{"id":"https://openalex.org/W2104308603","doi":"https://doi.org/10.1109/3dic.2015.7334579","title":"Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study","display_name":"Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study","publication_year":2015,"publication_date":"2015-08-01","ids":{"openalex":"https://openalex.org/W2104308603","doi":"https://doi.org/10.1109/3dic.2015.7334579","mag":"2104308603"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2015.7334579","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334579","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"M. Murugesan","raw_affiliation_strings":["Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113659962","display_name":"J. C. Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J.C. Bea","raw_affiliation_strings":["Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101642244","display_name":"Hiroyuki Hashimoto","orcid":"https://orcid.org/0000-0002-9458-8583"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"H. Hashimoto","raw_affiliation_strings":["Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027297551","display_name":"K.W. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K.W. Lee","raw_affiliation_strings":["Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Global INTegration Institute (GINTI), NICHE, Tohoku Univ., 6-6-10, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["Department of Bio-medical Engineering, Tohoku Univ., Sendai, Miyagi, Japan","Department of Bio-medical Engineering, Tohoku Univ., 6-6-01, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bio-medical Engineering, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bio-medical Engineering, Tohoku Univ., 6-6-01, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Bio-medical Engineering, Tohoku Univ., Sendai, Miyagi, Japan","Department of Bio-medical Engineering, Tohoku Univ., 6-6-01, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bio-medical Engineering, Tohoku Univ., Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bio-medical Engineering, Tohoku Univ., 6-6-01, Aramaki, Aoba-ku, Sendai, 980-8579, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5101440058"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07131224,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"61","issue":null,"first_page":"TS8.10.1","last_page":"TS8.10.5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8667436242103577},{"id":"https://openalex.org/keywords/raman-spectroscopy","display_name":"Raman spectroscopy","score":0.7790676355361938},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.7764918804168701},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6821489334106445},{"id":"https://openalex.org/keywords/diffraction","display_name":"Diffraction","score":0.6521849632263184},{"id":"https://openalex.org/keywords/polyimide","display_name":"Polyimide","score":0.5078240036964417},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5072264671325684},{"id":"https://openalex.org/keywords/modulus","display_name":"Modulus","score":0.49638134241104126},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4889620542526245},{"id":"https://openalex.org/keywords/vicinal","display_name":"Vicinal","score":0.4816693067550659},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4425506293773651},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.4166221022605896},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.28178876638412476},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.1620219349861145},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.1026742160320282}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8667436242103577},{"id":"https://openalex.org/C40003534","wikidata":"https://www.wikidata.org/wiki/Q862228","display_name":"Raman spectroscopy","level":2,"score":0.7790676355361938},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.7764918804168701},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6821489334106445},{"id":"https://openalex.org/C207114421","wikidata":"https://www.wikidata.org/wiki/Q133900","display_name":"Diffraction","level":2,"score":0.6521849632263184},{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.5078240036964417},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5072264671325684},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.49638134241104126},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4889620542526245},{"id":"https://openalex.org/C121349320","wikidata":"https://www.wikidata.org/wiki/Q285851","display_name":"Vicinal","level":2,"score":0.4816693067550659},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4425506293773651},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.4166221022605896},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.28178876638412476},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.1620219349861145},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1026742160320282},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2015.7334579","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2015.7334579","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1994042776","https://openalex.org/W2000459694","https://openalex.org/W2007482718","https://openalex.org/W2011389441","https://openalex.org/W2014002978","https://openalex.org/W2017387783","https://openalex.org/W2019035957","https://openalex.org/W2043965712","https://openalex.org/W2050041188","https://openalex.org/W2059983101","https://openalex.org/W2064676658","https://openalex.org/W2067933356","https://openalex.org/W2074966992","https://openalex.org/W2113418080","https://openalex.org/W2150620980","https://openalex.org/W2155707315","https://openalex.org/W2161242815","https://openalex.org/W2321076646","https://openalex.org/W4245507168","https://openalex.org/W6648928566"],"related_works":["https://openalex.org/W652365381","https://openalex.org/W2056309639","https://openalex.org/W2023220233","https://openalex.org/W2332230985","https://openalex.org/W1977806348","https://openalex.org/W4249519766","https://openalex.org/W2091648007","https://openalex.org/W2992570852","https://openalex.org/W4247828839","https://openalex.org/W2047841618"],"abstract_inverted_index":{"3D-LSI":[0],"chip":[1],"containing":[2],"through-silicon-via":[3],"(TSV,":[4],"diameters":[5],"ranging":[6],"from":[7],"5":[8],"\u03bcm":[9],"to":[10,82],"30":[11],"\u03bcm)":[12],"with":[13,78],"two":[14],"different":[15],"dielectric":[16,46],"liners":[17],"has":[18],"been":[19],"investigated":[20],"for":[21,76],"thermo-mechanical":[22],"stress":[23],"(TMS)":[24],"in":[25,54],"Si":[26,57,62],"via":[27],"micro-Raman":[28,36],"spectroscopy":[29],"and":[30,37],"micro-X-ray":[31,38],"diffraction":[32,39],"analysis.":[33],"Both":[34],"the":[35,43,52,55,61,71,83,87,94],"results":[40],"revealed":[41],"that":[42,70],"low-k":[44],"CVD-grown":[45],"polyimide":[47],"(PI)":[48],"liner":[49],"tremendously":[50],"reduces":[51],"TMS":[53,74],"vicinal":[56],"as":[58,60],"well":[59],"sandwiched":[63],"between":[64],"TSVs.":[65],"It":[66],"can":[67],"be":[68],"explained":[69],"observed":[72],"smaller":[73],"values":[75],"TSVs":[77],"PI":[79],"is":[80],"owing":[81],"partial":[84],"accommodation":[85],"of":[86],"expanded":[88],"Cu":[89],"during":[90],"thermal":[91],"cycling":[92],"by":[93],"low":[95],"modulus,":[96],"soft":[97],"PI.":[98]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}