{"id":"https://openalex.org/W4210656442","doi":"https://doi.org/10.1109/3dic52383.2021.9687604","title":"Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications","display_name":"Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications","publication_year":2021,"publication_date":"2021-10-01","ids":{"openalex":"https://openalex.org/W4210656442","doi":"https://doi.org/10.1109/3dic52383.2021.9687604"},"language":"en","primary_location":{"id":"doi:10.1109/3dic52383.2021.9687604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687604","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"M. Murugesan","raw_affiliation_strings":["GINTI, NICHe, Tohoku Univ.,Sendai,Japan","GINTI, NICHe, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"GINTI, NICHe, Tohoku Univ.,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"GINTI, NICHe, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024207022","display_name":"Eli D. Sone","orcid":"https://orcid.org/0000-0001-7087-473X"},"institutions":[{"id":"https://openalex.org/I860314941","display_name":"JGC (Japan)","ror":"https://ror.org/023s2h905","country_code":"JP","type":"company","lineage":["https://openalex.org/I860314941"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"E. Sone","raw_affiliation_strings":["JCU Corporation,Japan","JCU Corporation, Japan"],"affiliations":[{"raw_affiliation_string":"JCU Corporation,Japan","institution_ids":["https://openalex.org/I860314941"]},{"raw_affiliation_string":"JCU Corporation, Japan","institution_ids":["https://openalex.org/I860314941"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016661688","display_name":"A. Simomura","orcid":null},"institutions":[{"id":"https://openalex.org/I860314941","display_name":"JGC (Japan)","ror":"https://ror.org/023s2h905","country_code":"JP","type":"company","lineage":["https://openalex.org/I860314941"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"A. Simomura","raw_affiliation_strings":["JCU Corporation,Japan","JCU Corporation, Japan"],"affiliations":[{"raw_affiliation_string":"JCU Corporation,Japan","institution_ids":["https://openalex.org/I860314941"]},{"raw_affiliation_string":"JCU Corporation, Japan","institution_ids":["https://openalex.org/I860314941"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020882973","display_name":"Mitsuru Motoyoshi","orcid":"https://orcid.org/0000-0001-8705-5757"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. Motoyoshi","raw_affiliation_strings":["T-Micro,Sendai,Japan","T-Micro, Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"T-Micro,Sendai,Japan","institution_ids":[]},{"raw_affiliation_string":"T-Micro, Sendai, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029664118","display_name":"M. Sawa","orcid":"https://orcid.org/0000-0002-3309-2584"},"institutions":[{"id":"https://openalex.org/I860314941","display_name":"JGC (Japan)","ror":"https://ror.org/023s2h905","country_code":"JP","type":"company","lineage":["https://openalex.org/I860314941"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Sawa","raw_affiliation_strings":["JCU Corporation,Japan","JCU Corporation, Japan"],"affiliations":[{"raw_affiliation_string":"JCU Corporation,Japan","institution_ids":["https://openalex.org/I860314941"]},{"raw_affiliation_string":"JCU Corporation, Japan","institution_ids":["https://openalex.org/I860314941"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100632207","display_name":"Kenji Fukuda","orcid":"https://orcid.org/0000-0003-4789-5203"},"institutions":[{"id":"https://openalex.org/I860314941","display_name":"JGC (Japan)","ror":"https://ror.org/023s2h905","country_code":"JP","type":"company","lineage":["https://openalex.org/I860314941"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Fukuda","raw_affiliation_strings":["JCU Corporation,Japan","JCU Corporation, Japan"],"affiliations":[{"raw_affiliation_string":"JCU Corporation,Japan","institution_ids":["https://openalex.org/I860314941"]},{"raw_affiliation_string":"JCU Corporation, Japan","institution_ids":["https://openalex.org/I860314941"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["T-Micro,Sendai,Japan","T-Micro, Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"T-Micro,Sendai,Japan","institution_ids":[]},{"raw_affiliation_string":"T-Micro, Sendai, Japan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["GINTI, NICHe, Tohoku Univ.,Sendai,Japan","GINTI, NICHe, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"GINTI, NICHe, Tohoku Univ.,Sendai,Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"GINTI, NICHe, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5101440058"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.5014,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.65234476,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6452630758285522},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.6293210983276367},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.6070031523704529},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.5796183943748474},{"id":"https://openalex.org/keywords/tensile-testing","display_name":"Tensile testing","score":0.514116108417511},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.5019533634185791},{"id":"https://openalex.org/keywords/ultimate-tensile-strength","display_name":"Ultimate tensile strength","score":0.45968860387802124},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.4388481378555298},{"id":"https://openalex.org/keywords/crystallography","display_name":"Crystallography","score":0.4258463382720947},{"id":"https://openalex.org/keywords/vickers-hardness-test","display_name":"Vickers hardness test","score":0.414877325296402},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.41038355231285095},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.31908804178237915},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.264945387840271},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.1979975402355194},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.19645047187805176},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.08123689889907837}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6452630758285522},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.6293210983276367},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.6070031523704529},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.5796183943748474},{"id":"https://openalex.org/C182508753","wikidata":"https://www.wikidata.org/wiki/Q115605","display_name":"Tensile testing","level":3,"score":0.514116108417511},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5019533634185791},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.45968860387802124},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4388481378555298},{"id":"https://openalex.org/C8010536","wikidata":"https://www.wikidata.org/wiki/Q160398","display_name":"Crystallography","level":1,"score":0.4258463382720947},{"id":"https://openalex.org/C133392424","wikidata":"https://www.wikidata.org/wiki/Q223404","display_name":"Vickers hardness test","level":3,"score":0.414877325296402},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.41038355231285095},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.31908804178237915},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.264945387840271},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.1979975402355194},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.19645047187805176},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08123689889907837},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic52383.2021.9687604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687604","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1523236647","https://openalex.org/W2015056380","https://openalex.org/W2046304468","https://openalex.org/W2056768573","https://openalex.org/W2063114735","https://openalex.org/W2078744349","https://openalex.org/W2143957817","https://openalex.org/W2553006073","https://openalex.org/W2673295456","https://openalex.org/W2776953948","https://openalex.org/W2951801197","https://openalex.org/W2971335276","https://openalex.org/W3048204750","https://openalex.org/W3094177504","https://openalex.org/W3202865710"],"related_works":["https://openalex.org/W4240267549","https://openalex.org/W1987487801","https://openalex.org/W3032175699","https://openalex.org/W1969147243","https://openalex.org/W2996028241","https://openalex.org/W1968611243","https://openalex.org/W3195120266","https://openalex.org/W793395763","https://openalex.org/W4311039263","https://openalex.org/W4210656442"],"abstract_inverted_index":{"The":[0,44,53],"effect":[1],"of":[2,13,32],"an":[3],"extremely":[4],"large":[5,37],"and":[6,56,65],"relatively":[7,49],"ordered":[8],"Cu":[9,38,71],"grains":[10,39,76],"the":[11,30,70,74,78],"yield":[12],"Cu-Cu":[14,41,79],"direct":[15,42],"bonding":[16],"was":[17],"investigated.":[18],"Our":[19],"modified":[20],"electroplating":[21],"process":[22],"followed":[23],"by":[24],"post":[25],"processing":[26],"has":[27],"resulted":[28],"into":[29],"formation":[31,48],"10\u201315":[33],"<tex":[34],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[35],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$\\mu\\mathrm{m}$</tex>":[36],"before":[40],"bonding.":[43,81],"microstructural":[45],"evaluation":[46],"showed":[47],"(100)":[50],"oriented":[51,75],"Cu-grains.":[52],"less":[54],"hard":[55],"strain-suppressed":[57],"Cu-grains":[58],"as":[59],"inferred":[60],"from":[61],"respectively,":[62],"Vickers":[63],"hardness":[64],"tensile":[66],"test":[67],"highly":[68],"facilitates":[69],"diffusion":[72],"across":[73],"during":[77],"direct/hybrid":[80]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}