{"id":"https://openalex.org/W3015861834","doi":"https://doi.org/10.1109/3dic48104.2019.9058870","title":"Protective Layer for Collective Die to Wafer Hybrid Bonding","display_name":"Protective Layer for Collective Die to Wafer Hybrid Bonding","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3015861834","doi":"https://doi.org/10.1109/3dic48104.2019.9058870","mag":"3015861834"},"language":"en","primary_location":{"id":"doi:10.1109/3dic48104.2019.9058870","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058870","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5046776334","display_name":"Fumihiro Inoue","orcid":"https://orcid.org/0000-0003-2292-846X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"Fumihiro Inoue","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031982015","display_name":"Julien Bertheau","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Julien Bertheau","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022317604","display_name":"Samuel Suhard","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Samuel Suhard","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031627498","display_name":"Alain Phommahaxay","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Alain Phommahaxay","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029723876","display_name":"Takuya Ohashi","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Takuya Ohashi","raw_affiliation_strings":["Tokyo Ohka Kogyo co. ltd, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Tokyo Ohka Kogyo co. ltd, Tokyo, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045488425","display_name":"Tetsuro Kinoshita","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tetsuro Kinoshita","raw_affiliation_strings":["Tokyo Ohka Kogyo co. ltd, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Tokyo Ohka Kogyo co. ltd, Tokyo, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110425469","display_name":"Yohei Kinoshita","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yohei Kinoshita","raw_affiliation_strings":["Tokyo Ohka Kogyo co. ltd, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Tokyo Ohka Kogyo co. ltd, Tokyo, Japan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Eric Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5046776334"],"corresponding_institution_ids":["https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":0.8346,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.75000974,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.9795793294906616},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7838864326477051},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.6418607234954834},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.558411180973053},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5278748869895935},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5224727392196655},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.4901641309261322},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.45486822724342346},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4077543318271637},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3002488613128662},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22485345602035522}],"concepts":[{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.9795793294906616},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7838864326477051},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.6418607234954834},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.558411180973053},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5278748869895935},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5224727392196655},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.4901641309261322},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.45486822724342346},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4077543318271637},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3002488613128662},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22485345602035522}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic48104.2019.9058870","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058870","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2064390073","https://openalex.org/W2317953216","https://openalex.org/W2529942914","https://openalex.org/W2534959668","https://openalex.org/W2582052118","https://openalex.org/W2585597896","https://openalex.org/W2785863405","https://openalex.org/W2800843565","https://openalex.org/W2892358775","https://openalex.org/W2941965279","https://openalex.org/W2951295197","https://openalex.org/W2970163035","https://openalex.org/W2970266003","https://openalex.org/W2971335276"],"related_works":["https://openalex.org/W327425532","https://openalex.org/W293942573","https://openalex.org/W2168348385","https://openalex.org/W4213132161","https://openalex.org/W2017722595","https://openalex.org/W2970266003","https://openalex.org/W4281685712","https://openalex.org/W2004857665","https://openalex.org/W2331745693","https://openalex.org/W2757101255"],"abstract_inverted_index":{"Blade":[0],"dicing":[1,37,74],"compatible":[2],"particle":[3,75],"protective":[4,25,76,95],"layer":[5,26,77,96],"is":[6],"investigated":[7],"for":[8,31,65,104],"feasibility":[9],"study":[10],"of":[11,102],"collective":[12,66,80,105],"Die-to-":[13],"Wafer":[14],"(D2W)":[15],"direct":[16,70,84],"bonding.":[17,71],"Having":[18],"the":[19,24,43,73],"compatibility":[20],"to":[21,28,41,68,82,107],"blade":[22,36],"dicing,":[23],"needs":[27],"be":[29],"insoluble":[30,60],"de-ionized":[32],"water":[33,40],"(DIW),":[34],"because":[35],"requires":[38],"cooling":[39],"maintain":[42],"cutting":[44],"performance.":[45],"Therefore,":[46],"polymers":[47],"soluble":[48],"in":[49,61],"alkaline":[50],"solutions":[51],"(e.g.":[52],"TMAH,":[53],"NH":[54],"<sub":[55],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[56],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">4</sub>":[57],"OH),":[58],"however,":[59],"DIW":[62],"are":[63,91],"tested":[64],"die":[67,81,88,106],"wafer":[69,83,108],"With":[72],"technology,":[78],"successful":[79],"bonding":[85],"with":[86],"current":[87],"assembly":[89],"tools":[90],"achieved.":[92],"The":[93],"alternative":[94],"ensures":[97],"high":[98],"yield":[99],"and":[100],"cost":[101],"ownership":[103],"integration.":[109]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}