{"id":"https://openalex.org/W3015696552","doi":"https://doi.org/10.1109/3dic48104.2019.9058890","title":"Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration","display_name":"Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3015696552","doi":"https://doi.org/10.1109/3dic48104.2019.9058890","mag":"3015696552"},"language":"en","primary_location":{"id":"doi:10.1109/3dic48104.2019.9058890","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058890","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109071559","display_name":"Kwang\u2010Seong Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kwang-Seong Choi","raw_affiliation_strings":["ICT Creative Research Laboratory, ETRI, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ICT Creative Research Laboratory, ETRI, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052810591","display_name":"Yong\u2010Sung Eom","orcid":"https://orcid.org/0000-0002-5678-9093"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yong-Sung Eom","raw_affiliation_strings":["ICT Creative Research Laboratory, ETRI, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ICT Creative Research Laboratory, ETRI, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110635349","display_name":"Seok Hwan Moon","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seok Hwan Moon","raw_affiliation_strings":["ICT Creative Research Laboratory, ETRI, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ICT Creative Research Laboratory, ETRI, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068186791","display_name":"Jiho Joo","orcid":"https://orcid.org/0000-0003-2478-1908"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jiho Joo","raw_affiliation_strings":["ICT Creative Research Laboratory, ETRI, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ICT Creative Research Laboratory, ETRI, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012980889","display_name":"Kwangjoo Lee","orcid":"https://orcid.org/0000-0002-2747-7998"},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]},{"id":"https://openalex.org/I4387154587","display_name":"LG Chem (South Korea)","ror":"https://ror.org/04pjzv747","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kwangjoo Lee","raw_affiliation_strings":["R & D Campus, LG Chem, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"R & D Campus, LG Chem, Daejeon, Korea","institution_ids":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079732323","display_name":"Jung Hak Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]},{"id":"https://openalex.org/I4387154587","display_name":"LG Chem (South Korea)","ror":"https://ror.org/04pjzv747","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jung Hak Kim","raw_affiliation_strings":["R & D Campus, LG Chem, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"R & D Campus, LG Chem, Daejeon, Korea","institution_ids":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039362545","display_name":"Ju hyeon Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]},{"id":"https://openalex.org/I4387154587","display_name":"LG Chem (South Korea)","ror":"https://ror.org/04pjzv747","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ju hyeon Kim","raw_affiliation_strings":["R & D Campus, LG Chem, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"R & D Campus, LG Chem, Daejeon, Korea","institution_ids":["https://openalex.org/I4210131320","https://openalex.org/I4387154587"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.1211,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.51304933,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9864000082015991,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9799000024795532,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8229566812515259},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5330689549446106},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5191059112548828},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.4948956370353699},{"id":"https://openalex.org/keywords/fillet","display_name":"Fillet (mechanics)","score":0.4336807131767273},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4306355118751526},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4101964235305786},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4054469168186188},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21213588118553162},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.17901307344436646},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.15032300353050232}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8229566812515259},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5330689549446106},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5191059112548828},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.4948956370353699},{"id":"https://openalex.org/C121646663","wikidata":"https://www.wikidata.org/wiki/Q1624058","display_name":"Fillet (mechanics)","level":2,"score":0.4336807131767273},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4306355118751526},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4101964235305786},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4054469168186188},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21213588118553162},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.17901307344436646},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.15032300353050232},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic48104.2019.9058890","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058890","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2008613919","https://openalex.org/W2081399724","https://openalex.org/W2218115836","https://openalex.org/W2513737807","https://openalex.org/W2516079558","https://openalex.org/W2886418502"],"related_works":["https://openalex.org/W2367566533","https://openalex.org/W2187937315","https://openalex.org/W1983256527","https://openalex.org/W2297830036","https://openalex.org/W2113862045","https://openalex.org/W2384038313","https://openalex.org/W2378851622","https://openalex.org/W2349280512","https://openalex.org/W2145103798","https://openalex.org/W3094224064"],"abstract_inverted_index":{"Laser-Assisted":[0],"Bonding":[1],"with":[2,6,71,115],"Compression":[3],"(LABC)":[4],"technology":[5],"NCF":[7,51,134],"was":[8,27,54],"proposed":[9],"to":[10,29,33,56,64],"accomplish":[11],"the":[12,18,34,43,46,78,83,91,116,131],"productivity":[13],"and":[14,63,68,74,112,121,133],"process":[15],"reliability":[16],"at":[17],"same":[19],"time.":[20],"A":[21],"quartz":[22],"block":[23],"as":[24,87],"a":[25,31,60,88,106],"header":[26],"used":[28,86],"deliver":[30],"pressure":[32],"devices":[35],"because":[36],"of":[37,42,119,124],"its":[38],"extremely":[39],"low":[40],"absorption":[41],"laser":[44,84],"during":[45,77],"bonding":[47,80],"process.":[48,81],"Newly":[49],"developed":[50],"for":[52],"LABC":[53,79,132],"designed":[55],"have":[57],"stability":[58],"on":[59,97,103],"hot":[61],"stage":[62],"show":[65],"solder":[66],"wetting":[67],"fast":[69],"curing":[70],"no":[72],"void":[73],"optimal":[75],"fillet":[76],"As":[82],"is":[85],"heat":[89,93],"source,":[90],"uniform":[92],"should":[94],"be":[95],"provided":[96],"each":[98],"interconnection":[99],"without":[100],"any":[101],"damages":[102],"chip":[104],"or":[105],"substrate.":[107],"780\u03bc-thick":[108],"daisy":[109],"chain":[110],"top":[111],"bottom":[113],"chips":[114],"minimum":[117],"pitch":[118],"30^m":[120],"bump":[122],"number":[123],"about":[125],"27,000":[126],"were":[127],"successfully":[128],"bonded":[129],"using":[130],"film.":[135]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}