{"id":"https://openalex.org/W3016231909","doi":"https://doi.org/10.1109/3dic48104.2019.9058880","title":"Development of 3D-IC Embedded Flexible Hybrid System","display_name":"Development of 3D-IC Embedded Flexible Hybrid System","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3016231909","doi":"https://doi.org/10.1109/3dic48104.2019.9058880","mag":"3016231909"},"language":"en","primary_location":{"id":"doi:10.1109/3dic48104.2019.9058880","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058880","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100402783","display_name":"Sungho Lee","orcid":"https://orcid.org/0000-0002-6666-9191"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Sungho Lee","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084226105","display_name":"Yuki Susumago","orcid":"https://orcid.org/0000-0001-6110-7862"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuki Susumago","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108656036","display_name":"Zhengyang Qian","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Zhengyang Qian","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022430625","display_name":"Noriyuki Takahashi","orcid":"https://orcid.org/0000-0001-8448-4919"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Noriyuki Takahashi","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036200957","display_name":"Hisashi Kino","orcid":"https://orcid.org/0000-0001-9348-120X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hisashi Kino","raw_affiliation_strings":["The Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.1994,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.53488937,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"2019","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6602874994277954},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6464459896087646},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5830332040786743},{"id":"https://openalex.org/keywords/wearable-computer","display_name":"Wearable computer","score":0.4673745036125183},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.46135544776916504},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.4303605556488037},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.4113948941230774},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39985010027885437},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.36475062370300293},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.33911487460136414},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2660871744155884},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2473093867301941},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17759203910827637},{"id":"https://openalex.org/keywords/biomedical-engineering","display_name":"Biomedical engineering","score":0.11186924576759338},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.10691335797309875}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6602874994277954},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6464459896087646},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5830332040786743},{"id":"https://openalex.org/C150594956","wikidata":"https://www.wikidata.org/wiki/Q1334829","display_name":"Wearable computer","level":2,"score":0.4673745036125183},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.46135544776916504},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.4303605556488037},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.4113948941230774},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39985010027885437},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.36475062370300293},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.33911487460136414},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2660871744155884},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2473093867301941},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17759203910827637},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.11186924576759338},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.10691335797309875},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic48104.2019.9058880","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058880","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"mag:3045202513","is_oa":false,"landing_page_url":"https://jglobal.jst.go.jp/en/detail?JGLOBAL_ID=202002222790824229","pdf_url":null,"source":{"id":"https://openalex.org/S4306512817","display_name":"IEEE Conference Proceedings","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEEE Conference Proceedings","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2029038600","https://openalex.org/W2066935441","https://openalex.org/W2090514156","https://openalex.org/W2114682092","https://openalex.org/W2151613126","https://openalex.org/W2323734260","https://openalex.org/W2767528953","https://openalex.org/W2971163484"],"related_works":["https://openalex.org/W2146366317","https://openalex.org/W2070188681","https://openalex.org/W2041316527","https://openalex.org/W1969570385","https://openalex.org/W2970498257","https://openalex.org/W3066247946","https://openalex.org/W2036313051","https://openalex.org/W2164231539","https://openalex.org/W2082419378","https://openalex.org/W2544983870"],"abstract_inverted_index":{"We":[0],"have":[1],"fabricated":[2],"a":[3,13,27],"new":[4,65],"3D-IC":[5,33,49],"embedded":[6,50],"flexible":[7,28],"hybrid":[8],"system":[9],"(FHS)":[10],"based":[11],"on":[12],"Fan-Out":[14],"Wafer-Level":[15],"Packaging":[16],"(FOWLP).":[17],"The":[18,42,64],"unique":[19],"FHS":[20,51,66],"structure":[21],"is":[22],"consisting":[23],"of":[24,47],"PDMS":[25],"as":[26,73],"substrate":[29],"in":[30],"which":[31],"the":[32,48,60],"with":[34,59],"through-Si":[35],"vias":[36],"(TSVs)":[37],"and":[38,44],"microbumps":[39],"are":[40,52],"embedded.":[41],"mechanical":[43],"electrical":[45],"properties":[46],"characterized":[53],"by":[54],"using":[55],"repeated":[56],"bending":[57],"test":[58],"TSV/microbump":[61],"daisy":[62],"chains.":[63],"can":[67],"be":[68,71],"expected":[69],"to":[70],"used":[72],"high-performance":[74],"wearable":[75],"device":[76],"systems":[77],"for":[78],"biomedical":[79],"applications.":[80]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":2}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}