{"id":"https://openalex.org/W3015860121","doi":"https://doi.org/10.1109/3dic48104.2019.9058841","title":"Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs","display_name":"Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3015860121","doi":"https://doi.org/10.1109/3dic48104.2019.9058841","mag":"3015860121"},"language":"en","primary_location":{"id":"doi:10.1109/3dic48104.2019.9058841","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058841","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103030734","display_name":"Yuki Miwa","orcid":"https://orcid.org/0000-0003-2389-955X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuki Miwa","raw_affiliation_strings":["Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100402789","display_name":"Sungho Lee","orcid":"https://orcid.org/0000-0002-8291-4644"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Sungho Lee","raw_affiliation_strings":["Graduate School of Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027836208","display_name":"Rui Liang","orcid":"https://orcid.org/0000-0002-5095-9637"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Rui Liang","raw_affiliation_strings":["Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009154212","display_name":"Kousei Kumahara","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kousei Kumahara","raw_affiliation_strings":["Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of BiomeDICal Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036200957","display_name":"Hisashi Kino","orcid":"https://orcid.org/0000-0001-9348-120X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hisashi Kino","raw_affiliation_strings":["Frontier Research Institute for Interdisciplinary Sciences, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Graduate School of Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["Graduate School of Engineering, Tohoku Univ., Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.1211,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.51325391,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.9091944694519043},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.8841365575790405},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8036205768585205},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5676150321960449},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5391630530357361},{"id":"https://openalex.org/keywords/daisy-chain","display_name":"Daisy chain","score":0.47753798961639404},{"id":"https://openalex.org/keywords/capillary-action","display_name":"Capillary action","score":0.46482613682746887},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4474027752876282},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.332247793674469},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2509685456752777},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.22987234592437744},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.08931130170822144}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.9091944694519043},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8841365575790405},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8036205768585205},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5676150321960449},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5391630530357361},{"id":"https://openalex.org/C59014099","wikidata":"https://www.wikidata.org/wiki/Q1157702","display_name":"Daisy chain","level":2,"score":0.47753798961639404},{"id":"https://openalex.org/C196806460","wikidata":"https://www.wikidata.org/wiki/Q188603","display_name":"Capillary action","level":2,"score":0.46482613682746887},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4474027752876282},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.332247793674469},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2509685456752777},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.22987234592437744},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.08931130170822144},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic48104.2019.9058841","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic48104.2019.9058841","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2063114735","https://openalex.org/W2063447041","https://openalex.org/W2151613126","https://openalex.org/W2585597896"],"related_works":["https://openalex.org/W2086209657","https://openalex.org/W1900362976","https://openalex.org/W2554154929","https://openalex.org/W1985392845","https://openalex.org/W2154910868","https://openalex.org/W2540193419","https://openalex.org/W2104414205","https://openalex.org/W2083050228","https://openalex.org/W2098336614","https://openalex.org/W1554127544"],"abstract_inverted_index":{"We":[0],"have":[1],"fabricated":[2],"microbump":[3],"daisy":[4,55],"chains":[5],"with":[6,57,64,73],"a":[7,34,81],"low-height":[8,70],"solder":[9,71],"thickness":[10],"of":[11,23,53,75],"2.5":[12],"\u03bcm":[13],"in":[14,27,89],"order":[15],"to":[16],"evaluate":[17],"flip-chip":[18],"bonding":[19],"capabilities.":[20],"Electrical":[21],"characteristics":[22],"the":[24,51,54,58,65,69,76],"bonded":[25],"microbumps":[26,72],"three-dimensionally":[28],"stacked":[29],"chips":[30],"were":[31],"compared":[32],"between":[33],"very":[35],"thin":[36,77],"non-conductive":[37],"film":[38],"(NCF)":[39],"and":[40],"capillary":[41],"underfill":[42],"(CUF).":[43],"The":[44],"resulting":[45],"I-":[46],"V":[47],"behaviors":[48],"showed":[49],"that":[50,63,68],"resistance":[52],"chain":[56],"NCF":[59,78],"was":[60],"lower":[61],"than":[62],"CUF,":[66],"inDICating":[67],"combination":[74],"can":[79],"be":[80],"promising":[82],"candidate":[83],"for":[84],"future":[85],"fine-pitch":[86],"inter-chip":[87],"connection":[88],"3DICs.":[90]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}