{"id":"https://openalex.org/W2001479393","doi":"https://doi.org/10.1109/3dic.2013.6702394","title":"Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration","display_name":"Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2001479393","doi":"https://doi.org/10.1109/3dic.2013.6702394","mag":"2001479393"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702394","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702394","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111020074","display_name":"S. Joblot","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"S. Joblot","raw_affiliation_strings":["STMicroelectronics, Crolles, France","STMicroelectron., Crolles, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"STMicroelectron., Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109958272","display_name":"A. Farcy","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Farcy","raw_affiliation_strings":["STMicroelectronics, Crolles, France","STMicroelectron., Crolles, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"STMicroelectron., Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5106121069","display_name":"N. Hotellier","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"N. Hotellier","raw_affiliation_strings":["STMicroelectronics, Crolles, France","STMicroelectron., Crolles, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"STMicroelectron., Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078155706","display_name":"A. Jouve","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Jouve","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022942527","display_name":"F. de Cr\u00e9cy","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"F. de Crecy","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030228914","display_name":"Arnaud Garnier","orcid":null},"institutions":[{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Garnier","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000321246","display_name":"Maxime Argoud","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"M. Argoud","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022570429","display_name":"C. Ferrandon","orcid":null},"institutions":[{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Ferrandon","raw_affiliation_strings":["Commissariat a l'energie atomique et aux energies alternatives Laboratoire d'electronique et de technologies de l'information, Grenoble, Auvergne-Rh\u00c3\u00b4ne-Alpes, FR","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Commissariat a l'energie atomique et aux energies alternatives Laboratoire d'electronique et de technologies de l'information, Grenoble, Auvergne-Rh\u00c3\u00b4ne-Alpes, FR","institution_ids":["https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111942024","display_name":"Jean-Philippe Colonna","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"J. P. Colonna","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109960018","display_name":"R. Franiatte","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"R. Franiatte","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036469839","display_name":"C. Laviron","orcid":null},"institutions":[{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Laviron","raw_affiliation_strings":["CEA-LETI, MINATEC, Grenoble, France","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"CEA-LETI, MINATEC, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025989520","display_name":"S. Ch\u00e9ramy","orcid":"https://orcid.org/0000-0002-1473-5572"},"institutions":[{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Cheramy","raw_affiliation_strings":["Commissariat a l'energie atomique et aux energies alternatives Laboratoire d'electronique et de technologies de l'information, Grenoble, Auvergne-Rh\u00c3\u00b4ne-Alpes, FR","MINATEC, CEA-LETI, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"Commissariat a l'energie atomique et aux energies alternatives Laboratoire d'electronique et de technologies de l'information, Grenoble, Auvergne-Rh\u00c3\u00b4ne-Alpes, FR","institution_ids":["https://openalex.org/I2738703131"]},{"raw_affiliation_string":"MINATEC, CEA-LETI, Grenoble, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I899635006","https://openalex.org/I106785703","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5111020074"],"corresponding_institution_ids":["https://openalex.org/I4210104693"],"apc_list":null,"apc_paid":null,"fwci":0.9458,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.77662967,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8589435815811157},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.731472373008728},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7235935926437378},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.6173222661018372},{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.57461017370224},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.5095437169075012},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5082347393035889},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.4886782467365265},{"id":"https://openalex.org/keywords/wafer-backgrinding","display_name":"Wafer backgrinding","score":0.4462604522705078},{"id":"https://openalex.org/keywords/epoxy","display_name":"Epoxy","score":0.42175740003585815},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3704535961151123},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.33240777254104614},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.209102600812912},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.1505875289440155},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1313551664352417},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.12549972534179688},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.1010945737361908},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.08624893426895142}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8589435815811157},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.731472373008728},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7235935926437378},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.6173222661018372},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.57461017370224},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.5095437169075012},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5082347393035889},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4886782467365265},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.4462604522705078},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.42175740003585815},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3704535961151123},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.33240777254104614},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.209102600812912},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.1505875289440155},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1313551664352417},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.12549972534179688},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1010945737361908},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08624893426895142}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702394","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702394","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1978379671","https://openalex.org/W2003540073","https://openalex.org/W2017474423","https://openalex.org/W2017915771","https://openalex.org/W2026787801","https://openalex.org/W2039457235","https://openalex.org/W2058032318","https://openalex.org/W2063893206","https://openalex.org/W2063984454","https://openalex.org/W2067251610","https://openalex.org/W2076508254","https://openalex.org/W2101166204","https://openalex.org/W2130156466","https://openalex.org/W2162135055"],"related_works":["https://openalex.org/W2026710642","https://openalex.org/W1606557396","https://openalex.org/W2896557720","https://openalex.org/W1992573569","https://openalex.org/W2011182927","https://openalex.org/W1990828594","https://openalex.org/W2310189477","https://openalex.org/W2019002696","https://openalex.org/W1595610629","https://openalex.org/W2513455916"],"abstract_inverted_index":{"Wafer":[0],"level":[1,67],"molding":[2,26,77],"is":[3],"an":[4],"important":[5],"process":[6,21],"step":[7],"in":[8,18],"the":[9],"chip":[10],"on":[11,88],"wafer":[12,41,66,89],"approach":[13],"and":[14,42,47,51,62,74,85,93],"seems":[15],"currently":[16],"required":[17],"stacking":[19],"first":[20],"flow.":[22],"Thermo-mechanical":[23],"properties":[24,70],"of":[25,68,71,80],"material":[27,69],"has":[28],"to":[29,32,44,59],"be":[30],"controlled":[31],"limit":[33],"stress":[34,63],"induce":[35],"by":[36],"CTE":[37],"mismatch":[38],"with":[39,95],"silicon":[40],"also":[43],"assure":[45],"planarization":[46],"protection":[48],"functions.":[49],"2D":[50],"3D":[52],"finite":[53],"element":[54],"simulations":[55],"have":[56],"been":[57],"performed":[58],"evaluate":[60],"strain":[61],"impact":[64],"at":[65],"silicone":[72],"based":[73,76],"epoxy":[75],"compounds.":[78],"Impacts":[79],"Si":[81],"interposer":[82],"thickness,":[83],"design":[84],"chips":[86],"arrangement":[87],"warpage":[90],"are":[91],"presented":[92],"compared":[94],"experimental":[96],"results.":[97]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}