{"id":"https://openalex.org/W1582160340","doi":"https://doi.org/10.1109/3dic.2014.7152177","title":"Metal coated polymer spheres for compliant fine pitch ball grid arrays","display_name":"Metal coated polymer spheres for compliant fine pitch ball grid arrays","publication_year":2014,"publication_date":"2014-12-01","ids":{"openalex":"https://openalex.org/W1582160340","doi":"https://doi.org/10.1109/3dic.2014.7152177","mag":"1582160340"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2014.7152177","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152177","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028645817","display_name":"Daniel Nilsen Wright","orcid":"https://orcid.org/0000-0002-7419-2186"},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":true,"raw_author_name":"Daniel Nilsen Wright","raw_affiliation_strings":["SINTEF, Oslo, Norway","SINTEF, Oslo, Norway#TAB#"],"affiliations":[{"raw_affiliation_string":"SINTEF, Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"SINTEF, Oslo, Norway#TAB#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111643313","display_name":"Maaike M. Visser Taklo","orcid":null},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"Maaike M. Visser Taklo","raw_affiliation_strings":["SINTEF, Oslo, Norway","SINTEF, Oslo, Norway#TAB#"],"affiliations":[{"raw_affiliation_string":"SINTEF, Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"SINTEF, Oslo, Norway#TAB#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015292503","display_name":"Astrid-Sofie B. Vard\u00f8y","orcid":null},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"Astrid-Sofie B. Vardoy","raw_affiliation_strings":["SINTEF, Oslo, Norway#TAB#"],"affiliations":[{"raw_affiliation_string":"SINTEF, Oslo, Norway#TAB#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077005623","display_name":"Helge Kristiansen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210132501","display_name":"Conpart (Norway)","ror":"https://ror.org/043qs7x90","country_code":"NO","type":"company","lineage":["https://openalex.org/I4210132501"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"Helge Kristiansen","raw_affiliation_strings":["Conpart AS, Skedsmo, Norway"],"affiliations":[{"raw_affiliation_string":"Conpart AS, Skedsmo, Norway","institution_ids":["https://openalex.org/I4210132501"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5028645817"],"corresponding_institution_ids":["https://openalex.org/I173888879"],"apc_list":null,"apc_paid":null,"fwci":0.2093,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.55765093,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9941999912261963,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.851437509059906},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8237879276275635},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.7244175672531128},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.6278362274169922},{"id":"https://openalex.org/keywords/coating","display_name":"Coating","score":0.5671576261520386},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5300447940826416},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.50058913230896},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.4557885229587555},{"id":"https://openalex.org/keywords/ball","display_name":"Ball (mathematics)","score":0.4388187825679779},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.43221527338027954},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4232538640499115},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.3960520029067993},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.38323479890823364},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.36768215894699097},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3605288863182068},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.23588326573371887},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.14866003394126892}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.851437509059906},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8237879276275635},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.7244175672531128},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.6278362274169922},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5671576261520386},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5300447940826416},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.50058913230896},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.4557885229587555},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.4388187825679779},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.43221527338027954},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4232538640499115},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.3960520029067993},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.38323479890823364},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.36768215894699097},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3605288863182068},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.23588326573371887},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.14866003394126892},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2014.7152177","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152177","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320300","display_name":"European Commission","ror":"https://ror.org/00k4n6c32"},{"id":"https://openalex.org/F4320338367","display_name":"FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1968351331","https://openalex.org/W2049741397","https://openalex.org/W2318873218"],"related_works":["https://openalex.org/W1951801788","https://openalex.org/W2050959455","https://openalex.org/W2167784957","https://openalex.org/W2155941634","https://openalex.org/W2079719989","https://openalex.org/W2380335578","https://openalex.org/W2367693714","https://openalex.org/W2134467738","https://openalex.org/W4295036922","https://openalex.org/W2365278150"],"abstract_inverted_index":{"The":[0,209],"further":[1,186],"development":[2],"of":[3,12,29,31,82,124,169,174,211,244,261],"heterogeneous":[4],"3D":[5],"integration":[6],"involving":[7],"electrical":[8],"connections":[9],"between":[10,148],"layers":[11],"various":[13],"materials":[14,34],"demand":[15],"compliant":[16,51,54,83],"fine":[17,39,63,76],"pitch":[18,40,77],"interconnects":[19,84],"to":[20,108,137,161,176,192,214,255],"allow":[21],"for":[22,73,206],"the":[23,32,128,134,149,152,165,170,189,220,251,264],"varying":[24],"expansion":[25],"as":[26,223],"a":[27,70,75,109,116,119,143,145,158,234,241,258],"function":[28],"temperature":[30],"different":[33],"involved.":[35],"However,":[36],"most":[37],"available":[38,53],"interconnects,":[41,55],"like":[42,56],"micro":[43],"bumps":[44],"and":[45,151,191],"copper":[46],"pillars,":[47],"are":[48,61],"not":[49,62],"particularly":[50],"whereas":[52],"plastic":[57],"core":[58],"solder":[59],"balls,":[60],"pitch.":[64],"In":[65],"this":[66],"work":[67],"we":[68],"present":[69],"novel":[71],"process":[72,190],"achieving":[74],"ball":[78],"grid":[79],"array":[80],"comprised":[81],"using":[85],"singular":[86],"30":[87],"\u03bcm":[88,121,163],"metal":[89],"coated":[90],"polymer":[91],"spheres":[92],"(MPS)":[93],"in":[94,197,203,219],"conjunction":[95],"with":[96,118,199,240],"nano-particle":[97],"silver":[98],"conductive":[99,126],"ink.":[100],"Results":[101],"show":[102],"that":[103,141,250],"when":[104],"an":[105,139,195],"MPS":[106,135,150,230,252],"attached":[107],"chip":[110,113,153],"is":[111,130,218],"flip":[112],"assembled":[114],"onto":[115,233],"substrate":[117,235],"1.3":[120],"thick":[122],"layer":[123],"wet":[125],"ink,":[127],"ink":[129,212,225,245],"drawn":[131],"up":[132,160,175],"along":[133,263],"surface":[136],"such":[138,194,216],"extent":[140,260],"it":[142],"forms":[144],"bonding":[146],"neck":[147],"surface.":[154],"It":[155,247],"also":[156],"created":[157],"coating":[159],"1.5":[162],"on":[164],"MPS.":[166,180],"Shear":[167],"testing":[168],"assembly":[171],"gave":[172],"values":[173],"0.67":[177],"grams":[178],"per":[179],"This":[181],"strength":[182],"can":[183,201,228],"be":[184],"increased":[185],"by":[187],"optimizing":[188],"utilize":[193],"interconnect":[196],"combination":[198],"underfill":[200],"result":[202],"sufficient":[204],"reliability":[205],"several":[207],"applications.":[208],"volume":[210],"required":[213],"form":[215],"bonds":[217],"same":[221],"range":[222],"industrial":[224],"jet":[226],"nozzles":[227],"deliver.":[229],"was":[231,248],"applied":[232],"which":[236],"had":[237,257],"been":[238],"jetted":[239,265],"regular":[242],"pattern":[243],"droplets.":[246],"found":[249],"were":[253],"observed":[254],"have":[256],"certain":[259],"self-alignment":[262],"pattern.":[266]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}