{"id":"https://openalex.org/W3214569161","doi":"https://doi.org/10.1109/3dic52383.2021.9687606","title":"Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect","display_name":"Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect","publication_year":2021,"publication_date":"2021-10-01","ids":{"openalex":"https://openalex.org/W3214569161","doi":"https://doi.org/10.1109/3dic52383.2021.9687606","mag":"3214569161"},"language":"en","primary_location":{"id":"doi:10.1109/3dic52383.2021.9687606","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687606","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://kyutech.repo.nii.ac.jp/records/7604","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081091581","display_name":"Shinei Miyasaka","orcid":null},"institutions":[{"id":"https://openalex.org/I207014233","display_name":"Kyushu Institute of Technology","ror":"https://ror.org/02278tr80","country_code":"JP","type":"education","lineage":["https://openalex.org/I207014233"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Shinei Miyasaka","raw_affiliation_strings":["Graduate school of Kyushu Institute of Technology,Fukuoka,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate school of Kyushu Institute of Technology,Fukuoka,Japan","institution_ids":["https://openalex.org/I207014233"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5024030146","display_name":"Satoshi Matumoto","orcid":null},"institutions":[{"id":"https://openalex.org/I207014233","display_name":"Kyushu Institute of Technology","ror":"https://ror.org/02278tr80","country_code":"JP","type":"education","lineage":["https://openalex.org/I207014233"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Satoshi Matumoto","raw_affiliation_strings":["Kyushu Insitute of Technology,Fukuoka,Japan"],"affiliations":[{"raw_affiliation_string":"Kyushu Insitute of Technology,Fukuoka,Japan","institution_ids":["https://openalex.org/I207014233"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5081091581"],"corresponding_institution_ids":["https://openalex.org/I207014233"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14032897,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"27","issue":"183","first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9817000031471252,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9817000031471252,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5860280394554138},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5492250919342041},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45735329389572144},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32613688707351685},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29581084847450256},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.18518763780593872},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13877344131469727}],"concepts":[{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5860280394554138},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5492250919342041},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45735329389572144},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32613688707351685},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29581084847450256},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.18518763780593872},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13877344131469727},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/3dic52383.2021.9687606","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687606","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:irdb.nii.ac.jp:01216:0005280277","is_oa":true,"landing_page_url":"https://kyutech.repo.nii.ac.jp/records/7604","pdf_url":null,"source":{"id":"https://openalex.org/S7407056385","display_name":"Institutional Repositories DataBase (IRDB)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I184597095","host_organization_name":"National Institute of Informatics","host_organization_lineage":["https://openalex.org/I184597095"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"journal article"},{"id":"pmh:oai:kyutech.repo.nii.ac.jp:00007604","is_oa":false,"landing_page_url":"http://hdl.handle.net/10228/00008807","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"AM"},{"id":"mag:3214569161","is_oa":false,"landing_page_url":"https://www.ieice.org/ken/paper/20211006DC5A/eng/","pdf_url":null,"source":{"id":"https://openalex.org/S4306512848","display_name":"IEICE Technical Report; IEICE Tech. Rep.","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEICE Technical Report; IEICE Tech. Rep.","raw_type":null}],"best_oa_location":{"id":"pmh:oai:irdb.nii.ac.jp:01216:0005280277","is_oa":true,"landing_page_url":"https://kyutech.repo.nii.ac.jp/records/7604","pdf_url":null,"source":{"id":"https://openalex.org/S7407056385","display_name":"Institutional Repositories DataBase (IRDB)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I184597095","host_organization_name":"National Institute of Informatics","host_organization_lineage":["https://openalex.org/I184597095"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"journal article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.699999988079071}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2595419678"],"related_works":[],"abstract_inverted_index":{"3D":[0,27],"Power-SoC":[1,28],"(Supply":[2],"on":[3,23],"Chip),":[4],"which":[5],"can":[6],"ultimately":[7],"miniaturize":[8],"the":[9,57,67,71,75,86,90],"power":[10,18,40,44,58,76],"supply,":[11],"is":[12,45,53,63],"attracted":[13],"attentions.":[14],"It":[15],"integrates":[16],"Si-LSIs,":[17],"devices":[19],"and":[20],"passive":[21],"elements":[22],"a":[24,37],"single":[25],"chip.":[26],"requires":[29],"frequencies":[30],"above":[31],"30MHz.":[32],"In":[33,81],"addition,":[34],"it":[35,62],"realizes":[36],"very":[38],"high":[39],"density,":[41],"however":[42],"handling":[43],"small":[46],"because":[47],"of":[48,70,89],"miniaturization.":[49],"Therefore,":[50,61],"parallel":[51],"connection":[52],"required":[54],"to":[55,65],"increase":[56],"handing":[59],"capacity.":[60],"necessary":[64],"consider":[66],"proximity":[68,87],"effect":[69,88],"spiral":[72],"inductor":[73,91],"when":[74],"supplies":[77],"connected":[78],"in":[79],"parallel.":[80],"this":[82],"paper,":[83],"we":[84],"report":[85],"through":[92],"simulations.":[93]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}