{"id":"https://openalex.org/W1571451702","doi":"https://doi.org/10.1109/3dic.2014.7152153","title":"Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV","display_name":"Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV","publication_year":2014,"publication_date":"2014-12-01","ids":{"openalex":"https://openalex.org/W1571451702","doi":"https://doi.org/10.1109/3dic.2014.7152153","mag":"1571451702"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2014.7152153","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152153","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027297551","display_name":"K.W. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"K.W. Lee","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042233529","display_name":"C. Nagai","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"C. Nagai","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Sendai, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Sendai, Japan","institution_ids":[]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060668586","display_name":"Ai Nakamura","orcid":"https://orcid.org/0000-0003-3147-8368"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"A. Nakamura","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Sendai, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Sendai, Japan","institution_ids":[]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113659962","display_name":"J. C. Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J.C. Bea","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Murugesan","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","Dept. of Biomedical Eng., Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Dept. of Biomedical Eng., Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University , Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5027297551"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.2093,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.55741333,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/diffusion-barrier","display_name":"Diffusion barrier","score":0.8270646333694458},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8132026195526123},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.7925227284431458},{"id":"https://openalex.org/keywords/barrier-layer","display_name":"Barrier layer","score":0.7655748128890991},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.6377442479133606},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.5611568093299866},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5143481492996216},{"id":"https://openalex.org/keywords/plating","display_name":"Plating (geology)","score":0.42840832471847534},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.42088782787323}],"concepts":[{"id":"https://openalex.org/C2778836790","wikidata":"https://www.wikidata.org/wiki/Q5275435","display_name":"Diffusion barrier","level":3,"score":0.8270646333694458},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8132026195526123},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7925227284431458},{"id":"https://openalex.org/C2779833192","wikidata":"https://www.wikidata.org/wiki/Q17015866","display_name":"Barrier layer","level":3,"score":0.7655748128890991},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6377442479133606},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.5611568093299866},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5143481492996216},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.42840832471847534},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.42088782787323},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2014.7152153","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152153","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2014721931","https://openalex.org/W2014754697","https://openalex.org/W2035947921","https://openalex.org/W2036625429","https://openalex.org/W2053709945","https://openalex.org/W2080451420","https://openalex.org/W2082578258","https://openalex.org/W2096991703","https://openalex.org/W2118681581","https://openalex.org/W2127622913","https://openalex.org/W2130095812"],"related_works":["https://openalex.org/W2465054275","https://openalex.org/W2076677140","https://openalex.org/W4377089197","https://openalex.org/W1992456528","https://openalex.org/W2012707444","https://openalex.org/W1982785824","https://openalex.org/W1989054289","https://openalex.org/W2613510885","https://openalex.org/W4391111357","https://openalex.org/W2086143050"],"abstract_inverted_index":{"Effects":[0],"of":[1,23,65],"electro-less":[2],"Ni":[3,25,57,67,107,115],"layer":[4,26,68,108,117],"as":[5,27],"barrier/seed":[6,28],"layers":[7,29],"were":[8,49,74],"evaluated":[9],"for":[10,30],"high":[11],"reliable":[12],"and":[13,42,84,89],"low":[14],"cost":[15],"Cu":[16,53,70,72,78,95],"TSVs.":[17],"To":[18,60],"electrically":[19],"characterize":[20,61],"the":[21,35,62,66,106],"effectiveness":[22],"a":[24,124],"TSV":[31,45,79],"application,":[32],"we":[33],"fabricated":[34],"trench":[36],"MOS":[37],"capacitor":[38],"with":[39],"5\u00b5m":[40],"dia.":[41],"50\u00b5m":[43],"depth":[44],"array.":[46],"Via":[47],"holes":[48],"successfully":[50],"filled":[51],"by":[52,55,80],"electro-plating":[54],"using":[56],"seed":[58],"layer.":[59,127],"blocking":[63,120],"property":[64],"to":[69,123],"diffusion,":[71],"atoms":[73,96],"intentionally":[75],"diffused":[76],"from":[77],"annealing":[81,111],"at":[82,112],"300\u00b0C":[83],"400\u00b0C.":[85,113],"X-ray":[86],"spectrometer":[87],"(EDX)":[88],"C-t":[90],"analysis":[91],"results":[92],"shows":[93],"that":[94],"not":[97],"diffuse":[98],"into":[99],"t":[100],"h":[101],"e":[102],"Si":[103],"substrate":[104],"via":[105],"even":[109],"after":[110],"The":[114],"barrier":[116,126],"has":[118],"good":[119],"properties":[121],"compared":[122],"PVD":[125]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}