W4406355695","doi":"https://doi.org/10.1109/3dic63395.2024.10830136"},"language":"en","primary_location":{"id":"doi:10.1109/3dic63395.2024.10830136","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830136","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5115873230","display_name":"Nemoto Daiki","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Nemoto Daiki","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025345975","display_name":"Kai Takeuchi","orcid":"https://orcid.org/0000-0002-5700-3662"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kai Takeuchi","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074618363","display_name":"Eiji Higurashi","orcid":"https://orcid.org/0000-0002-7154-4203"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Eiji Higurashi","raw_affiliation_strings":["Graduate School of Engineering, Tohoku University,Sendai,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku University,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5115873230"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.28263291,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.8701000213623047,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.8701000213623047,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6074755787849426},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.5490936040878296},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.536545991897583},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.46437516808509827},{"id":"https://openalex.org/keywords/bonding-strength","display_name":"Bonding strength","score":0.43478915095329285},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22639724612236023}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6074755787849426},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5490936040878296},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.536545991897583},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.46437516808509827},{"id":"https://openalex.org/C2984173401","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bonding strength","level":2,"score":0.43478915095329285},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22639724612236023}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic63395.2024.10830136","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic63395.2024.10830136","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/6","score":0.6899999976158142,"display_name":"Clean water and sanitation"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2068411714","https://openalex.org/W2978362045","https://openalex.org/W3118259113","https://openalex.org/W3164541929","https://openalex.org/W4387186625","https://openalex.org/W4390838420"],"related_works":["https://openalex.org/W2053597733","https://openalex.org/W2765674533","https://openalex.org/W2228105431","https://openalex.org/W2073096817","https://openalex.org/W2488020685","https://openalex.org/W3043339446","https://openalex.org/W2540312267","https://openalex.org/W4405180575","https://openalex.org/W2001320522","https://openalex.org/W790172873"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"we":[3],"investigate":[4],"the":[5,66],"effect":[6],"of":[7],"plasma":[8,44,51,60,71],"hydrophilic":[9],"treatment":[10,45,52,72],"on":[11],"room":[12,37,90],"temperature":[13,38],"wafer":[14,39,87],"bonding":[15,20,40,83,88],"using":[16],"perhydropolysilazane":[17],"(PHPS).":[18],"Wafer":[19],"is":[21],"a":[22,34],"critical":[23],"technique":[24],"for":[25,36],"electronics":[26],"packaging,":[27],"including":[28],"hybrid":[29],"bonding.":[30],"This":[31],"paper":[32],"presents":[33],"method":[35,84],"via":[41],"PHPS,":[42],"where":[43],"improves":[46],"bond":[47,55,79],"strength.":[48,80],"Notably,":[49],"N2":[50],"achieves":[53],"higher":[54],"strength":[56],"compared":[57],"to":[58],"O2":[59],"treatment.":[61],"Surface":[62],"analysis":[63],"suggests":[64],"that":[65],"adsorbed":[67],"water":[68],"introduced":[69],"by":[70],"plays":[73],"an":[74],"important":[75],"role":[76],"in":[77],"enhancing":[78],"The":[81],"proposed":[82],"facilitates":[85],"high-strength":[86],"at":[89],"temperature.":[91]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}