{"id":"https://openalex.org/W2735461643","doi":"https://doi.org/10.1109/3dic.2016.7970037","title":"Towards high density 3D interconnections","display_name":"Towards high density 3D interconnections","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2735461643","doi":"https://doi.org/10.1109/3dic.2016.7970037","mag":"2735461643"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2016.7970037","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2016.7970037","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025989520","display_name":"S. Ch\u00e9ramy","orcid":"https://orcid.org/0000-0002-1473-5572"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Cheramy","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078155706","display_name":"A. Jouve","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Jouve","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112967532","display_name":"L. Arnaud","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Arnaud","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112344520","display_name":"C. Fenouillet-B\u00e9ranger","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Fenouillet-Beranger","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045610872","display_name":"P. Batude","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"P. Batude","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019983362","display_name":"M. Vinet","orcid":"https://orcid.org/0000-0001-6757-295X"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"M. Vinet","raw_affiliation_strings":["CEA, LETI, MINATEC Campus, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA, LETI, MINATEC Campus, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049","https://openalex.org/I899635006"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"2","issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6677610874176025},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6526036262512207},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.6137627363204956},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5276034474372864},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.5023548603057861},{"id":"https://openalex.org/keywords/range","display_name":"Range (aeronautics)","score":0.4625626802444458},{"id":"https://openalex.org/keywords/photonics","display_name":"Photonics","score":0.44750815629959106},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.44011884927749634},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42734795808792114},{"id":"https://openalex.org/keywords/supply-chain","display_name":"Supply chain","score":0.4263862073421478},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.4230808913707733},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.38832056522369385},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.36773449182510376},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3491811156272888},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.31076157093048096},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2324385941028595},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.13798794150352478},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.13114050030708313}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6677610874176025},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6526036262512207},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.6137627363204956},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5276034474372864},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5023548603057861},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.4625626802444458},{"id":"https://openalex.org/C20788544","wikidata":"https://www.wikidata.org/wiki/Q467054","display_name":"Photonics","level":2,"score":0.44750815629959106},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.44011884927749634},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42734795808792114},{"id":"https://openalex.org/C108713360","wikidata":"https://www.wikidata.org/wiki/Q1824206","display_name":"Supply chain","level":2,"score":0.4263862073421478},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.4230808913707733},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.38832056522369385},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.36773449182510376},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3491811156272888},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.31076157093048096},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2324385941028595},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.13798794150352478},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.13114050030708313},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2016.7970037","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2016.7970037","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5400000214576721,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1661007454","https://openalex.org/W1990015089","https://openalex.org/W2059381751","https://openalex.org/W2081566550","https://openalex.org/W2098280469","https://openalex.org/W2106546601","https://openalex.org/W2166549182","https://openalex.org/W2289109849","https://openalex.org/W2290466486","https://openalex.org/W2511451423","https://openalex.org/W2517036333"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2786493094","https://openalex.org/W2063603127","https://openalex.org/W2888620174","https://openalex.org/W3001671786","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2144881807","https://openalex.org/W3093450488","https://openalex.org/W3163301441"],"abstract_inverted_index":{"System":[0],"integration":[1,27],"takes":[2],"benefit":[3],"from":[4],"3D":[5,54],"stacking":[6],"technologies":[7],"in":[8,107],"a":[9],"wide":[10],"range":[11],"of":[12,104,109],"applications":[13,22,34],"such":[14],"as":[15],"smart":[16],"imagers,":[17],"photonics,":[18],"stacked":[19],"memories,":[20],"mobile":[21],"and":[23,70,81,94,113],"high-performance":[24],"computing.":[25],"Several":[26],"schemes":[28,63],"are":[29,79,84],"considered":[30],"worldwide":[31],"to":[32,101],"address":[33],"specific":[35],"requirements:":[36],"performance,":[37],"cost,":[38,110],"form-factor,":[39],"thermal":[40],"management":[41],"or":[42,58],"even":[43],"supply":[44],"chain":[45],"availability.":[46],"This":[47],"paper":[48],"presents":[49],"two":[50],"3D-high":[51],"density":[52],"(with":[53],"interconnects":[55],"pitch":[56],"around":[57],"below":[59],"the":[60,72],"\u03bcm":[61],"range)":[62],"using":[64],"on":[65,71],"one":[66,74],"side":[67],"hybrid":[68],"bonding":[69],"other":[73],"monolithic":[75],"integration.":[76],"Both":[77],"integrations":[78,93],"described":[80],"current":[82],"status":[83],"given.":[85],"A":[86],"technology/application":[87],"roadmap":[88],"is":[89],"proposed":[90],"positioning":[91],"both":[92],"showing":[95],"that":[96],"they":[97],"offer":[98],"complementary":[99],"approaches":[100],"tackle":[102],"most":[103],"today":[105],"challenges":[106],"terms":[108],"area,":[111],"power":[112],"performance.":[114]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}