{"id":"https://openalex.org/W4210650863","doi":"https://doi.org/10.1109/3dic52383.2021.9687609","title":"Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions","display_name":"Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions","publication_year":2021,"publication_date":"2021-10-01","ids":{"openalex":"https://openalex.org/W4210650863","doi":"https://doi.org/10.1109/3dic52383.2021.9687609"},"language":"en","primary_location":{"id":"doi:10.1109/3dic52383.2021.9687609","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687609","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028492563","display_name":"Liangxing Hu","orcid":"https://orcid.org/0000-0003-4477-8327"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Liangxing Hu","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034350038","display_name":"Simon Chun Kiat Goh","orcid":"https://orcid.org/0000-0002-6833-2920"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Simon Chun Kiat Goh","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081504270","display_name":"Yu Dian Lim","orcid":"https://orcid.org/0000-0003-4188-997X"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Yu Dian Lim","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086474111","display_name":"Peng Zhao","orcid":"https://orcid.org/0000-0002-4850-9354"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Peng Zhao","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104457770","display_name":"Michael Joo Zhong Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Michael Joo Zhong Lim","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5042727705","display_name":"Chuan Seng Tan","orcid":"https://orcid.org/0000-0003-1250-9165"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Chuan Seng Tan","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I172675005"],"apc_list":null,"apc_paid":null,"fwci":2.849,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.92378984,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/passivation","display_name":"Passivation","score":0.6116019487380981},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.5644087195396423},{"id":"https://openalex.org/keywords/contact-angle","display_name":"Contact angle","score":0.5084482431411743},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5061547160148621},{"id":"https://openalex.org/keywords/x-ray-photoelectron-spectroscopy","display_name":"X-ray photoelectron spectroscopy","score":0.49163466691970825},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.46737995743751526},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.3787543773651123},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3635371923446655},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.3565446734428406},{"id":"https://openalex.org/keywords/nuclear-chemistry","display_name":"Nuclear chemistry","score":0.335543692111969},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.32273292541503906},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.29481637477874756},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2547529935836792},{"id":"https://openalex.org/keywords/organic-chemistry","display_name":"Organic chemistry","score":0.21843400597572327},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.06893005967140198}],"concepts":[{"id":"https://openalex.org/C33574316","wikidata":"https://www.wikidata.org/wiki/Q917260","display_name":"Passivation","level":3,"score":0.6116019487380981},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5644087195396423},{"id":"https://openalex.org/C6556556","wikidata":"https://www.wikidata.org/wiki/Q899239","display_name":"Contact angle","level":2,"score":0.5084482431411743},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5061547160148621},{"id":"https://openalex.org/C175708663","wikidata":"https://www.wikidata.org/wiki/Q899559","display_name":"X-ray photoelectron spectroscopy","level":2,"score":0.49163466691970825},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.46737995743751526},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.3787543773651123},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3635371923446655},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.3565446734428406},{"id":"https://openalex.org/C13965031","wikidata":"https://www.wikidata.org/wiki/Q243545","display_name":"Nuclear chemistry","level":1,"score":0.335543692111969},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.32273292541503906},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.29481637477874756},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2547529935836792},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.21843400597572327},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.06893005967140198}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic52383.2021.9687609","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687609","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320696","display_name":"Agency for Science, Technology and Research","ror":"https://ror.org/036wvzt09"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W87133106","https://openalex.org/W1979542923","https://openalex.org/W1997220400","https://openalex.org/W2012810914","https://openalex.org/W2064390073","https://openalex.org/W2082247553","https://openalex.org/W2162856332","https://openalex.org/W2407553341","https://openalex.org/W2512792470","https://openalex.org/W2767940321","https://openalex.org/W2791308900","https://openalex.org/W2896346418","https://openalex.org/W2958102891","https://openalex.org/W3016001356","https://openalex.org/W3089155070","https://openalex.org/W3091885349","https://openalex.org/W3188200354","https://openalex.org/W3213027837","https://openalex.org/W4230196767"],"related_works":["https://openalex.org/W2893117232","https://openalex.org/W2368982584","https://openalex.org/W957405543","https://openalex.org/W2100154643","https://openalex.org/W81629128","https://openalex.org/W2326159057","https://openalex.org/W2390206784","https://openalex.org/W3034740403","https://openalex.org/W2358296720","https://openalex.org/W1970133672"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"we":[3],"study":[4],"multi-die":[5],"to":[6],"wafer":[7,102],"bonding":[8,13,118,122],"through":[9],"plasma-activated":[10],"Cu-Cu":[11],"direct":[12],"carried":[14],"out":[15],"at":[16,103,111],"room":[17,104],"temperature":[18,105],"in":[19,106],"cleanroom":[20],"ambient":[21,107],"conditions.":[22],"During":[23],"the":[24,45,48,56,69,84,90],"pre-bonding":[25],"phase,":[26],"surface":[27,30,32,38,59,66],"analyses":[28],"(e.g.":[29],"profile,":[31],"roughness,":[33],"water":[34,62],"contact":[35,63],"angle":[36,64],"and":[37,47,65,109,132],"chemical":[39],"states)":[40],"are":[41,98],"performed":[42],"on":[43,83],"both":[44],"as-deposited":[46,70],"Ar/N2plasma-activated":[49,57,85,96],"Cu":[50,58,71,86,92],"surfaces.":[51],"It":[52],"is":[53,81,119],"found":[54],"that":[55],"has":[60],"lower":[61],"roughness":[67],"than":[68],"surface.":[72],"From":[73],"XPS,":[74],"a":[75,101],"thin":[76],"passivation":[77],"layer":[78],"of":[79],"CUxN":[80],"produced":[82],"surface,":[87],"which":[88],"prevents":[89],"activated":[91],"from":[93],"oxidation.":[94],"The":[95],"dies":[97],"bonded":[99],"onto":[100],"conditions":[108],"annealed":[110],"300\u00b0C":[112],"for":[113,127],"1":[114],"hour,":[115],"where":[116],"successful":[117],"achieved.":[120],"This":[121],"scheme":[123],"shows":[124],"promising":[125],"features":[126],"high-throughput":[128],"advanced":[129],"3D":[130],"packaging":[131],"heterogeneous":[133],"integration.":[134]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":3}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}