{"id":"https://openalex.org/W2170673559","doi":"https://doi.org/10.1109/3dic.2015.7334615","title":"A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications","display_name":"A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications","publication_year":2015,"publication_date":"2015-08-01","ids":{"openalex":"https://openalex.org/W2170673559","doi":"https://doi.org/10.1109/3dic.2015.7334615","mag":"2170673559"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2015.7334615","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334615","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061228505","display_name":"Gamal Refai-Ahmed","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Gamal Refai-Ahmed","raw_affiliation_strings":["Xilinx Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048829149","display_name":"Ivor Barber","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ivor Barber","raw_affiliation_strings":["Xilinx Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051214648","display_name":"Anthony Torza","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anthony Torza","raw_affiliation_strings":["Xilinx Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006537087","display_name":"Brian Philofsky","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brian Philofsky","raw_affiliation_strings":["Xilinx Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5061228505"],"corresponding_institution_ids":["https://openalex.org/I32923980"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07826921,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"TS10.1.1","last_page":"TS10.1.4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9819999933242798,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9807000160217285,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dice","display_name":"Dice","score":0.7957408428192139},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7264127135276794},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.588413655757904},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.5825378894805908},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.5718172788619995},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4374639391899109},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.42597365379333496},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.39582639932632446},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.34278208017349243}],"concepts":[{"id":"https://openalex.org/C22029948","wikidata":"https://www.wikidata.org/wiki/Q45089","display_name":"Dice","level":2,"score":0.7957408428192139},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7264127135276794},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.588413655757904},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.5825378894805908},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.5718172788619995},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4374639391899109},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.42597365379333496},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.39582639932632446},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34278208017349243},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2015.7334615","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334615","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3104750253","https://openalex.org/W3021239166","https://openalex.org/W4366341510","https://openalex.org/W2390936256","https://openalex.org/W2483429559","https://openalex.org/W2016385589","https://openalex.org/W2009559548","https://openalex.org/W2906397153","https://openalex.org/W2385445039","https://openalex.org/W2038503502"],"abstract_inverted_index":{"Silicon":[0],"Interconnect":[1],"Technology":[2],"(SSIT)":[3],"enables":[4,48],"superior":[5,45],"feature":[6,20,26,46],"integration":[7,27],"beyond":[8],"what":[9],"is":[10],"possible":[11],"in":[12,104,128],"monolithic":[13],"technology":[14],"with":[15],"only":[16],"a":[17,41,66,71],"Moore's":[18],"Law":[19],"shrink":[21],"as":[22,24],"well":[23],"heterogeneous":[25,126],"of":[28,82,121],"disparate":[29],"dice":[30],"(e.g.":[31],"memories,":[32],"RF":[33],"DAC/ADCs,":[34],"optical":[35],"interfaces,":[36],"customer":[37],"ASICs":[38],"etc.).":[39],"In":[40],"Telecom":[42,108],"environment,":[43],"this":[44],"density":[47,56],"new":[49],"applications,":[50],"but":[51],"also":[52],"presents":[53],"higher":[54],"thermal":[55,75,99],"to":[57,74],"the":[58,94,119,129],"Thermal":[59,67],"Engineer.":[60],"To":[61],"properly":[62],"utilize":[63],"these":[64],"benefits,":[65],"Engineer":[68],"must":[69],"take":[70],"holistic":[72],"approach":[73],"architecture":[76],"that":[77],"simultaneously":[78],"addresses":[79],"system":[80,113],"goals":[81],"Cost,":[83],"Performance,":[84],"Weight,":[85],"Size,":[86],"Power":[87],"and":[88,106,112,115,125],"Performance.":[89],"This":[90],"paper":[91],"will":[92,117],"discuss":[93],"critical":[95],"parameters":[96],"which":[97],"impact":[98,120],"architecture,":[100],"followed":[101],"by":[102],"Challenges":[103],"Indoor":[105],"Outdoor":[107],"Systems":[109],"from":[110],"device":[111],"perspectives":[114],"finally":[116],"show":[118],"combining":[122],"network":[123],"utilization":[124],"load":[127],"user's":[130],"environment.":[131]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}