{"id":"https://openalex.org/W1507808248","doi":"https://doi.org/10.1109/3dic.2014.7152151","title":"Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs","display_name":"Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs","publication_year":2014,"publication_date":"2014-12-01","ids":{"openalex":"https://openalex.org/W1507808248","doi":"https://doi.org/10.1109/3dic.2014.7152151","mag":"1507808248"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2014.7152151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103064998","display_name":"Jonghoon J. Kim","orcid":"https://orcid.org/0000-0001-7611-9989"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghoon J. Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020557079","display_name":"Bumhee Bae","orcid":"https://orcid.org/0000-0001-8460-4861"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Bumhee Bae","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014007913","display_name":"Sukjin Kim","orcid":"https://orcid.org/0000-0003-2232-2038"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sukjin Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014678435","display_name":"Sunkyu Kong","orcid":"https://orcid.org/0000-0002-2707-8807"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sunkyu Kong","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002881987","display_name":"Heegon Kim","orcid":"https://orcid.org/0000-0003-0728-1346"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Heegon Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036985968","display_name":"D. Jung","orcid":"https://orcid.org/0000-0001-6920-0332"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Daniel H. Jung","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2129,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.56432944,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"1","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/waveform","display_name":"Waveform","score":0.6448078155517578},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5636509656906128},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.5508702397346497},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5385305881500244},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5227692127227783},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.508192777633667},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.49273064732551575},{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.48115575313568115},{"id":"https://openalex.org/keywords/measure","display_name":"Measure (data warehouse)","score":0.44472160935401917},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3881201148033142},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38145336508750916},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35945022106170654},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3201027512550354},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3152419328689575},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.28884249925613403}],"concepts":[{"id":"https://openalex.org/C197424946","wikidata":"https://www.wikidata.org/wiki/Q1165717","display_name":"Waveform","level":3,"score":0.6448078155517578},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5636509656906128},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.5508702397346497},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5385305881500244},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5227692127227783},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.508192777633667},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.49273064732551575},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.48115575313568115},{"id":"https://openalex.org/C2780009758","wikidata":"https://www.wikidata.org/wiki/Q6804172","display_name":"Measure (data warehouse)","level":2,"score":0.44472160935401917},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3881201148033142},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38145336508750916},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35945022106170654},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3201027512550354},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3152419328689575},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.28884249925613403},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2014.7152151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2014.7152151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7599999904632568,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1544011726","https://openalex.org/W1976095173","https://openalex.org/W2321275605","https://openalex.org/W2535035849","https://openalex.org/W3082486335","https://openalex.org/W6632632826","https://openalex.org/W6644508458","https://openalex.org/W6782577384"],"related_works":["https://openalex.org/W1974895211","https://openalex.org/W2176409448","https://openalex.org/W2129841057","https://openalex.org/W3040712279","https://openalex.org/W2364769705","https://openalex.org/W4367555392","https://openalex.org/W2374664672","https://openalex.org/W2056136368","https://openalex.org/W2883092465","https://openalex.org/W2114441484"],"abstract_inverted_index":{"Simultaneous":[0],"switching":[1,11],"current":[2,82,131,139],"(SSC)":[3],"drawn":[4],"by":[5,117,123],"integrated":[6],"circuits":[7],"(ICs)":[8],"creates":[9],"simultaneous":[10],"noise":[12,27],"(SSN)":[13],"on":[14,55,184],"power":[15],"nets,":[16],"which":[17],"causes":[18],"a":[19,71,80,147,179],"number":[20],"of":[21,38,64,74,86,106,126,149,160,166,190],"SI/PI":[22],"problems,":[23],"such":[24],"as":[25],"reduced":[26],"margin":[28],"and":[29,40,88,112,134,153,168,170],"eye":[30],"opening":[31],"with":[32,57,128],"increased":[33],"SSN.":[34],"Analyzing":[35],"the":[36,99,103,107,119,124,129,137,142,158,161,176,191],"effects":[37],"SSC":[39,100,125],"SSN":[41],"is":[42,63,95,182],"especially":[43],"important":[44],"for":[45,48,70,97,187],"ICs":[46],"targeted":[47],"mobile":[49],"applications":[50],"whose":[51],"operating":[52,59],"frequency":[53,152],"keeps":[54],"increasing":[56],"decreasing":[58],"voltage.":[60],"Therefore,":[61],"it":[62,172],"utmost":[65],"importance":[66],"to":[67],"measure":[68,175],"SSCs":[69,114],"thorough":[72],"analysis":[73],"high-speed":[75],"systems.":[76],"In":[77],"this":[78],"paper,":[79],"magnetically-coupled":[81],"probing":[83,132,163,193],"structure":[84,164],"consisting":[85,165],"TSVs":[87,167],"RDLs,":[89],"namely":[90],"TSV-based":[91],"Current":[92],"Probe":[93],"(TCP),":[94],"proposed":[96,130,162,192],"measuring":[98],"resulting":[101],"from":[102],"logical":[104],"activity":[105],"I/O":[108],"buffers":[109],"in":[110,151],"2.5D":[111],"3D-ICs.":[113],"are":[115],"found":[116],"capturing":[118],"magnetic":[120],"flux":[121],"induced":[122],"interest":[127],"structure,":[133],"then":[135],"reconstructing":[136],"original":[138],"waveform":[140],"using":[141],"transfer":[143],"impedance":[144],"profile.":[145],"Through":[146],"series":[148],"simulation":[150],"time":[154],"domains,":[155],"we":[156],"verified":[157],"performance":[159],"RDLs":[169],"proved":[171],"can":[173],"effectively":[174],"SSC.":[177],"Lastly,":[178],"test":[180],"vehicle":[181],"fabricated":[183],"package":[185],"level":[186],"experimental":[188],"verification":[189],"structure.":[194]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}