{"id":"https://openalex.org/W2101463882","doi":"https://doi.org/10.1109/3dic.2015.7334591","title":"Best engineering practice for thermal characterization of stacked dice FPGA devices","display_name":"Best engineering practice for thermal characterization of stacked dice FPGA devices","publication_year":2015,"publication_date":"2015-08-01","ids":{"openalex":"https://openalex.org/W2101463882","doi":"https://doi.org/10.1109/3dic.2015.7334591","mag":"2101463882"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2015.7334591","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334591","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015045839","display_name":"Arun Raghupathy","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Arun Raghupathy","raw_affiliation_strings":["Electronic Cooling Solutions Inc., Santa Clara, CA","Electronic Cooling Solutions Inc., Santa Clara, CA, 95051, USA"],"affiliations":[{"raw_affiliation_string":"Electronic Cooling Solutions Inc., Santa Clara, CA","institution_ids":[]},{"raw_affiliation_string":"Electronic Cooling Solutions Inc., Santa Clara, CA, 95051, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084183923","display_name":"Hoa Do","orcid":"https://orcid.org/0000-0001-5442-507X"},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hoa Do","raw_affiliation_strings":["Xilinx Inc., San Jose, CA","Xilinx Inc, San Jose, CA, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA","institution_ids":["https://openalex.org/I32923980"]},{"raw_affiliation_string":"Xilinx Inc, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006537087","display_name":"Brian Philofsky","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brian Philofsky","raw_affiliation_strings":["Xilinx Inc., San Jose, CA","Xilinx Inc, San Jose, CA, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA","institution_ids":["https://openalex.org/I32923980"]},{"raw_affiliation_string":"Xilinx Inc, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061228505","display_name":"Gamal Refai-Ahmed","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gamal Refai-Ahmed","raw_affiliation_strings":["Xilinx Inc., San Jose, CA","Xilinx Inc, San Jose, CA, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA","institution_ids":["https://openalex.org/I32923980"]},{"raw_affiliation_string":"Xilinx Inc, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I32923980"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5015045839"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.1973,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.58437174,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"20","issue":null,"first_page":"TS8.21.1","last_page":"TS8.21.8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7206985354423523},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5886850357055664},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5472493171691895},{"id":"https://openalex.org/keywords/dice","display_name":"Dice","score":0.5273008346557617},{"id":"https://openalex.org/keywords/resistor","display_name":"Resistor","score":0.5058972239494324},{"id":"https://openalex.org/keywords/delphi","display_name":"Delphi","score":0.48555585741996765},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.46322277188301086},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.44832414388656616},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.44740039110183716},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.4402025043964386},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43575379252433777},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.38832056522369385},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.37579798698425293},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3312745690345764},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3163061738014221},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2846134901046753},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1856827437877655},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.13373449444770813},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08409720659255981},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08210396766662598}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7206985354423523},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5886850357055664},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5472493171691895},{"id":"https://openalex.org/C22029948","wikidata":"https://www.wikidata.org/wiki/Q45089","display_name":"Dice","level":2,"score":0.5273008346557617},{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.5058972239494324},{"id":"https://openalex.org/C2779495148","wikidata":"https://www.wikidata.org/wiki/Q487378","display_name":"Delphi","level":2,"score":0.48555585741996765},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.46322277188301086},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.44832414388656616},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.44740039110183716},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4402025043964386},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43575379252433777},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.38832056522369385},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.37579798698425293},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3312745690345764},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3163061738014221},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2846134901046753},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1856827437877655},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.13373449444770813},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08409720659255981},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08210396766662598},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2015.7334591","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334591","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.4300000071525574}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1915557514","https://openalex.org/W1963984141","https://openalex.org/W1998873454","https://openalex.org/W2011375661","https://openalex.org/W2054021381","https://openalex.org/W2103245853","https://openalex.org/W2135370061","https://openalex.org/W2163960682"],"related_works":["https://openalex.org/W2367275322","https://openalex.org/W3011940019","https://openalex.org/W2094693852","https://openalex.org/W2159337632","https://openalex.org/W2327591730","https://openalex.org/W2786366621","https://openalex.org/W2115443918","https://openalex.org/W2726952278","https://openalex.org/W1977927964","https://openalex.org/W2353179748"],"abstract_inverted_index":{"This":[0,86,103],"paper":[1],"presents":[2],"a":[3,32,64,101],"couple":[4],"of":[5,14,31,117,123],"new":[6,37],"methodologies":[7],"regarding":[8],"package":[9],"characterization.":[10],"An":[11],"important":[12],"shortcoming":[13,44],"the":[15,28,61,94,97,108,112,124,129],"JEDEC":[16],"methodology":[17,38],"for":[18,27,47,76,93],"single-die":[19],"packages":[20,78],"is":[21,39,104],"that":[22],"it":[23],"does":[24],"not":[25],"account":[26],"real-world":[29],"scenario":[30],"package's":[33],"boundary":[34,70],"condition.":[35],"A":[36,115],"proposed":[40],"to":[41,54,67,128],"overcome":[42],"this":[43],"by":[45,106],"accounting":[46],"typical":[48],"PCB":[49],"conductivities":[50],"and":[51],"heatsink":[52],"attachments":[53],"packages.":[55],"The":[56],"second":[57],"methodology,":[58,87],"presented":[59],"in":[60,100],"paper,":[62],"shows":[63],"better":[65],"way":[66],"develop":[68],"DELPHI-based":[69,90],"condition":[71],"independent":[72],"compact":[73,125],"thermal":[74,126],"models":[75],"2.5D":[77],"with":[79],"multiple":[80,98],"dies":[81,99],"mounted":[82],"on":[83,89],"an":[84],"interposer.":[85],"based":[88],"techniques,":[91],"accounts":[92],"interaction":[95],"between":[96],"package.":[102],"done":[105],"modifying":[107],"resistors":[109],"generated":[110],"from":[111],"optimization":[113],"process.":[114],"number":[116],"verification":[118],"cases":[119],"show":[120],"good":[121],"fidelity":[122],"model":[127],"detailed":[130],"model.":[131]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}