{"id":"https://openalex.org/W4210609148","doi":"https://doi.org/10.1109/3dic52383.2021.9687599","title":"3D interconnection using copper direct hybrid bonding for GaN on silicon wafer","display_name":"3D interconnection using copper direct hybrid bonding for GaN on silicon wafer","publication_year":2021,"publication_date":"2021-10-01","ids":{"openalex":"https://openalex.org/W4210609148","doi":"https://doi.org/10.1109/3dic52383.2021.9687599"},"language":"en","primary_location":{"id":"doi:10.1109/3dic52383.2021.9687599","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687599","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088921208","display_name":"Christophe Dubarry","orcid":"https://orcid.org/0000-0002-6604-2997"},"institutions":[{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"C. Dubarry","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112967532","display_name":"L. Arnaud","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Arnaud","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104028368","display_name":"M. L. Calvo Munoz","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"M. L. Calvo Munoz","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033402482","display_name":"Ga\u00eblle Mauguen","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"G. Mauguen","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036400103","display_name":"S. Moreau","orcid":"https://orcid.org/0000-0001-6104-2050"},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Moreau","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044023419","display_name":"Romain Crochemore","orcid":null},"institutions":[{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"R. Crochemore","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050332658","display_name":"N. Bresson","orcid":null},"institutions":[{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"N. Bresson","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5021890806","display_name":"Bernard Aventurier","orcid":null},"institutions":[{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B. Aventurier","raw_affiliation_strings":["Univ. Grenoble Alpes, CEA LETI,Grenoble,France","Univ. Grenoble Alpes, CEA LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI,Grenoble,France","institution_ids":["https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I2738703131","https://openalex.org/I899635006"]},{"raw_affiliation_string":"Univ. Grenoble Alpes, CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I899635006","https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5088921208"],"corresponding_institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"],"apc_list":null,"apc_paid":null,"fwci":0.5014,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.65233536,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7288075089454651},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5726630091667175},{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.5461041927337646},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5248900651931763},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4935547113418579},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.491958349943161},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.44945257902145386},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4214813709259033},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3275901675224304},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.28693509101867676},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.26878827810287476},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.13898533582687378},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12073272466659546},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11474570631980896}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7288075089454651},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5726630091667175},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.5461041927337646},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5248900651931763},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4935547113418579},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.491958349943161},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.44945257902145386},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4214813709259033},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3275901675224304},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.28693509101867676},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.26878827810287476},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.13898533582687378},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12073272466659546},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11474570631980896},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic52383.2021.9687599","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic52383.2021.9687599","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:cea-04521702v1","is_oa":false,"landing_page_url":"https://cea.hal.science/cea-04521702","pdf_url":null,"source":{"id":"https://openalex.org/S4406922461","display_name":"SPIRE - Sciences Po Institutional REpository","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"3DIC 2021 - IEEE International 3D Systems Integration Conference, Oct 2021, Raleigh, United States. &#x27E8;10.1109/3DIC52383.2021.9687599&#x27E9;","raw_type":"Conference papers"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4300000071525574,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2070539204","https://openalex.org/W2083657955","https://openalex.org/W2792423839","https://openalex.org/W2800597541","https://openalex.org/W2911774253","https://openalex.org/W2941965279","https://openalex.org/W3015890648","https://openalex.org/W3130997603","https://openalex.org/W3166878629","https://openalex.org/W4243729171"],"related_works":["https://openalex.org/W2058666584","https://openalex.org/W2348452527","https://openalex.org/W749211866","https://openalex.org/W1992595509","https://openalex.org/W2041651538","https://openalex.org/W2030799362","https://openalex.org/W1991753396","https://openalex.org/W2122109943","https://openalex.org/W4226027024","https://openalex.org/W2053597733"],"abstract_inverted_index":{"3D":[0,50],"integration":[1],"of":[2,23,40,60,78,107],"wafers":[3,26],"stacking":[4],"is":[5],"obtained":[6],"with":[7,36,56,82,89,145],"a":[8,37,53,57,108,112,126],"GaN-based":[9],"wafer":[10,81],"integrated":[11],"on":[12],"Si":[13],"substrate":[14,77],"and":[15,83,104,121],"CMOS":[16,80],"wafer.":[17],"In":[18],"this":[19],"study,":[20],"after":[21],"planarization":[22],"the":[24,28,75,79,96,99],"incoming":[25],"prior":[27],"bonding,":[29],"wafer-to-wafer":[30],"hybrid":[31,114],"bonding":[32,115,136],"technology":[33],"was":[34,87],"provided":[35],"mirror":[38],"design":[39],"Cu":[41,71],"patterns":[42],"embedded":[43],"in":[44,52,92],"silica":[45],"matrix":[46],"to":[47,94,98],"provide":[48],"direct":[49],"links":[51],"face-to-face":[54],"scheme":[55],"low":[58],"pitch":[59],"3":[61],"<tex":[62,68],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[63,69,130,134],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$\\mu\\mathrm{m}$</tex>":[64,70],".":[65],"Then,":[66],"1":[67],"TSV-last":[72],"patterned":[73],"through":[74],"SOI":[76],"AlCu":[84],"routing":[85],"lines":[86],"followed":[88],"copper":[90],"pillars":[91],"order":[93],"connect":[95],"stack":[97],"package.":[100],"We":[101],"present":[102],"morphological":[103],"electrical":[105,146],"characterizations":[106],"test":[109],"vehicle":[110],"including":[111],"Cu/SiO2":[113],"interface.":[116],"Scanning":[117],"Acoustic":[118],"Microscopy,":[119],"FIB-SEM":[120],"TEM":[122],"cross-sections":[123],"demonstrated":[124],"both":[125],"perfect":[127],"SiO":[128],"<inf":[129,133],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</inf>":[131,135],"/SiO":[132],"as":[137,139],"well":[138],"an":[140],"excellent":[141],"Cu/Cu":[142],"connection":[143],"validated":[144],"data.":[147]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}