{"id":"https://openalex.org/W2150423452","doi":"https://doi.org/10.1109/3dic.2015.7334605","title":"Noise coupling modeling and analysis of through glass via(TGV)","display_name":"Noise coupling modeling and analysis of through glass via(TGV)","publication_year":2015,"publication_date":"2015-08-01","ids":{"openalex":"https://openalex.org/W2150423452","doi":"https://doi.org/10.1109/3dic.2015.7334605","mag":"2150423452"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2015.7334605","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334605","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034808111","display_name":"In-Su Hwang","orcid":"https://orcid.org/0000-0003-4080-2684"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Insu Hwang","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100384980","display_name":"Jihye Kim","orcid":"https://orcid.org/0000-0001-8546-854X"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jihye Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100696056","display_name":"Youngwoo Kim","orcid":"https://orcid.org/0000-0003-0096-2296"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngwoo Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074429007","display_name":"Jonghyun Cho","orcid":"https://orcid.org/0000-0003-3277-1072"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghyun Cho","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103543612","display_name":"Venky Sundaram","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Venky Sundaram","raw_affiliation_strings":["Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045655197","display_name":"Rao Tummala","orcid":"https://orcid.org/0000-0003-2284-7600"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rao Tummala","raw_affiliation_strings":["Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5034808111"],"corresponding_institution_ids":["https://openalex.org/I157485424"],"apc_list":null,"apc_paid":null,"fwci":0.5919,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.72589797,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"TS8.34.1","last_page":"TS8.34.5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7914522886276245},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.7520431280136108},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.7409761548042297},{"id":"https://openalex.org/keywords/frequency-domain","display_name":"Frequency domain","score":0.517328679561615},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4953674077987671},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.429801881313324},{"id":"https://openalex.org/keywords/time-domain","display_name":"Time domain","score":0.4285370111465454},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.426435649394989},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.4182104766368866},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3915213644504547},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.3336777091026306},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.31466516852378845},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2521602511405945},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22189867496490479},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08878979086875916}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7914522886276245},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.7520431280136108},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.7409761548042297},{"id":"https://openalex.org/C19118579","wikidata":"https://www.wikidata.org/wiki/Q786423","display_name":"Frequency domain","level":2,"score":0.517328679561615},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4953674077987671},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.429801881313324},{"id":"https://openalex.org/C103824480","wikidata":"https://www.wikidata.org/wiki/Q185889","display_name":"Time domain","level":2,"score":0.4285370111465454},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.426435649394989},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.4182104766368866},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3915213644504547},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.3336777091026306},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.31466516852378845},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2521602511405945},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22189867496490479},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08878979086875916},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2015.7334605","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334605","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1530384264","https://openalex.org/W1569297369","https://openalex.org/W2087092955","https://openalex.org/W2110024109","https://openalex.org/W2125309181","https://openalex.org/W2160428624","https://openalex.org/W2167539582"],"related_works":["https://openalex.org/W2158041725","https://openalex.org/W2782295999","https://openalex.org/W2162306796","https://openalex.org/W1970292246","https://openalex.org/W2016162169","https://openalex.org/W4247952185","https://openalex.org/W1895367623","https://openalex.org/W1642462315","https://openalex.org/W2015118744","https://openalex.org/W2005619368"],"abstract_inverted_index":{"In":[0,75],"glass":[1,7,27,34],"interposer":[2,35],"based":[3,45],"2.5D/3D":[4],"ICs,":[5],"through":[6],"via(TGV)":[8],"noise":[9,24,30,42,52,97,104],"coupling":[10,25,31,43,53,73,98,105],"could":[11],"critically":[12],"affect":[13],"overall":[14],"system's":[15],"performance.":[16],"Therefore":[17],"it":[18],"is":[19,36,58],"important":[20],"to":[21,89],"estimate":[22],"exact":[23],"in":[26,85],"interposers.":[28],"Thus":[29],"modeling":[32,56],"for":[33,55],"needed.":[37],"We":[38,95],"proposed":[39,67,109],"a":[40],"TGV-TGV":[41,51],"model":[44,81],"on":[46,115],"equivalent":[47],"circuit":[48],"model.":[49,74,102],"Our":[50],"structure":[54],"verification":[57],"composed":[59],"of":[60],"TGVs":[61],"and":[62,70,110,118],"channel":[63,71],"lines.":[64],"So":[65],"we":[66,78],"both":[68],"TGV":[69],"line":[72],"this":[76],"paper,":[77],"verified":[79],"our":[80,101],"using":[82],"3D-EM":[83],"solver":[84],"frequency":[86,116],"domain":[87,117],"up":[88],"20GHz":[90],"by":[91],"comparing":[92],"the":[93],"s-parameter.":[94],"analyzed":[96,114],"function":[99],"with":[100],"Also,":[103],"reduction":[106],"methods":[107],"are":[108,113],"their":[111],"effects":[112],"time":[119],"domain.":[120]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}