{"id":"https://openalex.org/W2099615692","doi":"https://doi.org/10.1109/3dic.2015.7334594","title":"On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs","display_name":"On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs","publication_year":2015,"publication_date":"2015-08-01","ids":{"openalex":"https://openalex.org/W2099615692","doi":"https://doi.org/10.1109/3dic.2015.7334594","mag":"2099615692"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2015.7334594","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334594","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071523958","display_name":"Hiroyuki Yotsuyanagi","orcid":"https://orcid.org/0000-0002-4223-3705"},"institutions":[{"id":"https://openalex.org/I922474255","display_name":"Tokushima University","ror":"https://ror.org/044vy1d05","country_code":"JP","type":"education","lineage":["https://openalex.org/I922474255"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hiroyuki Yotsuyanagi","raw_affiliation_strings":["Institutes of Technology and Science, Tokushima University, Tokushima, Japan"],"affiliations":[{"raw_affiliation_string":"Institutes of Technology and Science, Tokushima University, Tokushima, Japan","institution_ids":["https://openalex.org/I922474255"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110505473","display_name":"Akihiro Fujiwara","orcid":null},"institutions":[{"id":"https://openalex.org/I922474255","display_name":"Tokushima University","ror":"https://ror.org/044vy1d05","country_code":"JP","type":"education","lineage":["https://openalex.org/I922474255"]},{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akihiro Fujiwara","raw_affiliation_strings":["Institutes of Technology and Science, Tokushima University, Tokushima, Japan","Mitsubishi Electric Engineering Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Institutes of Technology and Science, Tokushima University, Tokushima, Japan","institution_ids":["https://openalex.org/I922474255"]},{"raw_affiliation_string":"Mitsubishi Electric Engineering Co., Ltd","institution_ids":["https://openalex.org/I4210133125"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052190532","display_name":"Masaki Hashizume","orcid":null},"institutions":[{"id":"https://openalex.org/I922474255","display_name":"Tokushima University","ror":"https://ror.org/044vy1d05","country_code":"JP","type":"education","lineage":["https://openalex.org/I922474255"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaki Hashizume","raw_affiliation_strings":["Institutes of Technology and Science, Tokushima University, Tokushima, Japan"],"affiliations":[{"raw_affiliation_string":"Institutes of Technology and Science, Tokushima University, Tokushima, Japan","institution_ids":["https://openalex.org/I922474255"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5071523958"],"corresponding_institution_ids":["https://openalex.org/I922474255"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07077809,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"TS8.24.1","last_page":"TS8.24.4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/crosstalk","display_name":"Crosstalk","score":0.738641619682312},{"id":"https://openalex.org/keywords/testability","display_name":"Testability","score":0.631314218044281},{"id":"https://openalex.org/keywords/resistive-touchscreen","display_name":"Resistive touchscreen","score":0.6156650185585022},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5628972053527832},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.48427432775497437},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.47199371457099915},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.41642627120018005},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3858611285686493},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3682006895542145},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33134472370147705},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.2748473882675171},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.261712908744812},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2476416826248169}],"concepts":[{"id":"https://openalex.org/C169822122","wikidata":"https://www.wikidata.org/wiki/Q230187","display_name":"Crosstalk","level":2,"score":0.738641619682312},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.631314218044281},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.6156650185585022},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5628972053527832},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.48427432775497437},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.47199371457099915},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.41642627120018005},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3858611285686493},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3682006895542145},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33134472370147705},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2748473882675171},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.261712908744812},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2476416826248169},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2015.7334594","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334594","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320309074","display_name":"Cadence Design Systems","ror":"https://ror.org/04w8xa018"},{"id":"https://openalex.org/F4320309545","display_name":"Synopsys","ror":"https://ror.org/013by2m91"},{"id":"https://openalex.org/F4320321416","display_name":"Agilent Technologies","ror":"https://ror.org/01xtpxr95"},{"id":"https://openalex.org/F4320322832","display_name":"University of Tokyo","ror":"https://ror.org/057zh3y96"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2023976101","https://openalex.org/W2055841712","https://openalex.org/W2070914725","https://openalex.org/W2121616189","https://openalex.org/W2148932348","https://openalex.org/W2165299571","https://openalex.org/W6656539271"],"related_works":["https://openalex.org/W2107525390","https://openalex.org/W2157191248","https://openalex.org/W2150046587","https://openalex.org/W2164493372","https://openalex.org/W2114980936","https://openalex.org/W4249526199","https://openalex.org/W1594445436","https://openalex.org/W2128920253","https://openalex.org/W2142405811","https://openalex.org/W2164349885"],"abstract_inverted_index":{"In":[0,21,69],"3D":[1],"IC":[2],"testing,":[3],"resistive":[4],"open":[5,99],"defects":[6,100],"in":[7,34,43,101],"TSVs":[8,35,42,74,87],"are":[9,75],"difficult":[10],"to":[11,88],"test":[12,28],"since":[13,47],"its":[14,61],"delay":[15,32],"size":[16],"is":[17,55],"usually":[18],"very":[19],"small.":[20],"this":[22],"paper,":[23],"we":[24],"propose":[25],"a":[26,44,48,66,102],"new":[27],"circuit":[29],"for":[30,85],"detecting":[31],"faults":[33],"considering":[36],"the":[37,52,70,90,96],"coupling":[38],"effect":[39],"between":[40],"adjacent":[41,62,86],"TSV":[45,54,103],"array":[46],"transition":[49],"signal":[50],"at":[51],"defective":[53],"more":[56],"affected":[57],"by":[58,104],"crosstalk":[59,91],"from":[60],"lines":[63],"compared":[64],"with":[65],"fault-free":[67],"TSV.":[68],"proposed":[71],"design-for-testability":[72],"circuit,":[73],"connected":[76],"into":[77],"two":[78],"rings":[79],"that":[80],"can":[81],"provide":[82],"opposite":[83],"transitions":[84],"increase":[89],"induced":[92],"delay.":[93],"We":[94],"estimated":[95],"detectability":[97],"of":[98],"simulation.":[105]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}