{"id":"https://openalex.org/W2735186336","doi":"https://doi.org/10.1109/3dic.2016.7970005","title":"Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC","display_name":"Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2735186336","doi":"https://doi.org/10.1109/3dic.2016.7970005","mag":"2735186336"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2016.7970005","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2016.7970005","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089550331","display_name":"Kumail Khurram","orcid":null},"institutions":[{"id":"https://openalex.org/I65181880","display_name":"Indian Institute of Technology Hyderabad","ror":"https://ror.org/01j4v3x97","country_code":"IN","type":"education","lineage":["https://openalex.org/I65181880"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Kumail Khurram","raw_affiliation_strings":["Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India","institution_ids":["https://openalex.org/I65181880"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112306119","display_name":"Asisa Kumar Panigrahi","orcid":null},"institutions":[{"id":"https://openalex.org/I65181880","display_name":"Indian Institute of Technology Hyderabad","ror":"https://ror.org/01j4v3x97","country_code":"IN","type":"education","lineage":["https://openalex.org/I65181880"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Asisa Kumar Panigrahi","raw_affiliation_strings":["Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India","institution_ids":["https://openalex.org/I65181880"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037787155","display_name":"Satish Bonam","orcid":"https://orcid.org/0000-0003-2789-6233"},"institutions":[{"id":"https://openalex.org/I65181880","display_name":"Indian Institute of Technology Hyderabad","ror":"https://ror.org/01j4v3x97","country_code":"IN","type":"education","lineage":["https://openalex.org/I65181880"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Satish Bonam","raw_affiliation_strings":["Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Indian Institute of Technology Hyderabad, Telangana, India","institution_ids":["https://openalex.org/I65181880"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060107034","display_name":"Om Krishan Singh","orcid":null},"institutions":[{"id":"https://openalex.org/I2799351866","display_name":"Government of India","ror":"https://ror.org/036h6g940","country_code":"IN","type":"government","lineage":["https://openalex.org/I2799351866"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Om Krishan Singh","raw_affiliation_strings":["Union Government, New Delhi, Delhi, IN"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Union Government, New Delhi, Delhi, IN","institution_ids":["https://openalex.org/I2799351866"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005811349","display_name":"Shiv Govind Singh","orcid":"https://orcid.org/0000-0001-7319-879X"},"institutions":[{"id":"https://openalex.org/I65181880","display_name":"Indian Institute of Technology Hyderabad","ror":"https://ror.org/01j4v3x97","country_code":"IN","type":"education","lineage":["https://openalex.org/I65181880"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Shiv Govind Singh","raw_affiliation_strings":["Indian Institute of Technology Hyderabad, Hyderabad, Telangana, IN"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Hyderabad, Hyderabad, Telangana, IN","institution_ids":["https://openalex.org/I65181880"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.751224935054779},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6777752637863159},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.6513258218765259},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.631801962852478},{"id":"https://openalex.org/keywords/boron-nitride","display_name":"Boron nitride","score":0.6294441223144531},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.5795516967773438},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.5506396889686584},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.4895406663417816},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.48372843861579895},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.48112836480140686},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4659605622291565},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.4587154686450958},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4357723295688629},{"id":"https://openalex.org/keywords/silicon-nitride","display_name":"Silicon nitride","score":0.41126397252082825},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3865221440792084},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.36569756269454956},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3197166323661804},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.254642516374588},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.17937606573104858},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17482507228851318},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12704849243164062}],"concepts":[{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.751224935054779},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6777752637863159},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6513258218765259},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.631801962852478},{"id":"https://openalex.org/C2780243435","wikidata":"https://www.wikidata.org/wiki/Q410193","display_name":"Boron nitride","level":2,"score":0.6294441223144531},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5795516967773438},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.5506396889686584},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.4895406663417816},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.48372843861579895},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.48112836480140686},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4659605622291565},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4587154686450958},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4357723295688629},{"id":"https://openalex.org/C2777431650","wikidata":"https://www.wikidata.org/wiki/Q413828","display_name":"Silicon nitride","level":3,"score":0.41126397252082825},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3865221440792084},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.36569756269454956},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3197166323661804},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.254642516374588},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.17937606573104858},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17482507228851318},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12704849243164062}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic.2016.7970005","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2016.7970005","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:raiith.iith.ac.in:2580","is_oa":false,"landing_page_url":"http://raiith.iith.ac.in/2580/","pdf_url":null,"source":{"id":"https://openalex.org/S4306400292","display_name":"Research Archive of Indian Institute of Technology Hyderabad (Indian Institute of Technology Hyderabad)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I65181880","host_organization_name":"Indian Institute of Technology Hyderabad","host_organization_lineage":["https://openalex.org/I65181880"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference or Workshop Item"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1970731240","https://openalex.org/W1985367418","https://openalex.org/W1993700253","https://openalex.org/W2001596658","https://openalex.org/W2027918523","https://openalex.org/W2073919591","https://openalex.org/W2146564548","https://openalex.org/W2158921969","https://openalex.org/W6643100068"],"related_works":["https://openalex.org/W2367275322","https://openalex.org/W3011940019","https://openalex.org/W2094693852","https://openalex.org/W2159337632","https://openalex.org/W2327591730","https://openalex.org/W2115443918","https://openalex.org/W2726952278","https://openalex.org/W1977927964","https://openalex.org/W2353179748","https://openalex.org/W2012956325"],"abstract_inverted_index":{"In":[0],"this":[1,60],"paper,":[2],"heat":[3,38,64],"transfer":[4],"in":[5,59],"3D":[6],"IC":[7],"system":[8],"is":[9,35],"investigated":[10],"using":[11],"practical":[12],"and":[13,21,49],"novel":[14],"materials":[15],"for":[16,37,62],"Inter":[17],"Layer":[18],"Dielectric":[19],"(ILD)":[20],"Thermal":[22],"Through":[23],"Silicon":[24],"Vias":[25],"(TTSV).":[26],"The":[27,46],"currently":[28],"used":[29],"SiO":[30],"<inf":[31],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[32],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</inf>":[33],"ILD":[34],"amiss":[36],"mitigation":[39],"due":[40],"to":[41],"its":[42],"poor":[43],"thermal":[44,48],"conductivity.":[45],"unique":[47],"electrical":[50],"properties":[51],"of":[52],"Hexagonal":[53],"Boron":[54],"Nitride":[55],"(h-BN)":[56],"are":[57],"explored":[58],"work":[61],"improved":[63],"mitigation.":[65]},"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}